| Company | Booth |
|---|---|
| AGC Inc. | P5912 |
| AI Technology, Inc. | L0808 |
| Nippon Electric Glass Co., Ltd. | X0031 |
| Resonac International(Taiwan) Co., Ltd | M1148 |
| SCHOTT AG | R7220 |
| Sumitomo Bakelite Co., Ltd. | T9512 |
Which exhibitors at SEMICON Taiwan 2026 are related to Package Substrate Core and Build-Up Materials?
6 exhibitors are related to Package Substrate Core and Build-Up Materials, including AGC Inc., AI Technology, Inc., Nippon Electric Glass Co., Ltd., Resonac International(Taiwan) Co., Ltd, SCHOTT AG. The full list with booth numbers is on this page.
How do I find the Package Substrate Core and Build-Up Materials booths?
The list on this page includes each exhibitor's booth number. You can also ask Askpo directly, e.g. "I am looking for Package Substrate Core and Build-Up Materials suppliers", and it returns the relevant exhibitors with booths and evidence.
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