| Company | Booth |
|---|---|
| AI Technology, Inc. | L0808 |
| EC ADVANCE PCB TECHNOLOGY CO., LTD | I2904 |
| 台灣格雷蒙股份有限公司 Gredmann Taiwan Ltd. | S8058 |
| LG化學 LG Chem | S7430 |
| NIPPON SHOKUBAI Co., Ltd. | S7836 |
| 住友電木株式会社 Sumitomo Bakelite Co., Ltd. | T9512 |
| 美商耀德系統股份有限公司 Yield Engineering Systems | N1276 |
Which exhibitors at SEMICON Taiwan 2026 are related to Package Substrate Core and Build-Up Materials?
7 exhibitors are related to Package Substrate Core and Build-Up Materials, including AI Technology, Inc., EC ADVANCE PCB TECHNOLOGY CO., LTD, Gredmann Taiwan Ltd., LG Chem, NIPPON SHOKUBAI Co., Ltd.. The full list with booth numbers is on this page.
Where can I see the booth numbers of Package Substrate Core and Build-Up Materials exhibitors?
The list on this page includes each exhibitor's booth number. You can also ask Askpo directly, e.g. "I am looking for Package Substrate Core and Build-Up Materials suppliers", and it returns the relevant exhibitors with booths and evidence.
- Package Substrates and Laminate Materials12 exhibitors
- Semiconductor Packaging Materials29 exhibitors
- Silicon, SiC and Sapphire Wafers and Substrates19 exhibitors
- Semiconductor Process Chemicals and Materials22 exhibitors
- Temporary Bonding and De-Bonding Adhesives9 exhibitors
- Wafer- and Package-Level Test32 exhibitors
- Die Attach Compounds17 exhibitors
- Packaging MaterialsTopic group