Omni Matcher · SEMICON Taiwan 2026 · Exhibitor List

Gredmann Taiwan Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth S8058

Booth S8058Country TW112 product topics
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BoothS8058
CountryTW
Websitewww.gredmann.com
Exhibitor profile

Company profile

Gredmann Taiwan Ltd. is part of Gredmann Group, which was established in July 1978 and is headquartered in Taipei, Taiwan, with business covering optoelectronic semiconductors, electronic engineering materials, industrial alloys, and inorganic chemicals. The group lists operations including Gredmann Taiwan, Gredmann USA, Gredmann Hong Kong, Gredmann Shanghai, Gredmann Shenzhen, Gredmann Beijing, Gredmann Guangzhou, Gredmann Korea with a PU foam factory, and a Taoyuan indium factory. Gredmann organizes its business into Technology Materials, New Materials, Energy, Metal and Chemical, and Equipment divisions. The Technology Materials group includes passive-components, research-materials, magnetic-materials, power-electronics, optical-materials, semiconductor-materials, flat-panel-display-materials, and liquid-cooling functions. The New Materials group covers optoelectronic materials, touch-panel materials, and IC components, while the Energy/Power group includes solar and semiconductor materials, battery materials, mobile-phone materials, substrate materials, and 3C-related materials. The Metal Chemical Materials group includes advanced-metal, metal/alloy, electro-ceramic, plastics-and-rubber-additive, and heavy-electric-and-fluorine functions, while the Equipment group includes semiconductor equipment, AI robotics, and high-heat materials. Gredmann states that its products are used in optoelectronic communications, automotive lenses, laser projection, infrared lenses, and AR applications. Its English corporate page describes imports and triangular trade in materials for optoelectronics, semiconductors, electronics, electrical engineering, and solar applications, as well as metal, alloy, and inorganic materials. The same page lists global sites in Taiwan, Hong Kong, Beijing, Shanghai, Shenzhen, and other group entities, and identifies factories for fine chemicals, foam-related production, PCB-related production, and indium and gallium materials.

Exhibitor profile

Exhibits

For OLED manufacturing, Gredmann supplies materials and equipment for Array, evaporation, and module stages, including polyimide liquid as a glass-substrate replacement, FMM and CMM, metal masks and mask-tension welding equipment, transparent and high-temperature PI film, and Li, LiF, Mg, Ag, and Al cathode-deposition materials. The OLED offering also includes precision-metal thick and thin sheet processing and patterned evaporation masks used to transfer organic and metal materials onto glass substrates during evaporation. Its represented technology-material portfolio includes 2D semiconductor materials, 3M industrial adhesives and tapes, ACI metal and alloy sputtering materials, UV lamps, metal-alkyl catalysts, silicon nitride for quartz-crucible coating, copper for MIM and diamond tools, AMOLED panels, special alloys and tungsten-carbide blades, and metal-mesh touch displays. The same portfolio includes LED components, superconducting wire and magnets, Cu-clad Al bar, relays and thin-film capacitors, compound-semiconductor wafers, optical, blue, and electronic glass, Ga-YAG phosphor, solar-module manufacturing equipment, MCMB anode material, EMC lead frames, stainless-steel 3D-printing powder, and AR or super-hard coatings for glass. Gredmann also lists cleaners, wet etchers and strippers, OLED organic materials, polyimide for flexible displays and touch panels, automation for AR/VR assembly, camera modules and dispensing, fine metal and open masks, LiFePO4 cathode material, copper foil, graphene films and foam, solar-cell Ag/Al paste, PU foam sheets, research reagents, LED chips, and argon recovery and recycling systems. Additional represented products include SiC power ICs for EVs, PV inverters and power supplies, SiO material, AR-coated solar glass, mask-tension welding equipment, hydraulic robots and components, AMOLED photoresists, battery inks and compounds, EVA solar encapsulation film, metals, alloys and single crystals, evaporation and sputtering materials, carbon-fiber insulation boards, etching paste, OLED photomask materials, polycarbonate sheets, and ferrite cores. The catalog further lists graphene for thermal pads and batteries, semiconductor and optical Si wafers, FPC lithium-ceramic batteries, Fe-Si and Fe-Si-Al magnetic materials, natural-graphite anode material, ink-jet printing, quartz-glass production and refinement, high-purity III-V metals, vacuum evaporation sources, AMOLED driver and touch ICs, connectors and contactors, conductive paste, anti-dripping agents, graphite for solar PV, diamond tools, solar junction boxes, SOI wafers, NiFe and CoFe magnetic materials, plasma-spray and brazing materials, III-V substrates, semiconductor silicon wafers, high-purity metals, bonding wires, and Al-laminated film. Gredmann describes itself as a professional antimony-trioxide producer supplying the global flame-retardant market, with products including Sb2O3, antimony-trioxide masterbatch, zinc borate, brominated polystyrene, CPE, magnesium oxides and hydroxides, CHP, PTFE anti-dripping agents, lubricants, neodymium oxide, and activated-alumina balls. Its Sb2O3 grades include GredmannGM-F for plastics, rubber, paint and paper; GredmannGM-FLT for light-colored ceramics, pigments, paint and paper; GredmannGM-E for EMC epoxy or PCB applications; and GredmannGM-CA as a catalyst grade for PET resin, with standard 25 kg bags and 40 bags, or 1000 kg, per pallet. Antimony-trioxide masterbatch grades are GM-01 in LDPE at 90/10, GM-02 in PP at 80/20, GM-03 in PS at 80/20, GM-04 in SAN at 80/20, GM-05 in PBT at 70/30, GM-06 in PA66 at 80/20, GM-07 in EVA at 90/10, and GM-08 in PA6 at 70/30. Zinc borate is presented as a multifunctional non-halogen flame-retardant and smoke-suppressant additive, while BPS brominated polystyrene is described for nylon, PBT, PET, PC and their alloys with more than 90% mechanical-property retention stated in the product description. CPE-WK3136 is a high-flow, low-residual-crystallinity CPE for flame-retardant ABS and impact modification of PVC, PC, PE and PP, while MH-10 magnesium hydroxide and Magchen50 magnesium oxide are listed for magnesium compounds, ceramics, chemicals, rubber, plastics, purification, odor removal, and adsorption applications. The coated PTFE anti-dripping agent is specified for PC, PA, PPO, PBT, ABS, HIPS and PP and is described as meeting UL94-V0 flame-retardancy requirements; activated-alumina offerings include TBCSORBE-GS101 through GS104, air-separation grades GS-201 through GS-206, and hydrogen-peroxide grades GS-301 and GS-302. Gredmann's optical-material business supplies materials for mobile-phone, camera, projector and automotive imaging, including high-purity precious metals, AR/IR and optical-communication evaporation oxides and sputtering targets, coating-equipment spares, optical glass, polishing materials, diamond tools, lenses, filters, blue glass, and solar PECVD consumables. SiO2 evaporation material is specified with a transmission range of 0.15 micrometers to 8 micrometers, while SiO2 rings are listed for optical coating and semiconductor equipment including TEL, LAM, and AMAT ring applications; Ta2O5 and Ti3O5 are also supplied as high-index coating materials, and MS-EC100 is a vacuum-deposition material for water- and oil-repellent films. Optical-coating sputtering targets include Al, Al-Ti, Al-Si, Cr, Cr-Si, Cu-Al, ITO, Nb, Ni-Cr, Ni-Cu, Ni-V, Si, SiO2, Ta, Ti, and ZnS-SiO2, while crystal sensors include 5 MHz and 6 MHz types and models GM-3952 and GM-8010. Filament IB and EB series are used for electron guns and ion sources in vacuum and optical coating and are stated to have an average service life of about 40 to 60 hours; the portfolio also includes coating crucibles and graphite heaters for Leybold equipment. Low-softening-point optical glass is specified below 600 degrees C for precision molding, lens blanks range from 0.3 g to 2400 g and 5 mm to 300 mm in diameter, and blue glass is described for CCD or CMOS sensors with infrared cutoff above 700 nm. Polishing products include cerium-oxide powder, cerium-, zirconia-, and silica-based slurries, polishing pads, and customizable diamond tools; Gredmann also supplies 5M to 21M mobile-phone lenses, zoom lenses, solar PECVD graphite boats and related consumables, and connector or liquid-cooling solutions for data centers, supercomputing centers, electric vehicles, power supplies, and renewable-energy systems. The research-materials function supplies high-purity materials and special reagents for academic research and advanced development, including elemental metals, alloys and compounds in powder, foil, wire, rod, plate and bulk forms, targets and substrates, single crystals, high-temperature insulating materials, vacuum consumables, analytical materials, special ceramics, chemical precursors, spin-coating liquids, isotopes, and 2D semiconductor powders and crystals. Listed materials include special alloys such as Al/Ga, Cu/Be, Ga/In, Fe/Ni, Ni/Cr and Pt/Ir, compound materials such as AlSb, BiSe, LaB6, LiF, SmCo5, ZnSe and ZrC, precious metals in wire, slug, rod or powder form, and nano powders including carbides, nitrides, oxides, carbon nanotubes and graphene. Evaporation and sputtering targets cover pure elements from Al to Zr, alloy targets such as Cu/In/Ga/Se and Fe/Pt, and ceramic targets including AZO, GZO, ITO, IZO, IGZO, Li3PO4, LiMn2O4, YBCO and YSZ; substrate offerings include metal single crystals, III-V crystals, oxide crystals, glass substrates, and flexible polymer films. Vacuum and MBE supplies include boats, crucibles, baskets, quartz-crystal sensors, high-temperature W, Ta, Mo, BN, PBN and PG parts, ultra-high-purity Al, As, Bi, In, Ga, Mg, P, Se, Sb, Te, Zn and related compounds, and PG or PBN crucibles. Other research products include precious-metal and alloy catalysts, Ag, Al, Au, Carbon and Pt conductive pastes and tapes, thermocouple wires, AlN, BN, B4C, Mica, Macor, Mullite, Sapphire, SiC, Si3N4 and Sialon ceramics, Graphene, h-BN, Phosphorene, FeSe, MoS2 and WSe2 2D materials, UV/DUV/HUV lamps, and thin-film wafers such as 3C-SiC, GaN on Sapphire, GOI, SOI and SOS. The special-chemical range includes MOCVD precursors, spin-coating materials, and isotope materials. For semiconductor, IC-substrate, PCB and CCL processing, Gredmann supplies wet-process equipment such as plating, electroless copper, desmear, ENIG, VCP, DES, coater and IJP systems, dry-process equipment including ovens, lamination, sputtering and CCL cutting, and inspection equipment including AOI, AVI and non-contact 3D surface microscopy. Related materials include copper foil, CCL, FCCL, CCL dummy panels, marking and solder-mask inks, nickel-free ENIG and SAP or m-SAP chemicals, lamination cushioning and steel plates, drills and routers; CCL pressing materials include SUS630 mirror plates, Hardox450 cover plates, and resin additives for Low Dk/Df, copper adhesion and CTE adjustment. Photomask blanks are offered in soda-lime glass or quartz from 4 inches to nearly 1000 mm with customizable Cr thickness, resist thickness and optical density, while photomasks are offered in glass or quartz with equipment supporting up to 1400 mm by 1500 mm and a drawing area up to 1350 mm by 1450 mm. FPC materials include conductive adhesive, EMI film and pure adhesive for FPC, rigid-flex boards, camera modules, display modules, antennas and 5G high-frequency applications, with stated features including reliability, step-height adaptability, conductivity and adhesion. The PMIC portfolio includes SIMO architectures intended to reduce BOM and inductor requirements, a stated PCB-area reduction of about 10 to 20%, high-voltage and low-voltage multi-output applications, and a WLCSP package of 1.68 by 1.68 for compact products, as well as watch and smartphone display-power applications. Heat-toughened resin is specified at about Dk 2.5 and Df 0.002 to 0.0035, Td5% at 400 degrees C, unchanged molecular weight after 500 hours at 85 degrees C and 85% RH, and 200% to 300% elongation; IR Pass and IR Cut materials are listed for iris recognition, FOD, noise reduction, automotive, LiDAR, TOF and heat-ray absorption, while black ink is specified at L value 17 and 60-degree Gloss 0.2%. The flat-panel-display function covers TFT, color-filter, touch-panel and module industries, with equipment for 100 mm by 100 mm and 200 mm by 200 mm laboratory lines and G2.5 to G6 production lines. Used-equipment offerings include CVD, PVD, coater, stepper, exposure, develop, etch and stripper systems for TFT Array; ELA, ion implantation, activation and hydrogenation for LTPS; PI, rubbing and ODF for TFT Cell; color-filter coating, exposure, develop and in-line sputtering; touch-panel photo and sputter systems; and solar-cell texture, diffusion, printing, isolation and implantation equipment. Turn-key services include used-equipment sales, recoverable disassembly, international-standard packing and transport, installation and adjustment, China used-equipment CCIC procedures, process-technology transfer, and spare-parts sales. New equipment includes high-resolution IJP for coating and printing on 2.5D glass and flexible substrates, contact-type Array Test electrical inspection, and a Blade Type Edge Coating machine that can apply 100 micrometers of reinforcement adhesive and is described with pull strength of at least 15 N. Photolithography-line equipment is specified at TFT accuracy of 1.5 to 5 micrometers, CF accuracy of 7 micrometers and TP accuracy of 10 micrometers, while multi-sputter equipment for TOL uses 4- to 7-inch substrates, 6 to 13 chambers and about 50 seconds per sheet tack time. Solar equipment includes single- and multicrystal growth furnaces, acid texturing, diffusion furnaces, PECVD with 3 to 4 tubes or 4 to 8 plasma sources and capacity of 1500 to 2400 pcs/hr, screen printers, firing furnaces, and a CIGS turn-key line described with average module efficiency above 15.3% and yield above 94%. Gredmann is the Greater China sales agent for VACUUMSCHMELZE (VAC) magnetic materials, whose product areas cover hard magnets, soft magnetic alloys, and cores or components for industrial, communications, automotive, wind-power, rail, medical, power-supply and sensing applications. VAC amorphous VITROVAC 6025Z cores are listed for magnetic amplifiers, spike-suppression chokes and saturable inductors, while VITROPERM 500Z nanocrystalline cores are offered for similar magnetic-amplifier uses with smaller-size potential. VITROPERM 250 and 500F common-mode cores are specified with initial permeability of 30,000 to 80,000 and saturation flux density of 1.2 T, with stated benefits including fewer turns, lower stray capacitance, low core loss, high insertion loss and smaller size. Closed-loop current sensors using a cobalt-based amorphous soft-magnetic probe are specified for 0.5 A to 1000 A and are described with low offset current, low temperature dependence, low hysteresis and compact size. VITROPERM 500F is also used for high-frequency switching power-transformer cores and is described as containing 73.5% iron, while VAC current transformers for electronic meters use amorphous or nanocrystalline cores and can detect a DC component. VAC Duracon 17A cobalt-iron-nickel alloy is listed for connector contacts such as SIM cards, automotive electronics and battery contacts, while VITROBRAZE alloy foil is supplied as a brazing material for heat sinks and heat exchangers. Gredmann's solar-semiconductor materials platform covers upstream, midstream and downstream production, from crystal-growth and wafer-slicing materials through solar-cell materials to module materials. Upstream items include quartz crucibles, Si3N4 crucible coating, molybdenum wire, wafer-slicing wire, PEG/DEG/PAG/PG slicing liquids, graphite for ingot-growth furnaces, SiC abrasive, and related consumables for crystalline-silicon ingot and wafer production. Midstream cell materials include solar wafers, Ag/Al paste, graphite boats, ceramic parts, thin-film-cell targets, and POCl3 with stated relative density 1.68, melting point 1.25 degrees C, boiling point 107.2 degrees C, and purity above 7N (99.9999999%) for diffusion processing. Downstream module materials include solar cells, EVA encapsulation film, backsheet, ultra-white patterned glass, tinned ribbon, aluminum frames, junction boxes, sealant, and ceramic rods or rings used with graphite boats. The graphite grades are identified by application: G330 for thermal-field heaters, G347 for crucible bottom and side plates and PECVD graphite boats, and G458 for graphite crucibles. In power electronics, Gredmann states that it is the Taiwan exclusive agent for 鉑科新材料股份有限公司 metal-powder-core products and expanded to European agency rights in 2016, serving Taiwan, mainland China, Hong Kong and Europe; the supplier's integrated process covers Fe-Si powder development, production, insulation and core forming for power conversion applications. NPS Fe-Si-Al cores are offered at permeabilities of 26, 60, 75, 90, 125, 160 and 173ui for PFC, resonant inductors, switching power supplies, AC/DC filters and output chokes, with lower core loss than traditional iron-powder cores and stated DC-bias capability. NPF Fe-Si6.5 cores are offered at 26, 60, 75, 90 and 125ui for PFC, EMI filters, switching-regulator inductors, line-noise filters and boost inductors, while PPI Fe-Si cores at 40 and 60ui target similar applications. NPH Fe-Si cores are specified at 26, 60, 90 and 125ui for high-power and high-frequency uses including solar inverters, EV chargers, variable-frequency air conditioning, rail transport and UPS, while PHD block cores and special-shaped Fe-Si cores are offered for configurable high-power designs and customer-specific energy-storage, leakage and loss requirements. The newer NPH-H/L Fe-Si series uses 26, 60, 90 and 125ui grades for server and industrial power, while EQ Fe-Si cores use a larger cross-section and closed magnetic path for compact high-current DC/DC modules and server-power output chokes. Gredmann's touch-material business supplies copper film and etched metal mesh for touch panels, with low-resistance metal-mesh capacitive touch solutions spanning 3.5 to 86 inches and transparent EMI-control films described for military and medical displays under specification 461. The portfolio also includes PET ITO, PC ITO and HC COP materials for light-guide and retardation-film uses, transparent heaters, smart windows, electronic paper, OPV and EMI shielding, plus gold and palladium films for glucose and biosensor test strips and laser or photolithography equipment for circuit processing. Touch-panel integration is offered for military, medical, gaming, industrial-computer, aerospace, kiosk, POS and digital-signage markets with customized resistive and capacitive panels, LCD full lamination, 4-, 5- and 8-wire resistive variants, metal-mesh or ITO capacitive designs, and Ultra Chip control ICs for multi-touch and touch-key applications. The materials range also includes hard-coated PET cover materials and PPG TESLIN label material qualified to BS5609 for IMDG marine use, with the stated test including three months of exposure between seawater tides. Conductive-film OC series include ITO, gold or silver-based transparent conductive polyester and custom sputtered layers; OCA is stated at more than 90% transmittance with 50 to 200 micrometer thickness options; metal mesh is offered in a 500 by 600 standard size or custom formats; and capacitive touch panels support customized 10-point touch with 30/30 micrometer line width and spacing, while LCD full lamination is used to strengthen product structure and drop-test resistance.

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