At a glance
| Booth | T9512 |
| Country | JP |
| Website | www.sumibe.co.jp |
Company profile
Sumitomo Bakelite Co., Ltd. provides epoxy resin molding compounds for semiconductor device encapsulation, coating resins for semiconductor wafers, die bonding pastes for semiconductor packages, and core, prepreg, and build-up materials for semiconductor package substrates.
Capabilities and products
- epoxy resin molding compounds for semiconductor device encapsulation
- coating resins for semiconductor wafers
- die bonding pastes for semiconductor packages
- core materials for semiconductor package substrates
- prepreg materials for semiconductor package substrates
- build-up materials for semiconductor package substrates