At a glance
| Booth | T9512 |
| Country | JP |
| Website | www.sumibe.co.jp |
Company profile
Sumitomo Bakelite Co., Ltd. positions its IT Materials Division as a materials-solutions provider for the future of electronics and mobility, with support extending from upstream to downstream in the semiconductor manufacturing supply chain. The division maintains factories and laboratories in major markets around the world so it can develop original products for regional needs and respond quickly to customer requests. The Sumitomo Bakelite Group operates Open Labs in Japan, Asia, Europe and the United States where customers can conduct actual molding operations as well as structural and process studies. These Open Labs are intended to support customers from development through evaluation, linking Sumitomo Bakelite's materials technologies with customer applications and processes. Its development model includes collaboration with equipment manufacturers, raw-material and component manufacturers, universities and consortia to accelerate work responding to the evolution of semiconductor packaging. The company also describes back-end development support for advanced semiconductors and support for mobility and new applications such as electronic components and industrial uses. Recent product development includes a next-generation 3D power module with ultra-compact size and high power density, high-Tg epoxy molding compounds for next-generation SiC power modules, and a trial launch of liquid encapsulant for advanced packages.
Exhibits
The semiconductor-material lineup includes epoxy molding compounds for semiconductor encapsulation, Semiconductor Wafer Coating Resins, die-bonding paste, and semiconductor package substrate materials such as Core Material, Prepreg Material and SR Alternative Materials. For wafer pre-process protection, SUMIRESIN EXCEL™ CRC photosensitive materials provide high insulation and chemical resistance for semiconductor reliability, and SUMIRESIN COAT “CRC” is mainly composed of positive photosensitive materials that do not require solvents. For dicing, SUMILITE™ FSL is a film designed to prevent chips from scattering, with antistatic properties suited to wafers that have fine patterns. For package-substrate creation, SUMILITE LαZ™ is a low-expansion, low-dimensional-change and high-stiffness material intended to contribute to smaller and thinner packages and miniaturized smartphone components. For die bonding, SUMIRESIN EXCEL™ CRM is a paste for multiple package types, used to bond chips and support thermal diffusion. For encapsulation, SUMIKON™ EME is an epoxy encapsulant for semiconductors that supports different applications and package forms while responding to changes in molding processes. For delivery to surface-mount processes, Cover Tape transports semiconductor packages and electronic components and is described as having excellent antistatic properties. The product portfolio covers semiconductor package manufacturing and is backed by development and evaluation support across materials, applications and customer processes. Use-case areas include electric powertrains, autonomous driving, AI and advanced semiconductors, and telecommunications and IoT. Sumitomo Bakelite also provides a flexible optical-circuit film made with its original polymer material and proprietary manufacturing method, designed for low optical-propagation loss and low crosstalk. The flexible optical-circuit film can be processed by Sumitomo Bakelite to meet individual customer requirements before delivery.
Capabilities and products
- Epoxy molding compounds for semiconductor encapsulation
- Development of high-Tg epoxy molding compounds for SiC power modules
- Development of liquid encapsulants for advanced packaging
- Photosensitive resins for wafer protection
- Die-bonding paste for thermal diffusion
- Core materials for semiconductor package substrates
- Prepreg materials for semiconductor package substrates
- SR alternative materials for semiconductor package substrates
- Antistatic protective films for wafer dicing
- Antistatic cover tape for electronic component transport
- Evaluation of package molding, structures and processes
- Custom processing of low-loss flexible optical circuit films