At a glance
| Booth | L0808 |
| Country | US |
| Website | www.aitechnology.com |
Company profile
Build-Up Film (BUF) Adhesive Pre-Preg for 3-D Semiconductor and Chiplet Applications Wafer Processing Adhesives and Solutions Temporary Bonding Adhesive Solutions with Clean Release De-Bonding: Backgrinding and 3D Wafer Processing Wafer Processing Adhesive on Disposable Carrier for Multiplying Wafer Processing Throughput Wafer Processing for High Topography Bumped Wafers: Conforming, Stress-Free Temporary Bonding Adhesive Backgrinding Wax Adhesive Solutions for SiC, Sapphire, GaN, and GaAs Wafers Laser De-Bonding, High Tg, Temporary Bonding Adhesive Solutions Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier Backgrinding and Dicing Tapes, and Solutions Backgrinding Wax Adhesive Solutions for SiC, Sapphire, GaN, and GaAs Wafers Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier Cavity Electronic Packaging Lid-Seal Solutions Instant Melt-Bonding Tabbing Solution High Compressibility, High Temperature Applicable, High Thermal Conduction Fire-Retardant Thermal Interface Pads for EV Battery Assembly Other Thermal, Electrical and Mechanical Interface Material Solutions for EV Automotive Applications Material Solutions for the Brightest LED and Longest Use Life AI Technology, Inc. is Proud to Announce our Strategic Acquisition of Ormet Circuits Inc. Product: COOL SILVER PAD Product: COOL-BOND PSA-3NC Thermal Adhesive Tape AIT engineering, sales and product support: AI Technology has more than 29 years experience in designing and manufacturing various forms of high performance “Stress-free” flexible adhesive films and pastes and materials for microelectronic packaging and thermal interface materials for thermal management applications. Our newest research has yielded higher performance and lower cost, solderable flexible circuit substrate materials to replace polyimide-based organic copper-clad laminates in high frequency, RFID, and with low dielectric constant loss and low moisture absorption in replacing PTFE substrate material in microwave circuits. Our technologies and products include solvent-free dies and substrate attach pastes and films, compressible gap-filling phase change thermal interface materials of thermal pads, thermal gels, thermal greases, polymer based Solder-Sub® flexible conductive adhesives for solder-replacement in fine-pitch interconnections, near-hermetic lid sealant for ceramic and metal covers and optical glass lids for opto-electronic sensors and devices, EMI Shielding gasket/adhesive/caulk materials, double-sided UV-release wafer grinding tapes and high temperature-static free dicing tapes.
Capabilities and products
- Build-Up Film (BUF) adhesive pre-preg for 3-D semiconductor and chiplet applications
- Solder-Sub flexible conductive adhesives
- backgrinding and dicing tapes
- backgrinding wax adhesive for SiC, sapphire, GaN and GaAs wafers
- cavity electronic packaging lid-seal solutions
- laser de-bonding high Tg temporary bonding adhesive
- stress-free temporary bonding adhesive for high topography bumped wafers
- temporary bonding adhesive for 3D wafer processing
- temporary bonding adhesive with clean release de-bonding for backgrinding
- wafer processing adhesive on disposable carrier