At a glance
| Booth | L0808 |
| Country | US |
| Website | www.aitechnology.com |
Company profile
AI Technology, Inc. (AIT), founded in 1981 and manufacturing since 1985, provides advanced electronic-packaging adhesives and material solutions from a 16-acre manufacturing and R&D campus in Princeton Junction, New Jersey. AIT expanded operations with a 46,000 sq. ft. clean-room facility and R&D center in Princeton in 2021 and added a second company-owned 18-acre Princeton campus in 2022. AIT manufactures to ISO 9001:2015 standards and has maintained this accreditation since 1999. AIT pioneered molecularly flexible epoxy adhesives for die and substrate attach in the 1980s and developed compliant, non-silicone adhesive films and pastes for large bonding areas to manage interfacial stress and improve long-term semiconductor-device reliability. The company has built a broad line of film and paste adhesives and expanded into semiconductor and electronic-packaging adhesives, underfills, encapsulants, coating solutions and thermal-interface materials. AIT's flexible-circuit research includes solderable flexible circuit substrate materials intended to replace polyimide-based copper-clad laminates in high-frequency and RFID applications and to replace PTFE substrate material in microwave circuits with low dielectric loss and low moisture absorption. Its technology portfolio includes solvent-free die- and substrate-attach pastes and films, compressible phase-change thermal pads, thermal gels and greases, polymer-based Solder-Sub® conductive adhesives for solder replacement, near-hermetic lid sealants, EMI-shielding gaskets, adhesives and caulks, UV-release wafer-grinding tapes and high-temperature static-free dicing tapes. Milestones include production of EMI/RFI shielding caulks, gaskets, adhesives and conductive coatings for extreme environments from 1985, pioneering non-silicone flexible stress-free epoxy and film technology from 1985, and the first self-supporting die-attach film adhesive for stacked-chip applications from 1990. Other milestones include Cool-Grease CGR7016/CGR7018 for RIE and high-temperature wafer processing from 2000, SOLAR-THRU™ PVDF front-sheet films and thermally conductive back-sheet technologies from 2011, and temporary wafer-processing waxes and specialty films for ambient-to-350°C applications from 2015. AIT introduced FLUOROSEAL® and CIRCUITSEAL® IPC-certified 830C conformal coatings for corrosion prevention in 2016, developed nano-conductive coatings for component-level EMI protection in 2020, and established AITCOATINGS in 2022 for patent-pending PVDF-based corrosion-protection coatings. In 2023 AIT introduced wafer-level temporary-bonding and packaging solutions including UV ablation, UV-activated release, peel release, heat-release TBDB, BUF film adhesives, fine-pitch underfills and wafer-protection film adhesives, and in 2024 it acquired Ormet Circuits Inc. to add TLPS technologies for high-density interconnect and high-temperature advanced electronic packaging. AIT serves worldwide customers in semiconductor and die-component-substrate packaging, circuit-board conformal and corrosion-protection coatings, and device-level EMI/RFI shielding, and its portfolio includes products certified to Mil-Std and NASA outgassing standards. The company reports more than 40 U.S. patents in microelectronics materials and a product-development team of 5+ Ph.D.-level materials scientists and chemists. AIT maintains local product-support staff in Hong Kong, Taiwan and Shenzhen and long-standing partnerships across Europe and Asia, supporting collaborations involving electronic adhesives, thermal-interface materials, EMI-shielding materials, flex-circuit substrates, semiconductors, and wafer-processing tapes and materials.
Exhibits
AIT supplies Build-Up Film (BUF) adhesive prepreg for 3-D semiconductor and chiplet applications, along with wafer-processing adhesives and temporary-bonding solutions for backgrinding and 3D wafer processing with clean-release de-bonding. Wafer-processing options include adhesive on disposable carriers for higher processing throughput, conforming stress-free temporary-bonding adhesive for high-topography bumped wafers, wax adhesives for SiC, sapphire, GaN and GaAs wafers, and high-Tg temporary-bonding adhesive for laser de-bonding. The wafer line also includes backgrinding and dicing tapes, high-temperature dicing and grinding tapes, UV- and heat-releasing dicing and grinding tapes, and heat-sliding and solvent-separation spin-coating liquid wax and film adhesive. Thermal and interface offerings include thermal greases and gels, patented compressible phase-change pads, thermal pressure-sensitive adhesives, COOL SILVER PAD, COOL-BOND PSA-3NC thermal adhesive tape, and high-compressibility, high-temperature, high-thermal-conduction fire-retardant interface pads for EV battery assembly. AIT also supplies thermal, electrical and mechanical interface materials for EV automotive applications, material solutions for LED brightness and service life, insulated-metal thermal substrate and prepreg for multilayer MCPWB, and insulated flexible-copper substrate and prepreg for multilayer ultrafine-line circuits. Electronic-packaging applications cover die attach, substrate and component attach, heatsink and heatpipe attach, gap-filling thermal interfaces, flexible-circuit substrates and interposers, EMI-shielding sheets and gaskets, cavity lid sealing, and instant melt-bonding tabbing. Product families include low-CTE or highly flexible moisture-resistant die-attach films and pastes, SOLAR-IMB™ thermally conductive insulated-metal back sheet, SOLAR-THRU™ transparent encapsulation front sheet, SOLAR-TAB™ low-temperature tabbing interconnection, substrate and component attach films and pastes, flexible-circuit substrate and interposer copper prepreg, U.S.-made high-temperature or UV-releasing dicing and grinding tapes, MCPCB substrates, and COOL-GREASE®, COOL-GEL®, COOL-BOND® and COOL-SILVER™ thermal-interface products. Lid-sealing products include adhesive preforms and pastes plus solderable glass and ceramic lids. AIT's die-attach films are offered for die-attach applications with 10 micron BLT and stress absorption, including Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT) for chip-scale packaging, stacked-chip packaging, through-silicon-via filling and underfill. For small dies below 1 cm, rapid-curing paste products ME7635-RC and ME8630-RC cure at 150-250°C in seconds, maintain more than 300 psi bond strength at 250°C, and are engineered for low moisture absorption and high-temperature stability; MC7888 and MC8880 are paste options for 300°C continuous use. For dies larger than 1 cm, ME7655-RC and ME8650-RC rapid-curing pastes cure at 150-250°C in seconds, maintain more than 300 psi bond strength at 150°C, and are engineered for low moisture absorption and high-temperature stability. For stacked-chip packaging with dies below 1 cm, ESP7670-WL and ESP8680-WL film adhesives tack at 80-150°C in seconds with 4-8 psi pressure, can rapidly cure without pressure at selected temperatures, and maintain more than 300 psi bond strength at 250°C; CXP7888 and CXP8880 support 300°C continuous use. For stacked-chip packages with dies larger than 1 cm, ESP7450-WL and ESP8450-WL tack at 125-150°C in seconds with 4-8 psi pressure, cure without pressure at selected temperatures, and maintain more than 300 psi bond strength at 150°C. AIT can combine UVR 250 UV-releasing dicing tape with ESP7660 or CXP7860 rapid-curing in-line Tack-and-Cure die-attach film, while its DDAF uses fast melt-flow molecular structure for low-temperature, low-pressure tacking followed by pressure-free post-curing. Specialty die-attach options include screen-printable LESP7670-WL and LESP8680-WL, which tack at 80-150°C with 4-8 psi and can use an alternative 250°C in-line tack-and-cure process; ultra-high thermally conductive pastes ME8456-DA and ME8650-RCT for military electronics; and 300°C continuous-use MC7888, MC8880, CXP7888 and CXP8880 for high-temperature electronics. Flip-chip direct-contact attach film and liquid underfill options for stacked-chip packaging and through-silicon-via filling include CM7880 and CXP7880-UF, with interpenetrating-network adhesive chemistry engineered for high-temperature stability, low CTE and moisture resistance. AIT DAF products support stacked-chip packaging with bond lines from 10 micron and applications targeting 8-10 microns or less, using engineered melt flow, stress management, thermal stability and moisture control. Controlled-thickness DAF from 10 micron can melt-flow around 80°C and remain ambient-storable for one year before or after dicing; AIT also offers electrically conductive DAF at 20 micron and electrically insulating but thermally conductive DAF at 20 micron. DAF can melt-flow and bond at 125-175°C with about 5 psi pressure and continue to full cure without pressure, while the fixed die position supports precise multi-chip-module and system-in-package assembly. Common production features include Tg of 175°C and beyond for wire bonding up to 250°C, RoHS and REACH compliance, widths for 450 mm and beyond, thicknesses from 10 micron, optional pre-lamination onto dicing tape with standard, UV or thermal release, and U.S. clean-room manufacturing capacity of more than 10 million square ft per year. DAF model families include ESP7660-HK-DAF, ESP7666-HK-DAF, ESP8660-HK-DAF and ESP8450-DAF, with listed features such as pressure-free curing or post-curing, MIL-STD-883F 5011.4 compliance, moisture resistance, thermal performance, stress management and support for large devices. Flow-Over-Wire DAF includes ESP7660-FOW and ESP7666-FOW for wafer-level pre-lamination around 70-90°C, wafer-level packaging up to 450 mm, melt-flow bonding around 90-150°C, and high-Tg moisture-barrier and stress-absorption behavior that allows the adhesive to flow over wire-bonded sections of stacked chips. AIT produces DDAF in wafer sizes up to 450 mm with dicing tape in reel-to-reel format and has manufactured its own U.S. wafer-dicing tapes since 2005, including controlled-peel, UV-release and heat-release products and tapes able to withstand exposure up to 250°C. DDAF tape compatibility is designed so the tape bonds to DAF but releases without delaminating DAF from diced chips, leaves the DAF free of residue, and can blend into the DAF during curing to reduce contamination risk. Dicing-tape models include DT-UV1200-SE4 and DT-UV3200-C1 with UV and/or heat release, DT-CR1000-SE3 with controlled peel strength over time, and DT-CR1200-R5 with stable peel strength, brief exposure resistance up to 250°C and an anti-static version. Substrate-attach offerings include dry epoxy film adhesives, tacky pressure-sensitive epoxy films, thermally conductive insulating films and pastes, electrically conductive films and pastes, and molecularly flexible stress-free bonding. AIT provides rotary die-cutting for high volume, laser die-cutting for special shapes and sizes, programmable machine die-cutting for precision parts, and steel-rule die cutting for thick parts. Featured substrate-attach models include electrically conductive ESP8450-WL, RTC8750 and TC8750 and electrically non-conductive TK7758, ESP7455, RTK7556 and TP7155, with options for instant melt-tack or placement tack, low-moisture performance, high-temperature exposure and large-area bonding. TC8750 meets MIL-STD-883 5011.4 and passes NASA outgassing requirements, while ESP7455 is specified for short-term exposure above 300°C and RTK7556 for wire bonding above 250°C. AIT thermal adhesives are available as compressible or curing pressure-sensitive tapes and films, dry thermal-epoxy tapes, tacky thermally conductive epoxy films, instant melt-bonding thermally conductive films, one-component heat-curing epoxies and two-component ambient-curing epoxies. Pressure-sensitive thermal tapes can provide more than 100 psi instant bonding, while curing versions can in-situ cure during use to beyond 1000 psi and retain molecular flexibility for a low-stress interface. Thermal-paste models include ME7155, ME7156, ME7159, ME7638-RC and ME7658-RC, while electrically and thermally conductive paste models include EG8050, ME8456-00, ME8456-LV GS002 and ME 8650-RC. Thermally conductive and electrically insulating film products include COOL-BOND® CP7138, COOL-BOND® CB7208-A, ESP7455, RTK7555 and RTK7553, while electrically and thermally conductive film products include ESP8450-WL and RTC8750. COOL-BOND PSA-3NC and COOL-BOND PSA-4TC pressure-sensitive thermal tapes are used for industrial computers, LED displays, large-area thermal bonding and difficult thermal-management applications, including bonding GPUs and memory modules to heatsinks or heat spreaders. SNAP-LID® uses pre-applied adhesive preforms on plastic, ceramic or metal lids for in-line instant tacking and bonding with thermoplastic or epoxy-based adhesives, with AIT providing either pre-application on customer parts or complete lid solutions. COOL-LID® combines pre-applied thermal-interface material and lid-seal adhesive, including COOL-PAD™ for devices generating more than 100 watts within a square inch, with lid options in copper, aluminum and ceramics and plastic caps where thermal performance is not critical. The B-staged COOL-LID® adhesive and interface pad are dry to the touch and ambient-storable for 12 months, tack to a substrate at 150°C within seconds with nominal pressure of 10 psi, and fully cure without pressure at 150°C in less than 5 minutes. Dispensable lid-seal products include insulating MC7883 and electrically conductive MC8880 pastes, both 100% solids that cure in-line at 175-200°C in seconds and are designed for continuous operating temperatures beyond 300°C. MC7883 is specified below 20 ppm/°C CTE and below 0.5% saturated moisture absorption, while MC8880 is specified below 25 ppm/°C CTE and below 0.5% saturated moisture absorption; both list Tg of 240°C and support commercial, military and specialty high-temperature sensor and electronic-device applications. Lid solutions also include solderable ceramic, glass and LCP lids, pre-applied adhesive preforms, and EMI-shielding covers, lids and caps without soldering. Pre-applied optical and component lid-seal adhesives are offered for metal, ceramic, optical glass and LCP lids, with instant in-line tacking and bonding and stated performance through fine and gross leak tests and 85%RH/85°C aging without fogging or bond-strength change. Featured lid-seal models include ESP7675-HF for smaller ceramic or plastic lids, ESP8680-HF for metal lids with EMI shielding, TP7150 for larger lids and devices below 160°C, and solderless conductive pre-application products CB8130 and CB8253-E for EMI shielding. CB8130 is listed for EMI shielding with moisture resistance, reworkability and instant melt bonding above 150°C without pressure, while CB8253-E uses pressure-sensitive bonding with optional in-situ curing above 150°C without pressure. AIT evaluates thermal-interface effectiveness through measured temperature rise and interface thermal resistance because bulk thermal-conductivity values alone do not predict coupling efficiency; its comparison method uses an Intel CPU, forced-air heatsink and an embedded thermocouple at the heatsink junction.
Capabilities and products
- 3D/Chiplet build-up-film adhesive prepreg
- wafer temporary-bond and clean-release debond adhesive
- stress-free temporary bonding adhesive for high-topography wafers
- laser-debond high-Tg temporary bonding adhesive
- wafer backgrinding and dicing tapes
- die-attach films and pastes
- substrate/component attach films and pastes
- phase-change thermal pads/gels/greases
- thermally conductive tapes and film adhesives
- Solder-Sub® solder-replacement conductive adhesive
- near-hermetic lid sealant
- EMI shielding gaskets/adhesives/caulks
- solderable low-dielectric flexible-circuit substrates
- solderable ceramic/glass/LCP package lids