At a glance
| Booth | N1276 |
| Country | TW |
| Product categories | Cleaning; Washing Equipment for Assembly & Packaging · Solder Reflow; Soldering & Brazing Equipment · Wafer Level Bonders · Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating · Vacuum drying & out gassing Systems · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Coat; Develop; Resist Processing; Track Equipment · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Etching; Stripping; Ashing - Dry and Wet Equipment · Plating; Electro Chemical Plating; Deposition Systems · Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment · Manufacturing Process Support and Development |
| Website | www.yes.tech |
Company profile
YES is a leading provider of technology solutions and process equipment for the Semiconductor Ecosystem and "More than Moore" applications. YES is a provider of surface and materials enhancement technology solutions. YES’s high-tech process equipment helps bring to life complex processes that enable state-of-the-art hardware for emerging Artificial Intelligence (AI), High Performance Computing (HPC), Power Semiconductors, Life Sciences, and Mixed Reality applications. YES’s highly advanced thermal processing systems, deposition systems, and wet etch and clean technologies play a vital role in the processing of legacy & advanced node silicon wafers, next-generation substrates, wafer and panel level packages, compound semiconductors, Internet of Things (IoT) devices, microLED & miniLED displays, and micro-fluidic consumables for genomics. With innovative technologies designed to optimize performance and cost of ownership, YES serves as a trusted partner from startups to Fortune 100 companies in a wide range of markets. YES is headquartered in Fremont, California. To learn more about YES, visit YES.tech.
Capabilities and products
- clean technologies for wafer and package processing
- compound semiconductor processing equipment
- deposition systems
- legacy and advanced node silicon wafer processing
- thermal processing systems
- wafer-level and panel-level package processing
- wet etch technologies
Related product topics
- Thin-Film Deposition Equipment
- Cluster and Inline Deposition Systems
- Compound Semiconductor Manufacturing Equipment
- Wet Etching and Cleaning Equipment
- Advanced Packaging Wet-Process Solutions
- Thermal-Process Furnaces and Ovens
- Diffusion and RTA Thermal Processing
- Wafer Cleaning And Drying Equipment
- Wet Cleaning Equipment