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LG Chem

Exhibitor at SEMICON Taiwan 2026 · Booth S7430

Booth S743014 product topics
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BoothS7430
Websitewww.lgchem.com
Exhibitor profile

Company profile

LG Chem aims to connect science to life for a better future by integrating new insight with its knowledge, technologies, and solutions, while operating across petrochemicals, advanced materials, and life sciences. LG Chem was founded in January 1947 and is headquartered in Seoul, South Korea. As of 2025, LG Chem reports sales of KRW 45.93 trillion, operating income of KRW 1.18 trillion, and 17,389 employees, including 12,943 domestic and 4,446 overseas employees. Its Petrochemicals Company includes the NCC/PO, PVC/Plasticizer, ABS, Acrylates/SAP, and HPM divisions and supplies petrochemical products for industrial development. Its Advanced Materials Company includes the Cathode Materials Division, Electronics Materials Business Unit, Engineering Materials Division, and Seperator Material Division and develops specialty materials for future lifestyles. Its Life Sciences Company includes the Primary Care Division and Specialty Care Division and focuses on improving quality of life through R&D capabilities. In Korea, its network includes 1 headquarters, 1 leadership center, 3 R&D sites, and 11 plants; globally it lists 4 production sites, 14 manufacturing or sales sites, 13 sales sites, 3 branches, 4 research sites, and 2 other sites. Its listed Asian locations include Bangkok, Beijing, Chongqing, Guangzhou, Gurgaon, Hai Phong, Ho Chi Minh, Huizhou, Jakarta, Kuala Lumpur, Ningbo, Quzhou, Singapore, Taipei, Tianjin, Tokyo, Visakhapatnam, and Wuxi; locations in the Americas include Bogotá, Atlanta, Boston, Evansville, Mexico City, Ohio, and Sao Paulo; European locations include Frankfurt, Istanbul, Moscow, Nyergesújfalu, and Wroclaw. LG Chem entered the information and electronic materials market in 2000, developed PDP phosphors for the first time in Korea, began mass production of LCD polarizers, established an IT&E manufacturing subsidiary in Nanjing in 2003, commercialized battery materials in 2006, acquired cathode-material maker GSEM in 2016, established a joint-venture production corporation in China in 2018, and launched the Advanced Materials Company in 2019. It commercialized the battery separator business in 2021, acquired LG Electronics' separator division and established the LG-Toray joint venture in Hungary, then established a cathode-material joint venture with B&M in Gumi and the separator joint venture LG-Today in 2022; it started construction of a cathode-material plant in Tennessee in 2023, signed cathode-material supply agreements with global customers including GM in 2024, and involved Toyota Tsusho in equity participation at the Gumi cathode-material plant in 2025. Advanced Materials sales are listed as KRW 7.4 trillion in 2023, KRW 6.4 trillion in 2024, and KRW 4.1 trillion in 2025, with major industries identified as automotive, battery, and smartphone. The Advanced Materials business states that it is developing materials for rechargeable batteries, the IT industry, and the automotive industry, expanding semiconductor and automotive materials, diversifying display-material customers, increasing R&D investment, and strengthening R&D execution through AX, or AI Transformation. Its stated battery-material plans include expanding global production bases with a U.S. cathode plant to be completed in 2026 and developing high-voltage, cost-innovative cathode materials and highly safe, eco-friendly separators.

Exhibitor profile

Exhibits

LG Chem's Advanced Materials product list spans the Cathode Materials, Electronics Materials, Engineering Materials, and Seperator Material divisions; material categories include high-performance plastics, display materials, battery materials, semiconductor materials, and automobile materials, with applications across automobiles, home appliances, electrical and electronic products, housing, batteries, displays, semiconductors, small components, industrial products, and other uses. The 27 listed products are Adhesives for automotive bodyshop & paintshop, Adhesives for automotive electronics, BGT, BUF, CCL/PPG, Cathode Material, DAF, Dispersant for Conductive Agent, Display Stripper, Flame Barrier Material, KEYFLEX BT, KEYFLEX TO, LUCEL, LUCON, LUMID/LUXY, LUMILOY, LUMIPLAS, LUPOL, LUPOS, LUPOX/LUMAX, LUPOY, LUSEP, NCF, OLED Materials, PID, SGF, and Separator. Adhesives for automotive bodyshop & paintshop are body and structural adhesives for strong bonding, lightweighting, and durability; BGT is a protective Back Grinding Tape for preventing wafer damage and contamination, BUF is a Build-Up Film used in multilayer high-performance semiconductor substrates, and Adhesives for automotive electronics provide high-insulation, heat-dissipation, and reliability solutions. CCL/PPG is a Copper Clad Laminate/Prepreg core material that affects semiconductor-substrate reliability and electrical properties, DAF is an ultra-thin Die Attach Film for stacking and thinning semiconductor packages, NCF is an ultra-thin Non-Conductive Film for advanced packages such as HBM, and PID is a Photo Imageable Dielectric for fine-circuit formation in advanced semiconductor packages. Cathode Material is described as essential to lithium-ion battery performance and safety, Dispersant for Conductive Agent is described as providing electrical and lifespan properties for secondary-battery cathodes, and Separator uses ceramic coating to enhance safety. Display Stripper is optimized to prevent circuit corrosion and remove foreign substances, OLED Materials are next-generation display core organic materials, and SGF is a Switchable Glazing Film for optical control in future mobility spaces. Flame Barrier Foam and Sheet are intended for EV battery safety through thermal-runaway prevention and fire resistance; KEYFLEX BT is a thermoplastic elastomer with strength and flexibility, and KEYFLEX TO is an elastomer with rubber-like properties and processability. LUCEL provides abrasion resistance, mechanical strength, and dimensional stability; LUCON provides electrical and thermal conductivity; LUMID is a PA-based engineering plastic with heat resistance; and LUMILOY is an mPPO material with dimensional stability and electrical properties. LUMIPLAS is a PC-based plastic with light diffusion and flame retardancy; LUPOL is a high-performance PP plastic with mechanical properties and heat resistance; LUPOS is a high-functionality plastic with enhanced mechanical properties and heat-deformation temperature; LUPOX is a high-functionality plastic with reinforced properties and moldability; LUPOY is a PC-based high-functionality engineering plastic; and LUSEP is a lightweight engineering plastic with heat, chemical, and flame resistance. CCL consists of copper foil laminated on both sides of an insulating layer and provides structural support, electrical connection, and circuit-pattern insulation for semiconductor-package PCBs; LG Chem lists dielectric properties, thermal and mechanical stability, processability and durability, and moisture and chemical resistance as CCL/PPG features. CCL/PPG applications include PC and server DRAM, mobile DRAM, NAND, and communication SiP and AiP, with fine-thickness control for flip-chip bonding, low-CTE and low-stress warpage control, high-strength thin-substrate design, and low-Dk and low-Df properties for high-speed signal transmission. For PC and server DRAM, CCL/PPG supports DDR, GDDR, and TSV DRAM; for smart-device mobile DRAM it supports Mobile PoP, discrete memory, and LPDDR; for automotive and computing mobile DRAM it supports infotainment, ECU, ADAS, and LPDDR(SOCAMM); and for NAND it supports uMCP, UFS, eMMC, and SSD controllers. For smart-device Mobile DRAM, CCL/PPG uses a wide Tg window for package-warpage control and low-CTE, low-stress properties for high-density-package reliability; automotive and computing grades emphasize BLR under repeated T/C conditions, while NAND grades use ultra-thin high-strength, high-rigidity materials for crack resistance. For communication applications, SiP-grade CCL/PPG is optimized for high-frequency transmission in 5G smart devices, wearables, and IoT, while AiP-grade CCL/PPG uses low-Dk and low-Df characteristics for mmWave mobile antennas. BUF is a high-insulation film that forms insulating layers between circuit layers in multilayer semiconductor-package substrates such as FC-BGA, enabling high-density wiring, signal-transmission quality, and substrate stability; its listed features include dielectric properties, thermal and mechanical stability, fine-patterning and multilayer-process stability, and moisture and chemical resistance. BUF applications include PC CPU/GPU, Server CPU/GPU, Network IC, and Automotive MCU/ADAS. The Low CTE BUF group uses high-Tg and low-CTE characteristics for heat resistance and reliability in FC-BGA applications including PC CPU/GPU, Automotive MCU/ADAS, and DTV Controller; the Fine Pattern group uses nano-filler engineering for L/S ≤ 4/4 µm and moisture resistance for high-temperature and high-humidity reliability, including FC-BGA Server CPU/GPU and dielectric material for glass substrates. The Low Dielectric Loss BUF group uses low-Df characteristics for high-speed signal transmission and low-loss requirements plus controlled elongation and modulus for crack suppression, with applications including FC-BGA Server CPU/GPU, Network IC, and dielectric material for glass substrates. PID is a photosensitive insulating material for fine circuit patterns connecting semiconductor chips to substrates in advanced packages, with high resolution, high reliability, low-temperature curing, and a PFAS-free formulation; listed applications include power semiconductors, Mobile AP, and high-performance semiconductors for AI applications. PID uses proprietary material design for high-resolution patterning and reliability, low-temperature curing with low shrinkage and low moisture absorption, a formulation free of PFAS and organic solvents such as NMP and toluene, and a film type that supports fine-line circuitry on large-area panels and substrates. Positive Type (Liquid) PID provides high resolution, substrate adhesion, thermal, mechanical, and electrical properties, and low shrinkage for multilayer circuits and high-density packaging; its listed applications include FO-WLP / PLP for PMIC and Mobile AP, 2.xD AI accelerators, and dielectric material for glass substrates. Negative Type (Liquid) PID provides high reliability, high resolution, substrate adhesion, and Low Dk and Low Df characteristics for reduced crosstalk and leakage in high-speed transmission, with the same FO-WLP / PLP, 2.xD AI accelerator, and glass-substrate dielectric applications. Negative Type (Film) PID supports film-lamination processes and large-area panels, with applications including FO-WLP / PLP for PMIC and Mobile AP, FC-BGA / FC-CSP, 2.xD AI accelerators, and dielectric material for glass substrates. LG Chem also reports mass supply to Amkor in connection with its entry into the semiconductor stripper market in 2026.

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Related product topics

Thermal Interface MaterialsEngineering Plastic Stock ShapesSpecialty Foam Tapes and FilmsSurface-Processed Functional FilmsThermoplastic and Composite Semi-Finished ProductsOLED Luminescent MaterialsConductive and Non-Conductive Bonding AdhesivesDie Attach CompoundsUV Dicing and Grinding TapePackage Substrates and Laminate MaterialsPackage Substrate Core and Build-Up MaterialsSpecialty Chemicals and Custom SynthesisCleaning Chemicals & StrippersConformal Coating and Adhesives
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