| Company | Booth |
|---|---|
| 台灣東京精密股份有限公司 Accretech Taiwan Co., Ltd. | M0348, M0448 |
| MAXWELL TECHNOLOGY PTE. LTD. | P6020 |
| Rokko Electronics Co., Ltd. | K2168 |
| 瀋陽和研科技股份有限公司 Shenyang Heyan Technology Co.,Ltd | N0049 |
| 東台精機股份有限公司 Tongtai Machine & Tool Co., Ltd. | I2516 |
Which exhibitors at SEMICON Taiwan 2026 are related to Backgrind, Slicing, Lapping and Polishing Equipment?
5 exhibitors are related to Backgrind, Slicing, Lapping and Polishing Equipment, including Accretech Taiwan Co., Ltd., MAXWELL TECHNOLOGY PTE. LTD., Rokko Electronics Co., Ltd., Shenyang Heyan Technology Co.,Ltd, Tongtai Machine & Tool Co., Ltd.. The full list with booth numbers is on this page.
Where can I see the booth numbers of Backgrind, Slicing, Lapping and Polishing Equipment exhibitors?
The list on this page includes each exhibitor's booth number. You can also ask Askpo directly, e.g. "I am looking for Backgrind, Slicing, Lapping and Polishing Equipment suppliers", and it returns the relevant exhibitors with booths and evidence.
- Wafer Backgrind Equipment13 exhibitors
- Wafer Grinding & Slicing Equipment2 exhibitors
- Wafer Slicing Equipment5 exhibitors
- Lapping and Polishing Equipment10 exhibitors
- Grinding, Dicing & Polishing Equipment15 exhibitors
- Dicing Sawing and Scribing Equipment24 exhibitors
- Wafer-to-Wafer Bonders and De-Bonders5 exhibitors
- Wafer Dicing & GrindingTopic group