Tongtai Machine & Tool Co., Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth I2516

Booth I2516Country TW10 product topics
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BoothI2516
CountryTW
Websitewww.tongtai.com.tw
Exhibitor profile

Company profile

Tongtai Machine & Tool Co., Ltd. was established in 1969, is a Taiwan-listed company, and has two core business units covering machine tools and electronic equipment; its electronic-equipment division develops and manufactures equipment for PCB and semiconductor processes. Within PCB equipment, the electronic-equipment division is described as one of Taiwan's major equipment suppliers and works in mechanical drilling, winding, and laser-drilling systems that can be integrated with automation systems for efficient, continuous production. Founded in 1969 and rooted in the machine-tool industry for more than half a century, Tongtai develops standard machines, specialized machines, dedicated machines, automation, and turnkey solutions as part of its mechanical R&D activities. Its smart-technology work includes electrical-control design, software development, image processing, motion control, and integration of intelligent technologies, complementing its stated capability in standard equipment, high-end customization, and smart software. Tongtai operates R&D and manufacturing bases in Kaohsiung and Suzhou for high-precision machine-tool development, manufacturing, and quality management, with air-conditioned plants and cleanroom plus temperature-and-humidity controls in key areas such as precision measurement and spindle assembly. The company states that its outgoing accuracy standard is set above the ISO machine-tool accuracy specification, at 2 times the stated requirement, and supports this with inspection processes intended to maintain consistent delivery quality. Its management-system certifications include ISO 9001, ISO 14001, ISO 45001, ISO 50001, and ISO 27001, together with AEO certification; it also reports ISO 14064-1 verification and ISO 14067 verification for some products. Recognitions include Taiwan Top 100 Brands, the National Brand Yushan Award, the Industrial Excellence Award, and the Dingge Award. Tongtai positions its portfolio from single machines to multi-machine systems and from simpler to more complex production needs, integrating products and technologies to address manufacturing problems across different stages. Its turnkey-engineering approach links equipment, processes, automation control, and data systems through planning, construction, and validation, while its automation approach connects machinery, electrical control, and software from individual machines through complete lines, FMS, and MES. For smart manufacturing, Tongtai combines mechatronic automation, sensing data, and system platforms, progressing from connected visualization toward predictive optimization; it also provides engineering analysis and process planning based on drawing analysis, capacity targets, and risk prediction. Its production-line planning covers spatial configuration, logistics flow, equipment layout, module integration, and allowance for future expansion, while its machining solutions connect equipment, processes, and application technologies for compound-process challenges. Supporting engineering services include tool selection and planning, path strategy, tool-magazine scheduling and tool-life management, as well as fixture design focused on stable clamping, rapid changeover, automatic positioning, and automation interfaces. Machining-program development combines fixture conditions, tool strategies, and virtual-and-physical simulation validation, and batch trial production uses actual cutting, takt-time testing, and process-capability analysis to confirm controllable quality and production feasibility before delivery. Tongtai also states that it supports customers through a global network for sales and maintenance services, and its technology and service scope includes turnkey engineering, automation, smart manufacturing, machining solutions, production-line management, intelligent software, application-center services, and after-sales service. Beyond its established PCB equipment portfolio, Tongtai has expanded into semiconductor-wafer processing and advanced-packaging applications, and it states that its newer equipment solutions have been adopted by leading customers in third-generation semiconductors and advanced packaging.

Exhibitor profile

Exhibits

For semiconductor and advanced-packaging applications, Tongtai supplies a SiC-ingot laser cutting system that provides non-contact slicing for hard and brittle materials. Its wafer-thinning system supports precise thickness control for Si, SiC, sapphire, and other wafers. Its EMC thinning and interposer-planarization system is designed for surface flattening in FOPLP and other advanced-packaging processes. Tongtai also lists electronic-material processing equipment spanning CNC PCB drilling machines, CNC PCB routing or forming machines, and laser-processing machines, alongside additive-manufacturing equipment, smart tools, production-line management, and intelligent software. The electronic-material processing range includes the model designations TDL-6, TDL-6CL, TCDM-6CL, TCRM-6, DCRM-6, and TLCU-660. Across its broader equipment portfolio, the company also lists vertical and horizontal machining centers, vertical and horizontal five-axis machining centers, drilling and tapping centers, horizontal and vertical CNC lathes, turn-mill centers, and ultrasonic-assisted machining centers. The semiconductor-related equipment is presented as part of Tongtai’s expansion from PCB processing toward wafer processing and advanced packaging, while automation integration supports continuous production in PCB and semiconductor-process environments.

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