At a glance
| Booth | I2516 |
| Country | TW |
| Website | www.tongtai.com.tw |
Company profile
http://www.tongtai.com.tw/tw Tongtai Machine & Tool Co., Ltd. was founded in 1969 and is a listed company in Taiwan, certified to ISO 9001 and ISO 14001. The company operates two core business units, the Machine Tool Business Division and the Electronic Equipment Business Division, and continues to deliver high-quality manufacturing solutions. The Electronic Equipment Business Division focuses on the R&D and manufacture of PCB and semiconductor process equipment. As one of the principal equipment suppliers to Taiwan's PCB industry, it holds a leading position in mechanical drilling, winding and laser drilling systems, and its equipment can be integrated with automation systems to achieve efficient, continuous production. In addition to strengthening its PCB equipment portfolio, Tongtai has in recent years expanded into semiconductor wafer processing and advanced packaging applications, including: Silicon carbide ingot laser cutting systems: non-contact slicing solutions for hard and brittle materials. Wafer thinning systems: precise thickness control for a wide range of wafers including Si, SiC and sapphire. EMC thinning and interposer planarization systems: designed for surface planarization in FOPLP and other advanced packaging processes. These next-generation equipment solutions have been progressively adopted by leading third-generation semiconductor and advanced packaging customers, demonstrating Tongtai's technical strength and forward-looking development in high-precision applications.
Exhibits
Electronic equipment includes mechanical drilling, winding, and laser drilling systems for PCB and semiconductor processes, with automation-system integration. Semiconductor and advanced-packaging equipment includes SiC ingot laser cutting systems, wafer thinning systems for Si/SiC/sapphire, and EMC thinning and interposer planarization systems for processes such as FOPLP.
Capabilities and products
- R&D and manufacturing of PCB and semiconductor process equipment
- a major equipment supplier to Taiwan's PCB industry
- mechanical drilling, routing and laser drilling systems
- integration with automation systems for continuous production
- SiC ingot laser slicing system
- wafer thinning system
- EMC thinning and interposer planarization system
- surface planarization for FOPLP advanced packaging
- machine tool business division
- ISO 9001 and ISO 14001 certified
- founded in 1969, a Taiwan listed company
- expansion into semiconductor wafer processing and advanced packaging