At a glance
| Booth | K2168 |
| Country | JP |
| Website | www.rokkodenshi.com |
Company profile
Rokko Electronics Co., Ltd. supports semiconductor production with wafer grinding and polishing for normal, thin and ultra-thin Silicon, SiC, LT, LN and Sapphire wafers, together with wafer reclaim, wafer cleaning and special wafer processing for SiC, Sapphire, LT and MEMS applications. Its integrated grinding and polishing process is used to produce thin and mirror-finished surfaces required for sensor and power-device applications. The company can process 4 to 8 inch wafers to finished thicknesses of 15 to 100 μm in both test and volume production, and it also supports special processing needs such as grinding-finish (#8000) and polishing-only services. Rokko Electronics Co., Ltd. states that quality is its first priority and that process parameters are measured and monitored, including thickness accuracy and polishing precision. Its processing-technology description covers the development, improvement, updating and manufacturing of high-precision silicon-wafer grinding and polishing technologies that affect semiconductor characteristics and performance, while special-wafer grinding and polishing for MEMS is handled in both development and volume production. The company also lists the 平成２４年度西宮市 優良事業所顕彰受賞 recognition in its corporate processing-technology information.
Exhibits
For wafers that will be finished thin, Rokko Electronics Co., Ltd. can apply preventive processing before thinning because the pre-process wafer bevel can become knife-like as the final wafer becomes thinner, creating a cause of chipping. Its grinding process is performed precisely to limit thickness variation, with a grinder selected from multiple equipment types according to the product being processed. Supported wafer sizes are 4 to 8 inches, and the grinding description gives a finished thickness of 100um or less from prototyping through volume production. After grinding, microscopic unevenness on Silicon wafers is polished away to create a mirror finish, with careful and rapid polishing intended to avoid affecting surface performance and with high precision required to avoid strain and scratches. For wafers with a patterned front side and backside thinning, RCA cleaning can be applied only to the thinned surface to remove metal contamination before the wafer is returned to the customer's process, without the RCA cleaning reaching the patterned front surface. For Silicon and compound wafers processed to 100um or less, a support substrate can continue supporting the thinned wafer through the dicing process when wafer handling by the wafer alone becomes difficult. Double-side polishing equipment enables in-plane TTV of less than 1um and can be applied to Silicon used as bonded-substrate material. Monitor-wafer reclaim services include reclaim polishing for wafers used in customer processes, with thickness, particle and metal-contamination management adjusted to customer requirements and support for 4 to 8 inch wafer sizes. For SiC wafers, the company supports wafers up to 8 inches with grinding, polishing, RCA cleaning, various inspections and epi reclaim processing. For compound wafers, Rokko Electronics Co., Ltd. states that it can support various wafer types, processing methods and inspections. Its CMP capability addresses oxide-film planarization, while trimming is used as a final process to realize nm-level planarization when grinding followed by CMP does not achieve the required ultra-flat result. For film removal on monitor wafers, the company can etch away the target films and then use RCA cleaning to remove contamination, verify whether contamination has been fully removed through inspections, and use its normal reclaim process when particle assurance is also required. Its frame-mount support service can receive a thinned wafer after the customer's heating or chemical process, mount the wafer on a dicing ring, remove the support material and return the wafer. The company also offers paid contract inspection services for a range of semiconductor-device wafers, including transparent compound wafers and Silicon wafers. The processing scope additionally identifies back grinding, polishing, patterned-wafer RCA cleaning, temporary bonding, double-side polishing, Premium process, inspection equipment, Sapphire and SiC dedicated grinders and knife-edge prevention processing as areas connected with its wafer-processing operations.
Capabilities and products
- Silicon/SiC/LT/LN/Sapphire wafer grinding and polishing
- wafer reclaim
- wafer cleaning
- special wafer processing for SiC/Sapphire/LT/MEMS
- RCA cleaning of thinned surface on patterned wafers
- temporary bonding support for thinned wafers
- double-side wafer polishing with TTV <1um
- 8-inch SiC wafer grinding/polishing/RCA/inspection/epi reclaim
- oxide-film CMP planarization
- monitor-wafer film etch removal and RCA cleaning
- nm-level wafer trimming planarization
- frame-mount service for thinned wafers
- contract inspection of semiconductor wafers
- wafer knife-edge prevention processing