At a glance
| Booth | K2168 |
| Country | JP |
| Product categories | CMP; Grind; Lap; Polish; Abrasive materials |
| Website | www.rokkodenshi.com |
Company profile
We, Rokko electronics Co.Ltd. take the following roles in the semiconductor production process. 1:Wafer grinding & polishing.(normal / thin / ultra thin for Silicon, SiC, LT, LN, Sapphire) 2: Wafer reclaim. 3:Wafer Cleaning 4:Special wafer processing for SiC,Sapphire, LT & MEMS applications. We provide the thin/mirror finished surface required for sensor or power device applications through its integrated grinding & polishing process.4 to 8 inch wafers can be processed with the finished thickness of 15 to 100 μm in both test and volume productions.Besides the integrated processing services,we are also capable of meeting special processing needs such as grinding-finish(#8000)and polishing -only services. Quality is the 1st priority in our operations.All parameters are measured and monitored,which includes thickness accuracy,polishing precision to give customers the best available quality and services.
Capabilities and products
- 4 to 8 inch wafer thinning to 15 to 100 μm
- grinding-finish #8000 and polishing-only services
- special wafer processing for SiC, Sapphire, LT and MEMS
- thin and mirror-finished surfaces for sensor and power devices
- wafer cleaning
- wafer grinding and polishing for Silicon, SiC, LT, LN and Sapphire
- wafer reclaim