At a glance
| Booth | P6012 |
| Country | SG |
| Product categories | Backgrind; Slicing; Lapping; Polishing Equipment · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Wafer Level Bonders · Wafer Mount; Taping Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment |
| Website | www.maxwell-gp.com/maxwell-en |
Company profile
Maxwell technology focusing on semiconductor pan-cutting full process, 2.5D/3D advanced packaging, Maxwell provides packaging process total solution——not only has developed semiconductor wafer laser grooving, laser stealth cutting, dicing saw, grinding and other equipment, but also has developed core components such as spindle, ultra-precision lifting platform and main consumables such as grinding wheel and cutter wheel through independent R&D, consolidating the safety and stability of the industrial chain.
Exhibits
HJT High Efficiency Solar Cell Manufacturing Whole-line Solution-HJT 3.0 Pro(720MW) + Perovskite/SHJ Tandem Cell Manufacturing Full-line Solution + High-speed off-line Laser-assisted Selective Diffusion Equipment + (Module)OLED Film Laser Abnormity Cutting Equipment + (EAC)OLED Film Automatic Laser Repairing Equipment + Mini LED Wafer Laser Stealth Cutting Equipment + Frame Handling Laser Stealth Dicing Equipment + Wafer Handling Laser Stealth Dicing Equipment + Substrate Dicing and Sorting Equipment (Jig Saw) + 12-inch Grinding and Polishing Integrated Equipment + According to the business philosophy of Maxwell, customers are always our first priority. Maxwell focuses on customer requirements and continuously carries out optimization and innovation from multiple dimensions, such as product quality, manufacturing cost, process flexibility, operation safety, production efficiency and delivery speed. Through superior products, high-quality services and professional solutions, Maxwell continuously improves customer experience, creates higher value for customers, and establishes a win-win & mutual-improvement partnership The Company has a professional technical service team comprising nearly 400 engineers, in which nearly 300 engineers are dispatched to the plants of customers in China, Korea, Singapore, Malaysia and other places in the world, to provide real-time, efficient and accompanying technical support and service, and help customers constantly improve production efficiency through field research and application of new technologies. We provide comprehensive and in-depth services to customers, from customer requirement analysis, customer consultation & suggestion and product design in the early stage, to fast delivery, installation & commissioning and technical training in the sales process, and finally to quality tracing, process upgrade and so on in the later stage, in order to ensure that our products and solutions meet and even exceed the expected requirements By establishing a smooth communication channel to customers, the Company keeps in touch with customers and responds to customer requirements rapidly through the comprehensive service response mechanism. The Company focuses on the customers' individualized requirements, and the R&D and production teams will constantly carry out adjustment and iteration of the hardware and software of equipment based on the update of
Capabilities and products
- 12-inch Grinding and Polishing Integrated Equipment
- Mini LED Wafer Laser Stealth Cutting Equipment
- Wafer Handling Laser Stealth Dicing Equipment
- dicing saw equipment
- grinding wheel and cutter wheel consumables
- laser stealth cutting equipment
- semiconductor wafer laser grooving equipment
- spindle core components
- ultra-precision lifting platform core components
- wafer grinding equipment
Related product topics
- Laser Scribing & Drilling Systems
- Wafer Laser Marking & Alignment
- Precision Machine Tool Spindles
- Spindle Bearings and Spindles
- Dicing Sawing and Scribing Equipment
- Grinding, Dicing & Polishing Equipment
- Diamond Dicing Blades & Saws
- Wafer Grinding & Slicing Equipment
- Wafer Backgrind Equipment
- Grinding Wheels and Abrasives