At a glance
| Booth | P6020 |
| Country | SG |
| Website | www.maxwell-gp.com/maxwell-en |
Company profile
MAXWELL TECHNOLOGY PTE. LTD. focuses on the full semiconductor pan-cutting process and on 2.5D/3D advanced packaging, and it provides total solutions for packaging processes rather than treating cutting as a single isolated operation. Its equipment development covers semiconductor wafer laser grooving, laser stealth cutting, dicing saw systems, grinding equipment, and other equipment used across that processing scope. Through independent R&D, MAXWELL TECHNOLOGY PTE. LTD. has also developed core components including spindles and ultra-precision lifting platforms, so its work extends beyond finished machines to important internal hardware. The same independent R&D scope includes major consumables such as grinding wheels and cutter wheels, with the stated purpose of reinforcing the safety and stability of the industrial chain around its semiconductor processing solutions.
Exhibits
MAXWELL TECHNOLOGY PTE. LTD. supplies HJT High Efficiency Solar Cell Manufacturing Whole-line Solution-HJT 3.0 Pro(720MW), Perovskite/SHJ Tandem Cell Manufacturing Full-line Solution, and High-speed off-line Laser-assisted Selective Diffusion Equipment as part of its listed solution and equipment portfolio. Its laser equipment range also includes (Module)OLED Film Laser Abnormity Cutting Equipment and (EAC)OLED Film Automatic Laser Repairing Equipment for OLED film processing, together with Mini LED Wafer Laser Stealth Cutting Equipment. For dicing-related applications, the listed equipment includes Frame Handling Laser Stealth Dicing Equipment, Wafer Handling Laser Stealth Dicing Equipment, and Substrate Dicing and Sorting Equipment (Jig Saw). The portfolio further includes 12-inch Grinding and Polishing Integrated Equipment, adding integrated grinding and polishing to the supplied semiconductor and substrate-processing equipment categories. MAXWELL TECHNOLOGY PTE. LTD. organizes product and process improvement around customer requirements, with optimization and innovation covering product quality, manufacturing cost, process flexibility, operational safety, production efficiency, and delivery speed. Its technical service organization comprises nearly 400 engineers, and nearly 300 engineers are dispatched to customer plants in China, Korea, Singapore, Malaysia, and other locations to provide real-time, efficient, accompanying technical support and service. Those field teams use on-site research and the application of new technologies to help customers continue improving production efficiency, linking service work directly to production performance at customer facilities. The service process starts with customer requirement analysis, consultation and suggestions, and product design in the early stage, then continues through fast delivery, installation and commissioning, and technical training during the sales process. Later-stage support includes quality tracing and process upgrades, and the stated service objective is to ensure that products and solutions meet or exceed expected requirements throughout the customer lifecycle. MAXWELL TECHNOLOGY PTE. LTD. also maintains customer communication through a comprehensive service response mechanism intended to keep contact smooth and respond rapidly when customer requirements change. For individualized requirements, its R&D and production teams continually adjust and iterate equipment hardware and software as customer needs are updated, making customization and ongoing equipment refinement part of the supplied support model.
Capabilities and products
- semiconductor wafer laser grooving equipment
- wafer laser stealth dicing equipment
- dicing saw equipment
- wafer grinding equipment
- spindle components for semiconductor equipment
- ultra-precision lifting platforms
- grinding-wheel and cutter-wheel consumables
- Mini LED wafer laser stealth dicing equipment
- frame-handling laser stealth dicing equipment
- wafer-handling laser stealth dicing equipment
- substrate dicing and sorting equipment
- 12-inch integrated grinding and polishing equipment
- HJT 720MW solar-cell whole-line solution
- Perovskite/SHJ tandem-cell full-line solution
- laser-assisted selective diffusion equipment
- OLED film laser shape-cutting equipment
- OLED film automatic laser repair equipment