At a glance
| Booth | M0348, M0448 |
| Country | TW |
| Product categories | Cleaning; Washing Equipment for Assembly & Packaging · Dicing; Sawing; Scribing; Separation Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Inspection and Metrology · Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers |
| Website | www.accretech.jp |
Company profile
The Future Defined. ACCRETECH. We develop our businesses in two key areas: semiconductor manufacturing equipment and precision measuring systems. Our philosophy is to generate long-term growth through the creation of "WIN-WIN," or mutually beneficial, relationships, with all our stakeholders - customers, business partners, shareholders and employees.
Exhibits
Based on the official Overview and product-category listing, the exhibitor presents capabilities aligned with Cleaning; Washing Equipment for Assembly & Packaging, Dicing; Sawing; Scribing; Separation Equipment, Cutting; Drilling; Laser ablation; Beveling Equipment, and related listed categories. The complete official category labels are preserved in the categories field.
Capabilities and products
- cleaning and washing equipment for assembly and packaging
- cutting, drilling, laser ablation and beveling equipment
- dicing, sawing, scribing and separation equipment
- precision measuring systems
- semiconductor manufacturing equipment