At a glance
| Booth | M0348, M0448 |
| Country | TW |
| Website | www.accretech.jp |
Company profile
Accretech Taiwan Co., Ltd. operates within ACCRETECH's two core business areas: semiconductor manufacturing equipment and precision measuring systems. ACCRETECH states that it builds long-term growth through WIN-WIN relationships with customers, business partners, shareholders and investors, employees, suppliers, governments, and other stakeholders. The group has bases in Japan and other major regions of the world and supports both semiconductor production equipment and precision measuring instruments through a global operating network. Its history began in 1949 with the establishment of Tokyo Seimitsu Kogu Co., Ltd., starting from precision instruments and developing its ability to measure precisely over more than 70 years. In 1952 the company developed and commercialized Japan's first air micrometer, responding to micron-level measurement needs under changing conditions such as dust, powder, and temperature. The 1958 germanium pellet auto-sorter automated micron-level thickness measurement and grade sorting and became a catalyst for entry into automated precision machinery for electronic components and semiconductor-related products. In 1963 the company completed development of Japan's first internal-diameter blade-type slicing machine, and in 1964 it developed Japan's first probing machine for semiconductor manufacturers. In 1970 it developed Japan's first wafer dicing machine, using a thin high-speed rotating blade with water flow to improve accuracy and efficiency in chip splitting. Its measuring-equipment milestones include the 1979 RONDCOM 5A roundness and cylindrical-profile measuring instrument and the earlier DCM-600A coordinate measuring machine developed in 1969. The semiconductor-equipment history also includes the A-PM-3000A fully automatic wafer probing machine, the S-LM slicing-machine series, and the W-GM-2000B edge grinding machine developed to reduce wafer-edge chipping and cracking. In 1999 the company commercialized a fully automatic blade dicing machine with opposed two-axis spindles, and in 2000 it developed the PG200 polish grinder combining rough grinding, finish grinding, polishing, and cleaning while wafers remained on the chuck table. The ACCRETECH corporate brand was introduced in 2001, followed by development of the A-FP-210A CMP in 2002 for wafer-surface polishing and planarization needs. In 2011 the company developed the HRG300 high-rigid grinding machine for hard-to-cut materials used in next-generation power semiconductors. More recent semiconductor-equipment milestones include the AP3000/AP3000e wafer probing platform, the AL3000 laser dicing machine, expansion of semiconductor-equipment production capacity through the Hanno Plant in 2023, and further capacity expansion with the Nagoya Plant in 2025. In precision metrology, the 2025 Nagoya Plant also includes the Chubu Metrology Center as a hub for technical support and solutions in precision measurement technology.
Exhibits
The semiconductor-manufacturing equipment lineup includes Probing Machines, Polish Grinders, Dicing Machines, CMP, High Rigid Grinder, Edge Shaping Products, Sliced Wafer Demounting and Cleaning Machine, Consumables, Precision ACCRETECH Blade, and ancillary equipment. ACCRETECH describes this semiconductor-equipment business as serving wafer manufacturing, test, and back-end processing while also supplying CMP and Polish Grinders for production-system requirements. Its probing-machine portfolio builds on a long history that includes Japan's first probing machine and later fully automatic wafer probers, connecting current test equipment with decades of semiconductor test development. Dicing and wafer-processing capabilities likewise extend from wafer dicing machines and precision blades to polish grinders, high-rigid grinders, edge shaping, sliced-wafer demounting, and cleaning equipment. The precision-measuring-instrument lineup includes Coordinate Measuring Machines, X-ray CT systems, surface texture and contour measuring systems, non-contact surface texture and contour systems, roundness and cylindrical-profile measuring instruments, and optical shaft measuring systems. Further precision-measurement products include dedicated measuring machines, discharge test systems, Power Supply Evaluation Services, Laser Interferometers, Non-contact Displacement Sensors, Grinder and Lathe systems, Machining Center systems, and Air Micrometers. Software is provided for coordinate measuring machines, X-ray CT systems, surface texture and contour measurement, roundness and cylindrical-profile measurement, optical shaft measurement, laser interferometers, and data collection and management. Accessories are also listed for coordinate measuring machines, surface-texture and contour or roundness measurement instruments, grinder and lathe systems, and air micrometers. ACCRETECH states that its high-precision measuring instruments are supplied to industries worldwide including automobiles, heavy-duty equipment, and aircraft, for use in measuring laboratories and production lines. The precision-measurement product-development direction includes durability, a smaller footprint, and fully automatic operation, reflecting requirements for both laboratory and in-line use. In Japanese, ACCRETECH also states that it provides products responding to various line-measurement needs in addition to general-purpose measuring instruments, directly supporting its in-line precision measurement capability. Across both business areas, the supplied scope therefore connects semiconductor manufacturing equipment with general-purpose and in-line precision measurement, measurement software, accessories, and technical-support infrastructure.
Capabilities and products
- wafer probing machines
- wafer polish grinders
- wafer dicing machines
- CMP chemical mechanical planarization equipment
- high-rigidity grinders
- wafer edge-shaping equipment
- sliced-wafer demounting and cleaning equipment
- precision wafer dicing blades
- coordinate measuring machines
- X-ray CT measuring systems
- surface texture and contour measuring systems
- non-contact surface texture and contour measurement
- roundness and cylindrical-profile measurement
- optical shaft measuring systems
- dedicated measuring machines
- discharge test systems
- power-supply evaluation services
- laser interferometers
- non-contact displacement sensors
- air micrometers
- in-line measurement products
- measurement data collection and management software