At a glance
| Booth | N0049 |
| Country | CN |
| Product categories | Dicing; Sawing; Scribing; Separation Equipment · Wafers |
| Website | www.heyantech.com |
Company profile
Shenyang He Yan Technology Co., Ltd. was founded in 2011 in Shenyang, Liaoning. In 2021 it established a subsidiary, Suzhou He Yan Precision Technology Co., Ltd.; in 2024 it established the He Yan Technology & Dalian University of Technology Joint Semiconductor Equipment R&D Center and a Japan R&D center; and in 2025 it completed a deep strategic integration with Yunzhe Semiconductor. The company currently has 800+ employees, with sales centers in Nanjing, Suzhou, Nantong, Xiamen, Xi'an, Nanchang, Dongguan, and other locations. Its products are exported to South Korea, Malaysia, Singapore, Thailand, Vietnam, and other countries, and it has set up an R&D laboratory in Japan to align with advanced international technical standards. The company focuses on precision grinding and dicing of hard and brittle materials such as silicon wafers, glass, ceramics, gallium arsenide, lithium niobate, and SiC, and is committed to providing customers with integrated semiconductor equipment and supporting process solutions spanning R&D, production, sales, and service. He Yan's main equipment includes: DS-series precision dicing saws (DICING SAW): for advanced and traditional packaging processes, meeting full-cut, half-cut, V-groove forming, and edge-trimming process needs for various product types, with multiple customized solutions. HG-series wafer grinders (GRINDER): integrating ultra-precision grinding, dry polishing, and film attach/detach processes, achieving full-process automated machining inline, with flexible process adaptation to various products and support for ultra-thin wafers and high-warpage process requirements. JS-series fully automatic cutting and sorting machines (JIGSAW): a rich product range covering JIG SAW, BULK SAW, and PANEL SAW, with cutting, sorting, and jigs all developed and produced in-house. RM-series re-mounter equipment (RE-MOUNTER): a rich range of film-handling equipment supporting various mounting and taping processes, with vacuum film-attach modules and strong anti-warpage capability. Our industry standing: national-level "little giant" specialized and innovative enterprise, high-tech enterprise, and Liaoning Province manufacturing single-product champion. In 2025 its wafer dicing-saw product market ranking rose to second worldwide, leading industry sales for 15 consecutive years, with annual shipments exceeding 1,500 units and a domestic dicing-saw market share of over 70%. Our technical accumulation: 15 years of deep engagement in semiconductor grinding and dicing, with two major R&D centers in Shenyang and Suzhou, and a cumulative total of 120 granted invention patents, 68 utility-model patents, and 5 design patents. Why choose He Yan: 1. Technology leadership: multiple core technologies at world-advanced levels, with fully functional independent-IP control software and leading precision-control and quality-control systems. 2. Reliable quality: craftsmanship-driven manufacturing, with products rigorously tested and running stably on 900+ customer production lines worldwide. 3. Fast response: a comprehensive sales and service network providing 7×24 after-sales technical support. 4. Customized service: personalized process solutions per customer needs, including customized software-function upgrades, customized workbenches, and customized auxiliary equipment.
Capabilities and products
- DS-series precision dicing saws for advanced and traditional packaging
- HG-series wafer grinders
- JS-series automatic cutting and sorting machines for JIG SAW, BULK SAW and PANEL SAW
- RM-series re-mounter equipment
- full-cut, half-cut, V-groove forming and edge-trimming dicing processes
- integrated semiconductor equipment and supporting process solutions
- precision grinding and dicing of silicon wafers, glass, ceramics, gallium arsenide, lithium niobate and SiC
- ultra-precision grinding, dry polishing and film attach/detach inline automation
- ultra-thin wafer and high-warpage grinding process support
Related product topics
- Dicing Sawing and Scribing Equipment
- Grinding, Dicing & Polishing Equipment
- Dicing, Sawing And Scribing Equipment
- Wafer Grinding & Slicing Equipment
- Package Singulation and Die Sorting
- Wafer Backgrind Equipment
- SiC and Sapphire Wafer Grinding
- Wafer Mount and Taping Equipment
- Ultra-Precision Grinding and Polishing