At a glance
| Booth | N0049 |
| Country | CN |
| Website | www.heyantech.com |
Company profile
Shenyang Heyan Technology Co.,Ltd was established in 2011 in Shenyang, Liaoning; it established Suzhou Heyan Precision Technology Co., Ltd. in 2021, established the Heyan Technology & Dalian University of Technology Joint R&D Center for Semiconductor Equipment and a Japan R&D center in 2024, and completed a strategic integration with the semiconductor company 允哲半導體 in 2025. The company has 800+ employees, has sales centers in Nanjing, Suzhou, Nantong, Zibo, Chengdu, Xiamen, Xi'an, Nanchang, and Dongguan, exports products to South Korea, Malaysia, Singapore, Thailand, and Vietnam, and operates an R&D laboratory in Japan to connect with international advanced technical standards. It focuses on precision grinding and dicing of hard and brittle materials including silicon wafers, glass, ceramics, gallium arsenide, lithium niobate, SiC, and metal, and provides semiconductor equipment and supporting process solutions integrating R&D, production, sales, and service. Its customer base is described as including domestic and international chip and packaging companies together with research institutes and universities, with applications spanning integrated circuits, optoelectronic devices, discrete devices, sensors, LED, optics, refrigeration, optical communications and 5G, medical equipment, detectors, NTC, ceramics, LED packaging, QFN packaging, DFN packaging, and BGA packaging. The company lists recognition as a national-level specialized and innovative Little Giant enterprise, a high-tech enterprise, a Liaoning Gazelle enterprise, and a Liaoning manufacturing single-product champion. It states that in 2025 its wafer dicing-saw product ranking rose to second globally, that it had led industry sales for 15 consecutive years, annual shipments exceeded 1,500 units, and its products were operating on 900+ customer production lines with 7×24-hour after-sales technical support. Its process laboratory uses semiconductor measuring microscopes, optical 3D surface profilometers, thickness gauges, and other instruments, and provides process development and improvement services, detailed trial-cut reports, small-batch dicing trials, and contract processing based on customer materials and equipment characteristics. The company offers customized process solutions including software-function upgrades, customized worktables, and customized auxiliary equipment, and states that core team members include industry professionals with more than 40 years of experience. Development records also describe a move to a new intelligent-manufacturing base with a film-product line, establishment of Dalian and Japan R&D centers, expansion into equipment, tools, and consumables, release of a fully automatic wafer grinder, customer validation of integrated cutting-and-sorting and cutting-and-ring-removal machines, 12-inch dicing-saw entry into back-end packaging wafer cutting, 12-inch semi-automatic dual-axis equipment for board cutting, an 8-inch gantry-type dicing saw, system-function upgrades, and expanded applications in optoelectronic devices, optical components, LED chips, discrete devices, and sensors. The company also highlights Shenyang's advanced-equipment manufacturing base and its own professional mechanical-processing capabilities as operational strengths.
Exhibits
The DS Series Precision Dicing Saw supports advanced and traditional packaging processes with full-cut, half-cut, V-groove forming, and edge-trimming requirements and offers multiple customized solutions. The HG Series Wafer Grinder integrates ultra-precision grinding, dry polishing, and film stripping and attachment processes, supports inline full-process automatic machining, accommodates ultra-thin wafers and high-warpage process requirements, and is also presented for grinding thinning and planarization of multiple materials. The JS Series Fully Automatic Cutting and Sorting Machine includes JIG SAW, BULK SAW, and PANEL SAW models, with cutting, sorting, and jigs developed and produced in-house, and is positioned to improve processing efficiency and automation. The RM Series Re-Mounter supports multiple Mounting and Taping processes and includes a vacuum film-attachment module with strong anti-warpage capability. The RMT Series Automatic Film Remover uses a universal dedicated wafer-positioning module supporting V-notch, center, and contour positioning, and its wrinkle-proof laminating design is intended to provide uniform film attachment for ultra-thin and highly warped wafers. The LRC Series Automatic Laser Ring Cutting Machine uses two wafer-pickup platforms matched to the tact time of laser ring cutting to improve overall cutting efficiency. The product portfolio also includes precision dicing saws in multiple model sizes and semiconductor specialty equipment for applications in integrated circuits, power devices, compound chips, LED, optical communications and 5G, optics and optoelectronics, refrigeration, detectors, medical products, NTC, ceramics, and semiconductor packaging.
Capabilities and products
- Precision dicing saws
- Integrated wafer grinding, dry polishing and film-processing equipment
- Fully automatic integrated dicing and sorting machines
- Wafer remounting and vacuum laminating equipment
- Customization of grinding and dicing equipment software and worktables
- Automatic wafer film-removal equipment
- Wafer laser ring-cutting equipment
- Tape-free dicing equipment
- Grinding and dicing process development and trial-cut evaluation
- Small-batch dicing trials and contract processing