| Company | Booth |
|---|---|
| Micro-Mechanics PTE. Ltd. | N0566 |
| 安徽耐科裝備科技股份有限公司 Nextool Technology Co.,Ltd | X0006 |
| Onn Wah Tech Pte Ltd. | P6121 |
| ORICUS SEMICON SOLUTIONS PTE. LTD. | P6016 |
| 維米電子股份有限公司 VIMIC Electronic Corp. | N0366 |
Which exhibitors at SEMICON Taiwan 2026 are related to IC Packaging Molding Dies and Tooling?
5 exhibitors are related to IC Packaging Molding Dies and Tooling, including Micro-Mechanics PTE. Ltd., Nextool Technology Co.,Ltd, Onn Wah Tech Pte Ltd., ORICUS SEMICON SOLUTIONS PTE. LTD., VIMIC Electronic Corp.. The full list with booth numbers is on this page.
Where can I see the booth numbers of IC Packaging Molding Dies and Tooling exhibitors?
The list on this page includes each exhibitor's booth number. You can also ask Askpo directly, e.g. "I am looking for IC Packaging Molding Dies and Tooling suppliers", and it returns the relevant exhibitors with booths and evidence.
- Semiconductor Packaging Equipment32 exhibitors
- Advanced-Packaging Carriers and Fixtures7 exhibitors
- IC Package Assembly, Test and Failure Analysis13 exhibitors
- Chip Test and Assembly Components10 exhibitors
- IC Test Interface Products20 exhibitors
- IC Test Sockets23 exhibitors
- IC Sorting Systems10 exhibitors
- Die Bonding & AssemblyTopic group