At a glance
| Booth | P6016 |
| Country | SG |
| Website | oricus-semicon.com |
Company profile
ORICUS SEMICON SOLUTIONS PTE. LTD. manufactures semiconductor backend tools and applies process and application know-how to create bespoke, mission-critical tooling solutions for the global Semiconductor Assembly and Test industry. Its manufacturing scope runs from one-off specials to large-scale production, supported by R&D capability, precision-manufacturing experience and problem-solving work for tooling requirements that range from individual custom parts to repeat production. The company combines engineering, customer-oriented service and current manufacturing technology to produce micro-precision tooling for special applications, supplying a global market while maintaining a local presence. ORICUS SEMICON SOLUTIONS PTE. LTD. can design and manufacture either one-off or high-volume orders to customer specifications, including high-temperature-resistant tools for Power Devices and complex tools for 3D Advanced Packaging. Its Sales and R&D teams are made up of experienced Semiconductor Assembly and Test professionals who study chip and package requirements and propose tooling solutions intended to work directly in the required application. Facilities certified to ISO9001:2015 and ISO14001:2015 operate quality-assurance programs beginning with incoming-material inspection and continuing through the production process. Quality-control resources include a Material Testing laboratory, comprehensive dimensional-test procedures, a tool-performance testing center and final-product inspection, covering both incoming and finished-tool verification activities. The company takes measures to comply with REACH under European Regulation (EC) 1907/2006 and RoHS under European Parliament 2011/65/EU, and it has adopted the OECD Due Diligence Guidance for Responsible Supply Chains of Minerals from Conflict Affected and High Risk Areas.
Exhibits
ORICUS SEMICON SOLUTIONS PTE. LTD. offers customized, application-specific tooling for the global Semiconductor Assembly and Test industry and organizes its main tooling range around three business sectors: Die Attach Tools, Wire Bond Tools and Bond Test Tools. For Die Attach applications, the company supplies a full suite ranging from Rubber Tips and Pick Up Tools to Ejection Systems and Adhesive Systems, with each category intended to be customized for the specific die-attach requirement. For Ball Bonding and Wedge Bonding, the Wire Bond Tools range includes Precision Window Clamps, Heat Blocks, Finger Clamps, Bridges and Anvil Blocks. For bond testing, Shear Tools and Pull Hooks are used to determine the integrity and reliability of bonded Integrated Circuits. The featured-product range includes Rubber Tips and Rubber Holders, with holder configurations listed as Common, Tri-lock, Compression and Magnetic. Pick Up Tools are offered in Engineering Plastics, Alloy Steels and Superalloys, Full Carbide and Metal-Carbide Hybrid configurations, providing several construction choices for die-handling tooling. Ejection Systems include Needles and Holding Sets, while Adhesive Systems include Dispensing, Stamping and Flux Tools, expanding the die-attach offering beyond pickup components alone. The company develops precision-engineered tooling with the stated objective of improving productivity and yield in backend Semiconductor Assembly and Test operations, combining design creativity with manufacturing execution. ORICUS SEMICON SOLUTIONS PTE. LTD. has started operations in a new R&D Facility in Singapore, adding a dedicated location for its research and development activity. For Rubber Tips, the company conducts R&D and laboratory work on its rubber compounds and develops, mixes and molds those compounds entirely in-house, retaining control over the compound-development and manufacturing process. The company's featured product resources also identify a new line of NBR-C Rubber within its rubber-product development activity.
Capabilities and products
- custom semiconductor backend tooling manufacturing
- one-off to high-volume tooling design and manufacturing
- high-temperature-resistant tooling for power devices
- complex tooling for 3D Advanced Packaging
- die-attach rubber tips and pick-up tools
- die-attach ejection and adhesive systems
- precision fixtures for ball and wedge bonding
- bond-test shear tools and pull hooks
- in-house rubber-tip compound development, mixing and molding