At a glance
| Booth | X0006 |
| Country | CN |
| Website | www.nextooling.com |
Company profile
Nextool Technology Co.,Ltd was established in October 2005 and researches, develops, produces and sells intelligent manufacturing equipment for plastic extrusion molding and semiconductor packaging, while providing customized intelligent manufacturing equipment and system solutions. Its main product areas are plastic extrusion molds, extrusion molding equipment and downstream equipment, together with semiconductor packaging equipment and molds. The company states registered capital of RMB 114.55 million and more than 100 patents supported by an established research and development system and continuing innovation. Its manufacturing resources include four-axis wire-cutting and EDM equipment, high-speed graphite-electrode milling machines, machining centers and mirror grinders introduced from Switzerland, Japan and Germany. For inspection and metrology, the company lists German ZEISS coordinate imaging equipment and coordinate measuring machines, which it uses to support micron-level part manufacturing accuracy. In plastic extrusion, Nextool Technology Co.,Ltd states that it has systematically mastered core technologies through in-depth study of plastic extrusion-forming principles, polymer-melt rheology and integrated mechanical and electrical technologies. That technical base is used to continually design and develop plastic extrusion molds, extrusion-forming equipment and downstream equipment for customer requirements. The company attributes its extrusion business to distinctive design concepts, mature process technology, product quality, extensive commissioning experience and a complete after-sales service capability. Its plastic-extrusion products are stated to be sold to 40 countries worldwide, giving the business an established international supply reach. Long-term customers named for the extrusion business include Germany's Aluplast Group, Profine Group and REHAU Group, Belgium's Deceuninck Group, and the U.S. companies Austroplast, Eastern Fence and PLYGEM Group. For semiconductor packaging, the company applies its knowledge of plastic forming, precision mechanical design and manufacturing and electrical automation control, together with its research and development system and innovation capability. It has developed fully automatic semiconductor packaging systems, fully automatic trim-and-form systems, molds and related equipment for precision packaging of integrated circuits and discrete devices. Named semiconductor customers include Tongfu Microelectronics Co., Ltd. (002156), Tianshui Huatian Technology Co., Ltd. (002185), JCET Group Co., Ltd. (600584), PANJIT Electronic (Wuxi) Co., Ltd. and 晶導微, and the company identifies Tongfu Microelectronics, Tianshui Huatian Technology and JCET Group among the world's top ten semiconductor packaging and test enterprises. Nextool Technology Co.,Ltd describes itself as one of a limited number of domestic-brand suppliers of semiconductor packaging equipment and molds serving those semiconductor customers. The company identifies itself as a national high-tech enterprise, an Anhui innovative enterprise and an Anhui specialized and sophisticated SME, and states that it has an Anhui-recognized enterprise technology center and a postdoctoral research station. In November 2018, the company was named a Manufacturing Single Champion Demonstration Enterprise for 2019-2021 by the Ministry of Industry and Information Technology and the China Federation of Industrial Economics. In November 2021, it passed the Ministry of Industry and Information Technology review associated with the third batch of Manufacturing Single Champion listings. The company undertook the 2018 Anhui major science-and-technology project for the NTASM200 integrated-circuit automatic packaging system. In 2019, it received the annual Mold Export Key Enterprise honor from the China Die & Mould Industry Association. In 2020, it received the Anhui Science and Technology Second Prize for key technologies and industrialization of intelligent extrusion-forming equipment and a China key backbone mold-enterprise honor for plastic-profile extrusion molds. Its AMS120-PS fully automatic packaging system was recognized as 2020 Anhui first-set major technical equipment. In 2021, the company received recognition from the China International Semiconductor Packaging and Test Conference organizing committee as a semiconductor packaging-and-test equipment enterprise with development potential and was elected a council member of the national IC packaging-and-test industrial-chain technology innovation strategic alliance.
Exhibits
The supplied product range includes plastic extrusion molds, extrusion-forming equipment and downstream equipment for plastic-processing applications, with designs developed from the company's work on extrusion principles, polymer-melt rheology and mechatronics. The extrusion equipment offering is paired with commissioning experience and after-sales service, giving customers support beyond the mold or machine itself. For semiconductor manufacturing, the lineup includes semiconductor packaging equipment and molds, fully automatic semiconductor packaging systems, fully automatic trim-and-form systems and related equipment. These semiconductor systems are used for precision packaging of integrated circuits and discrete devices and are based on precision mechanical design and manufacturing together with electrical automation-control technologies. The company's production and inspection base includes imported four-axis wire-cutting and EDM equipment, graphite-electrode high-speed milling, machining centers and mirror grinders, plus ZEISS coordinate imaging and measuring equipment to support micron-level component accuracy. The NTASM200 integrated-circuit automatic packaging system appears in the company's 2018 Anhui major science-and-technology project history, while the AMS120-PS fully automatic packaging system received 2020 Anhui first-set major technical equipment recognition.
Capabilities and products
- plastic extrusion molding dies
- plastic extrusion equipment and downstream equipment
- fully automatic semiconductor packaging systems
- fully automatic trim-and-form systems
- semiconductor packaging molds