At a glance
| Booth | X0006 |
| Country | CN |
| Website | www.nextooling.com |
Company profile
Anhui Naike Equipment Technology Co., Ltd. was established in October 2005 and is mainly engaged in the R&D, production and sales of intelligent manufacturing equipment used in plastic extrusion molding and semiconductor packaging fields, providing customers with customized intelligent manufacturing equipment and system solutions. Its main products are plastic extrusion molds, extrusion molding devices and downstream equipment, and semiconductor packaging equipment and molds. The company has a registered capital of 114.55 million yuan. Relying on a complete R&D system and continuous innovation capability, it has obtained more than 100 patents. The company has introduced world-leading processing equipment such as four-axis wire-cutting and EDM machines, graphite electrode high-speed milling, machining centers and mirror grinders from Switzerland, Japan and Germany; its inspection equipment includes German ZEISS coordinate measuring imagers and coordinate measuring machines, ensuring micron-level part manufacturing precision. Through in-depth research on plastic extrusion molding principles, plastic melt rheology theory, and mechanical-electrical integration technology, the company has systematically mastered the core technology of plastic extrusion molding, continuously designing and developing plastic extrusion molds, extrusion molding devices and downstream equipment that meet customer needs. With unique design concepts, mature process technology, solid product quality, rich commissioning experience and complete after-sales service, its products are sold to 40 countries worldwide and have for many years served numerous internationally renowned brands such as Germany's Aluplast Group, Profine Group and REHAU Group, Belgium's Deceuninck Group, and the USA's Austroplast, Eastern Fence and PLYGEM Group. Relying on the key technologies it has mastered in plastic molding principles, precision mechanical design and manufacturing, and electrical automation control, and with its complete R&D system and continuous innovation capability, the company has successfully developed fully automatic semiconductor packaging systems, fully automatic trim-and-form systems, molds and related equipment, mainly used in the precision packaging of integrated circuits and discrete devices. The company sells its semiconductor packaging equipment and molds to TFME (002156), Huatian Technology (002185) and JCET (600584) among the world's top ten semiconductor packaging-and-testing enterprises, as well as to many well-known domestic semiconductor companies such as Wuxi Qiangmao Electronics and Jingdao Micro, making it one of the few domestic-brand suppliers of semiconductor packaging equipment and molds. The company is a national high-tech enterprise, an Anhui Province innovative enterprise, and an Anhui Province "specialized, refined, distinctive and innovative" SME; it holds an Anhui-Province-recognized enterprise technology center and has established a post-doctoral research workstation. In November 2018, the company was named a "Manufacturing Single-Champion Demonstration Enterprise (2019-2021)" by the Ministry of Industry and Information Technology and the China Federation of Industrial Economics; in November 2021, it passed the MIIT review and was listed in the third batch of manufacturing single-champion announcements; it undertook the 2018 Anhui Province major science-and-technology special project "Integrated Circuit Automatic Packaging System NTASM200"; in 2019, the company was awarded the title of "Annual Key Mold Export Enterprise" by the China Die & Mould Industry Association; in 2020, the company received the "Anhui Province Science and Technology Second Prize - Key Technologies and Industrialization of Intelligent Extrusion Molding Equipment" awarded by the Anhui Provincial People's Government and the title of "China Key Backbone Mold Enterprise - Plastic Profile Extrusion Mold" awarded by the China Die & Mould Industry Association, and its product "Fully Automatic Packaging System AMS120-PS" won the "2020 Anhui Province First (Set) Major Technical Equipment" honor; in 2021, the company was awarded the title of "China's Most Promising Semiconductor Packaging-and-Testing Equipment Enterprise" by the organizing committee of the China International Semiconductor Packaging-and-Testing Conference, and was elected a council member of the National Integrated Circuit Packaging-and-Testing Industry Chain Technology Innovation Strategic Alliance.
Capabilities and products
- ZEISS coordinate measuring imagers and coordinate measuring machines
- extrusion molding devices and downstream equipment
- four-axis wire-cutting and EDM machining
- graphite electrode high-speed milling
- machining centers and mirror grinders
- micron-level part manufacturing precision
- plastic extrusion molds
- semiconductor packaging equipment and molds