At a glance
| Booth | P6121 |
| Country | SG |
| Website | onnwahtech.com/about-us |
Company profile
Onn Wah Tech Pte Ltd. is a Singapore based precision engineering company serving semiconductor back-end packaging, with its business centered on precision tooling for the SEMICON Back-End Packaging Industry. Established in January 2009, the company developed its role around semiconductor back-end packaging and the engineering of tooling used in that manufacturing stage. OWT aims to become the preferred One-Stop supplier for Precision Tooling used in the SEMICON Back-End Packaging Industry, making one-stop precision-tool supply a defined part of the company's positioning. Onn Wah Tech Pte Ltd. is not limited to make-to-print supply and provides customized design solutions, placing engineering design rather than drawing-based fabrication alone at the center of its customer approach.
Exhibits
Ball Mount (BGA) Tooling is also referred to as Ball attach tooling, providing the product terminology used for this semiconductor packaging-tool category. The tooling consists of high-precision, specialised manufacturing components used in the semiconductor back-end packaging process, placing the product directly within back-end package assembly. Its primary purpose is to accurately place microscopic solder balls onto the contact pads of a Ball Grid Array (BGA) substrate or wafer. The supply range also includes Ball mounter 植球模具, adding ball-mounter tooling to the company's semiconductor packaging-tool portfolio. Onn Wah Tech Pte Ltd. provides design, fabrication and setup of BGA tooling for semiconductor back-end packaging, so the offering includes engineering work as well as the precision components used in the packaging process. Designed Conversion Kits are part of the company's precision-tooling supply, providing conversion-kit solutions alongside BGA-related tooling for semiconductor back-end packaging equipment requirements. For standardization needs, Onn Wah Tech Pte Ltd. offers automation mechanisms that can be incorporated into tooling solutions rather than limiting the work to static make-to-print components. The company's supply scope also includes Precision Engineering Solutions and Industry 4.0 Precision Engineering Solutions, extending the tooling offer into engineering solutions associated with semiconductor back-end packaging. BGA tooling design is part of the company's supply capability, allowing the tooling configuration to be engineered for semiconductor back-end packaging requirements before manufacturing begins. BGA tooling fabrication is also provided, converting the engineered tooling design into the precision-manufactured hardware required for packaging operations. Setup of BGA tooling forms a further part of the offering, extending the service from design and fabrication into implementation of the tooling for semiconductor back-end packaging use. Precision machining solutions complement the packaging-tool portfolio, adding precision-manufacturing capability to the company's BGA tooling and engineering services.
Capabilities and products
- precision tooling supply for semiconductor back-end packaging
- BGA ball attach tooling
- ball mounter tooling
- conversion kit design
- custom precision tooling design
- automation mechanism design for standardization
- Industry 4.0 precision engineering solutions