At a glance
| Booth | N0566 |
| Country | SG |
| Website | www.micro-mechanics.com |
Company profile
Micro-Mechanics PTE. Ltd. designs, manufactures and markets a complete range of consumable parts and tooling used in semiconductor assembly and testing. Its core product families include rubber pick-up tools, tungsten carbide die collets, adhesive dispensing nozzles, die ejector needles, wire-bond clamps and EFOs, mold pots and plungers, and trim and form tools. The company also designs and manufactures parts and tooling to customer specifications, extending its standard semiconductor assembly and test range with application-specific mechanical solutions. Micro-Mechanics reports eight operations across Asia, Europe and the United States and about 500 people, with an operating goal of providing fast and effective precision solutions for assembly and test. Its broader business describes high-precision parts and tools for process-critical applications in the semiconductor and other high-technology industries and presents the organization as a global integrated mechanics solution company. The company's network includes operations or representatives associated with Malaysia, China, Thailand, Europe, Singapore, the Philippines, the USA, Taiwan, Indonesia and Japan, supporting customers across multiple semiconductor manufacturing regions. Named organizations in this network include Micro-Mechanics Technology Sdn. Bhd. in Malaysia, Micro-Mechanics Technology(Suzhou) Co., Ltd. in China, Progress Tooling & Engineering Co.,Ltd. in Thailand, Micro-Mechanics Pte Ltd. in Singapore, Micro-Mechanics Technology International Inc. in the Philippines, Micro-Mechanics, Inc. in the USA and Actec Co., Ltd. in Japan, alongside sales representatives in Europe, Taiwan and Indonesia.
Exhibits
Micro-Mechanics PTE. Ltd. supplies semiconductor assembly and test consumables and tooling covering die attach, pick-up, dispensing, die ejection, wire bonding and encapsulation process steps. High-Temperature Plastic Pick-up Tools are offered in standard and custom sizes with tip sizes beginning at 0.20mm, and the polyimide withstands 480 degrees C so the tools can be used for both ambient and high-temperature processing. Micro-Mechanics specializes in Wire-Bond Clamps that securely hold a lead-frame or substrate during the bonding process, with both design and manufacturing provided as part of the bonding solution. For dip-and-stamp adhesive applications, the company designs and manufactures stamping tools even though syringe dispensing techniques have replaced this method for most applications. Its contract-manufacturing capability focuses on developing repeatable processes for machining complex parts on a 24/7 automated basis. Replaceable rubber tips are designed for die-attach or pick-and-place and cover die sizes starting as small as 0.25mm (0.010"), using proprietary ultra-pure and antistatic rubber for assembly cleanroom use. The broader tooling portfolio also includes rubber pick-up tools, tungsten carbide die collets, adhesive dispensing nozzles, die ejector needles, wire-bond clamps and EFOs, mold pots and plungers, trim and form tools, plus custom parts and tooling made to specification. By combining application-specific pick-up tooling, bonding clamps, adhesive stamping tools and automated contract machining, the company supports multiple process-critical mechanical interfaces used during semiconductor assembly and testing.
Capabilities and products
- semiconductor rubber pick-up tools
- tungsten carbide die collets
- adhesive dispensing nozzles
- die ejector needles
- wire-bond clamps
- mold pots and plungers
- trim and form tools
- custom semiconductor parts and tooling