At a glance
| Booth | H0034 |
| Country | CN |
| Website | zeroonetest.com |
Company profile
Zero One Semiconductor Technology (Changzhou) Co. Ltd. was established in July 2021 and leverages more than 30 years of industry expertise in ATE test boards to serve semiconductor clients globally. The company provides ATE Device Interface Boards (DIBs) and MLO products, with a service scope that spans design, simulation, fabrication and component assembly. Its testing expertise covers applications including GPUs, AP, RF, PMICs, Optical and Memory devices such as LPDDR6 and HBM. The product categories named by Zero One include Load Board, DSA, Burn-in Board, Probe Card PCB and MLO. Zero One states that it has its own design centers and PCB factory, while its design team and factory are dedicated to ATE performance boards and bench boards. The company also describes a strong R&D department that continually works to improve processes and evaluate better materials, with quality and reliability identified as drivers of its growth.
Exhibits
For Load Board work, Zero One offers ATE board design, simulation, PCB fabrication, component sourcing, component assembly, post-assembly flying-probe testing and AOI inspection. Its high-speed design experience lists 3.2 Gbps DDR2, 10 Gbps DDR3, 4.2 Gbps DDR4 and 6.4 Gbps DDR5 among the memory-interface examples. RF and wireless examples include a 2.6 GHz RF transceiver, a 40 GHz RF application board, 2.4 GHz Bluetooth 1, 2 and 3.0, NFC, mobile wireless, WLAN, GPS, 2.5 GHz Wi-MAX and 5 GHz WLAN or mobile wireless. Additional interface examples include 3.4 Gbps and 4.5 Gbps HDMI, 3.125 GHz Hyper Transport, 5 Gbps USB 3.0, 6 Gbps SATA I, II and III, 6 Gbps Serial ATA, 13 GHz XDR, 10 GHz SONET and 13 GHz SONET/SDH. The Load Board page also lists 8, 16 and 32 Gbps PCIE 1, 2.0 and 3.0, a 16 Gbps Image Signal Processor example and Serdes examples at 25 Gbps and 56 Gbps. For RF layout, Zero One lists a 5 GHz and 2.4 GHz multi-site RF design with 0.5 mm pitch and quad-site configuration, plus a 0.35 mm pitch direct-probe octal-site RF layout with 32 RF ports per site. High-density layout examples include 0.4 mm pitch across 12 sites with 12 ICs at 0.35 mm pitch and 24 ICs at 0.40 mm pitch, while DUT pitch examples include 0.30 mm single-site, 0.35 mm octal-site and 0.40 mm quad-site designs. The Load Board capability is supported by PCB fabrication and assembly resources, with the company's own design centers and PCB factory used to support delivery and pricing objectives. For probe cards, Zero One describes a vertical probe card system based on proven vertical bucking-beam probe technology. The stated advantages of the probe-head approach include relatively linear contact force, the ability to reach small pitch with incremental cost increases, and on-site replacement of a single probe. Probe-card automation uses laser drilling, which is described as capable of producing very small holes at lower drilling cost than mechanical drilling. Automatic probe-forming equipment includes wire cutting, probe-length measurement and insertion into plating fixtures, a plating line for forming the space-transformer end, and grinding equipment for controlling probe-tip and tail length. A QA machine measures probe straightness, length and diameter and records the results in a database as part of the automated manufacturing and inspection flow. Probe-head construction uses NC and lapping machines for probe-head parts, laser drilling for ceramic guide plates, and an automatic machine that inserts probes into ceramic guide plates at 240 probes per hour. The probe-card process includes an MLO/MLC vapor soldering process, final lapping of probe tips for planarity control, X, Y and Z position measurement of probe tips, and a leakage-current measurement machine. Zero One's probe-card strategy emphasizes automation, lower probe cost, multi-site MLO carriers, lower assembly cost, faster delivery and development of pointed-tip probes for fine-pitch pad probing. Probe-card configurations listed by the company include Flex PCB Assembly, Multisite MLO Space Transformer, Multisite MLO Interposer Space Transformer and Direct Attach. For MLO or MLC space transformers, the page notes that the MLO or MLC is mounted to the PCB by soldering and that soldering interconnections can create performance problems such as cold solder, de-wetting or snow-man joints that cause electrical failure. As a Direct Attach alternative, Zero One states that it developed a 150 um pitch PCB that allows the probe head to be mounted directly to the PCB without soldering.
Capabilities and products
- ATE DIB and MLO design, simulation, fabrication and assembly
- ATE Load Board design and fabrication
- post-assembly flying-probe testing and AOI inspection for Load Boards
- automated manufacturing and inspection of vertical Probe Cards
- 150um-pitch Probe Card Direct Attach PCB
- pointed-tip probe development for fine-pitch pad probing