At a glance
| Booth | Q5958 |
| Country | TW |
| Website | www.ymtechnology.com/index_en.php |
Company profile
YMT CO.,LTD TAIWAN BRANCH (KOREA) is part of YMT's specialty-chemical and materials business, which was established in 1999 and has focused on products for the printed circuit board, optoelectronics and semiconductor industries. YMT completed its IPO in 2017 and is currently Korea's largest supplier of specialty chemicals. The company bases its development and service approach on quality assurance, technology-based development and customer-first service, and states that these principles have earned client trust and recognition. It supplies specialty chemicals for surface treatment of flexible boards, rigid-flex boards and IC substrates. Since 2013, YMT has established branches and subsidiaries in Taiwan, Shenzhen, Kunshan, Vietnam and Zhuhai to provide technical services and promote localized production. YMT Co., Ltd.'s Korean headquarters is in Inchen, with chemical and materials divisions, three factories in the Namdong industrial area, two R&D centers and its main manufacturing location in Korea. YMT Vina Co.,Ltd in Bac-ninh, Vietnam operates a Chemical Division and plating-outsourcing business, with a Vin-Phuc Branch identified as a manufacturing location. YMT Co., Ltd Taiwan Branch is located in Taoyuan and handles sales and promotion for Chinese and Taiwanese customers. Chimie Lab CO., LTD. in Ansan, Korea is associated with Antivirus Cu Materials/Mask, Bio link and B2C business. YPT Co.,Ltd. in Ansan provides plating outsourcing for ENIG, ENEPIG and Via-Fill and is also identified with an R&D center. YMT China(Shenzhen) Co., Ltd operates in Shenzhen with Pinhong and Kunsan branches and identifies factory construction in Zhuhai. Beyond Solution in Ansan is described as conducting plating-machine R&D and providing equipment-management service.
Exhibits
The core product range includes electroplating, electroless plating, mSAP, SAP and UBM, together with specialty chemicals for 5G high-frequency processes. The wider electronic-materials lineup includes ultra-thin copper foil, EMI shielding and Roll to Roll copper plating. Process chemicals include the DR Series, SE Series, Gold Recover and Cleaner, alongside copper-plating products covering Electroless Copper Plating and Electronic Copper Plating. Final-surface-treatment products include the Soft ENIG Process and ENEPIG Process, while the semiconductor lineup includes Gold surface cleaning, Cu Etchant, Gold Etchant and Post dry etch cleaner. The lineup also includes electronic materials, semiconductor process chemicals and packages, Auto analyzer, and related chemical and service categories. At SEMICON Taiwan 2026, YMT presents chemical copper for T-Glass as part of its semiconductor and PCB process-material lineup. The exhibition lineup also includes etchants and strippers for mSAP and SAP processes, ENEPIG, an environmentally oriented Non-TMAH stripper, and a wafer cleaner for bumping processes. YMT also displays an automatic chemical-analysis and supply unit to demonstrate technology for stable chemical management and supply in production environments. For next-generation semiconductor packaging, the company presents glass-substrate TGV technology and samples and has developed TGV Full Fill copper-plating chemistry and related technology for high-density through holes. Electronic materials also include EMI shielding, Coverlay Film, Edge coating and Dry Film, broadening the materials available alongside the chemical-process portfolio. YMT organizes offerings under Final Surface Treatment, Copper Plating, Process & Display, Electronic Materials, Semi-conductor and B2C, and separately offers an Auto analyzer, combining process chemicals, materials and supporting analysis equipment. Within copper plating, Electroless Copper Plating and Electronic Copper Plating are named as separate product categories, complementing the broader electroplating and electroless-plating range identified in the company introduction. The process-chemical range separately identifies DR Series and SE Series products, together with Gold Recover and Cleaner, rather than presenting process chemistry as a single undifferentiated category. For final surface treatment, Soft ENIG Process and ENEPIG Process are listed as distinct offerings, and YPT Co.,Ltd. also provides plating outsourcing for ENIG, ENEPIG and Via-Fill. The semiconductor chemical package separates Gold surface cleaning, Cu Etchant, Gold Etchant and Post dry etch cleaner into named process materials, giving customers a defined set of cleaning and etching-related options. The broader materials portfolio also includes Bio link materials in the B2C category, while affiliated businesses connect the chemical portfolio with plating outsourcing, plating-machine R&D and equipment-management services. The TGV presentation is positioned within YMT's accumulated plating-chemistry capability, with the company linking its TGV Full Fill copper-plating chemistry to high-density through-hole requirements in glass substrates for advanced packaging.
Capabilities and products
- electroless copper plating chemicals including T-Glass applications
- copper electroplating chemicals
- soft nickel-gold (Soft ENIG) process chemicals
- nickel-palladium-gold (ENEPIG) process chemicals
- gold surface cleaners
- copper etchants
- gold etchants
- post-dry-etch cleaners
- gold recovery process chemicals
- ultra-thin copper foil
- EMI shielding materials
- roll-to-roll copper plating
- etchants for mSAP/SAP processes
- strippers for mSAP/SAP processes
- Non-TMAH strippers
- wafer cleaners for bumping processes
- copper plating chemicals and technology for full filling of TGVs in glass substrates
- automatic chemical analysis and supply equipment
- coverlay film
- edge-coating materials
- dry film
- specialty chemicals for UBM processes
- specialty chemicals for 5G high-frequency processes
- Bio link materials