At a glance
| Booth | L0810 |
| Country | TW |
| Website | www.wiretech.com.tw |
Company profile
Wire Technology Co., Ltd. is a Taiwan-based supplier of alloy bonding wire for the semiconductor industry, specializing in alloy-wire alternatives to pure gold and copper wire. Its alloy wire is offered in complete specifications from 2.0 to 0.6 mil (0.0500 to 0.0150 mm) and can be tailored to customer machine types. The material is positioned as a lower-cost substitute for precious-metal bonding wire, offering tensile strength, elongation at break, and post-bond pull and push performance comparable or superior to pure gold while matching it in electrical conductivity, melting current and thermal conductivity. The company holds patents in Taiwan and abroad and operates its own R&D and production lines.
Capabilities and products
- 2.0 to 0.6 mil alloy bonding wire
- alloy bonding wire for the semiconductor industry
- alloy bonding wire with post-bond pull and push performance
- alloy-wire alternatives to copper wire
- alloy-wire alternatives to pure gold wire
- machine-tailored alloy bonding wire