At a glance
| Booth | L0810 |
| Country | TW |
| Website | www.wiretech.com.tw/en/about |
Company profile
Wire Technology Co., Ltd. was established in November 2008 with a mission centered on competitive alternative fine-wire solutions for semiconductor applications. The company states that it was the first and only Taiwan provider of high-technology alloy wire for the semiconductor industry and that it continues developing alloy-wire alternatives to pure gold wire and copper wire. Its technical focus includes alloy and coated micro-metal materials on fine-wire surfaces, with wire characteristics described in terms of low resistivity and softer hardness for bondability. Production is controlled through melting, block drawing, spooling, washing, packing and other stages, with the company describing thorough process and quality control across the sequence. The company has a dedicated inspection room for regular or random quality checks and states that quality-assurance personnel are trained to support product quality and customer requirements. Its product quality was verified under ISO9001, with the company milestone list recording ISO9001 certification in March 2009 and ISO14000 certification in November 2010. The milestone history begins with an alloy-wire team established in April 2000, followed by establishment of LG Corporation in November 2008 and completion of KH K1H-Type alloy wire development in December 2008. A new plant was established and the company relocated to Taichung in October 2010. The company records becoming a member of the International Association of Semiconductor companies in March 2011 and joining an Optical Association in June 2011. Its patent history includes US Patent Certificate Numbers US8,101,123B2 and US8,101,030B2 in January 2012, Taiwan Certificate Number I373382 in October 2012, and Taiwan Certificate Number I384082 in February 2013. Additional Taiwan patent certificates I394849, I395313 and I396756 are listed for March 2013. In September 2013, the company records a National Taiwan 102 Creation Award for an alloy wire and its manufacturing method and an industry innovation recognition related to silver-alloy bonding wire used in electrical packaging. The milestone list also includes patent certificates in Japan, China, Korea, the United States and Taiwan during 2014 and 2015, including Japan certificate 5541440, Japan certificate 5670412, US 8,940,403 B2, China certificate 1670992 and Taiwan certificate I486970. Wire Technology Co., Ltd. states that it has a diversity of local and overseas patents related to alloy wire. Its silver-alloy bonding wire was also reported as shortlisted for the R&D 100 award. The company's future direction emphasizes continued use of alloy-wire technology to address production-cost pressure in the semiconductor industry while combining service, initiative and technical capability.
Exhibits
Wire Technology Co., Ltd. supplies high-technology alloy wire for semiconductor applications and develops alloy-wire alternatives to pure gold wire and copper wire. The alloy-wire product line covers diameters from 2.0~0.6mil, corresponding to 0.0500-0.0150mm. The company can design and produce wire to customer requirements and describes its R&D team, production lines and technical foundation as the basis for model-specific customization. Its fine-wire solutions include alloy and coating micro-metal materials applied on fine-wire surfaces. The wire is described as having low resistivity for speed-related considerations and softer hardness for bondability. The company describes alloy wire as being composed of different metal compositions, with physical properties including fracture load and elongation at break. It states that wire tension and thrust are better than gold wire, while electrical conductivity, fusing current and thermal conductivity can be comparable to gold wire. The company also states that the alloy-wire price is significantly lower than gold wire, linking the material approach to its continuing cost-reduction efforts. Manufacturing control spans melting, block drawing, spooling, washing and packing, and the product flow is subject to thorough process and quality controls. A dedicated inspection room performs regular or random quality checks as part of the company's quality-assurance system. The company identifies ISO9001 verification and ISO certification as part of its product and process quality framework. Applications listed on the company site include IC package and LED package uses, connecting the fine alloy-wire product family with electronic packaging. The KH K1H-Type alloy wire was developed and completed in December 2008, providing a named alloy-wire development milestone within the company's product history. The company's patent and award record around alloy wire includes US and Taiwan patents, a National Taiwan 102 Creation Award for alloy wire and its manufacturing method, and an industry innovation recognition for silver-alloy bonding wire used in electrical packaging. Its silver-alloy bonding wire was shortlisted for the R&D 100 award, adding another stated recognition for the alloy-wire product line. Across the portfolio, the company combines a complete diameter range, customer-specific design and production, controlled manufacturing, inspection and alloy-wire intellectual property to supply semiconductor bonding-wire alternatives.
Capabilities and products
- high-technology alloy wire for semiconductors
- alloy-wire alternatives to gold or copper wire
- 2.0-0.6mil alloy wire
- custom alloy-wire design and production
- alloy and coated micro-metal materials on fine-wire surfaces
- alloy wire for IC packaging
- alloy wire for LED packaging
- silver-alloy bonding wire