At a glance
| Booth | I2428 |
| Country | TW |
| Website | www.wesitechnology.com |
Company profile
WESI Technology Limited is a service and distribution enterprise focused on the semiconductor, FPD and solar industries, representing international suppliers of processing equipment and consumables in Greater China markets. The company has main offices in Shanghai and Hsinchu and affiliated offices throughout Mainland China and Taiwan, forming a regional service and distribution network for the equipment and material suppliers it represents. WESI Technology formally announced its inception at Semicon China 2008 and was formed by long-term business partners; one of its key investors is WKK Distribution Ltd., which the company describes as a distributor supplying capital equipment, materials and services to the electronics industry in China and Southeast Asia since 1975. Applications of the processing tools represented by WESI include ion beam trimming, ion beam milling, ion beam deposition, vapor etch of MEMS sacrificial layers, self-aligned monolayer coating, PECVD, ICP-RIE and vacuum equipment. The company also offers materials for semiconductor and display industries, including quantum-dot material, chip trays and chemicals used for laser grooving and wafer-dicing protection. Its listed suppliers include scia Systems, memsstar®, Vakuum Servis, MTI, QNA, NanoIntegris, TTL and other international equipment and material providers. This portfolio gives WESI a combined equipment-and-consumables role spanning semiconductor process tools, MEMS-specific process technology, vacuum systems, advanced materials and production consumables for semiconductor, display and related manufacturing markets.
Exhibits
True Clean is presented for the chip-dicing process with a stated blade-life increase of over 50%, an environmentally degradable formula and manufacturing in China for faster customer service and domestic demand. scia Systems, based in Chemnitz, Germany, develops and manufactures high-end equipment for ultra-precise surface processing with ion beam and plasma technologies, and its systems are designed for coating, etching and cleaning with nanometer accuracy. The MEMS-related offering reflects the need for process flows and integrated manufacturing techniques beyond conventional semiconductor manufacturing as MEMS applications expand and require low-cost, high-quality advanced production. SPEC designs and manufactures wafer- and device-level wet-process equipment for semiconductor production and other industries requiring high processing cleanliness, with each system custom designed and manufactured for customer requirements and with designs intended to meet SEMI, ANSI, OSHA, NFPA and NEC guidelines. SPEC examples include a high-capacity 200 mm automatic wet-process system with spin dryer and a 300 mm cassette-less final-clean tool with slow-pull IPA dryer, dual Isoports and ozone injection. For cleanroom compatibility, SPEC prioritizes construction materials that will not degrade the process through chemical interaction, manufactures its systems in Valencia, California, and completes final assembly and testing with clean dry air and de-ionized water in its cleanroom. SPEC also offers electroless UBM processes for Pd+Ni+Pd and Zn+Ni+Au and states that its electroless plating systems for Under Bump Metallization are used in production by leading fabs in the United States and Asia. The SC3™ semiautomatic system provides a compact pre-diffusion clean in less than 30 square feet, combining oxide stripping, SC-1 removal of organics and particles, SC-2 metal removal, computer control and support for multiple wafer sizes. A-Tech System has developed and shipped processing equipment since 1995 for semiconductor, flat-panel-display and wear-resistant-coating applications, including PVD and deposition of graphene, diamond-like carbon and carbon nanotube materials. Its PVD offering includes versatile magnetron sputtering R&D systems, UHV magnetron sputtering for high-purity materials, reactive magnetron sputtering for ophthalmic-lens coatings, ion-beam sputtering for precision optics, inline sputtering for flat-panel-display R&D and hybrid sputtering plus ion-beam evaporation for precision mold coatings. A-Tech also offers Arc Ion Plating for wear-resistant TiN, CrN and TiAlN mold and tool coatings and clustered or standalone CVD systems for graphene, DLC and CNT deposition. KLA/ECI chemical metrology systems are used for chemical monitoring in chip and solar-cell manufacturing, and KLA/ECI works with research centers on analytical procedures for electroplating, electroless deposition and wet processing. Quali-Line® provides online copper-deposition bath control for Dual Damascene Metallization, Electroless Deposition, Advanced Packaging/Bumping and MEMS chemistries, with non-reagent techniques and express analysis aimed at lowering cost of ownership and avoiding plating voids and errors. A new Quali-Line model is identified for TSV applications, extending the chemical-monitoring line to through-silicon-via processing. QualiSurf® and the QualiLab series address plating-process monitoring for laboratory users and smaller production lines that do not require the automated sampling and ultra-accuracy of the Quali-Line series, including applications for DSP+ and silicon texturing in solar manufacturing. QualiLab® is a modular, flexible plating-bath analyzer available in configurations for semiautomatic analysis or individual sample results and is positioned for R&D, laboratory use and lower-volume production lines. memsstar® provides MEMS-specific release and surface-modification process solutions using modular process modules that can extend from R&D into volume manufacturing. In release processing, isotropic etching removes sacrificial materials to free the 3D MEMS structure, and memsstar® SVRT™ modules are designed to remove sacrificial material quickly without deposits or residues and without surface damage. The SVR-Xe product is based on XeF2 chemistries, while SVR-VHF is based on anhydrous HF chemistries, giving the release platform two named sacrificial-layer etch approaches. For surface modification, the SPDT™ module supports standard film processes including moisture barriers, wetting layers, anti-stiction coatings, seed layers and bio-inert surfaces, with CCFFT™ used for controlled deposition of ultra-thin conformal films. memsstar® can perform surface modification immediately after release etching without breaking process vacuum so that pristine MEMS surfaces are treated directly after etch for durable and well-covered films. SVRT™ release and SPD™ surface-modification modules can be integrated on a single platform, and the processes are single-wafer with repeatability from wafer to wafer, broad process windows, high yield and process control. The process modules are available in three levels of automation and are upgradeable, including the Solo standalone process-module platform and the Sentry single-wafer vacuum-loadlock platform.
Capabilities and products
- ion beam trimming equipment supply
- ion beam milling equipment supply
- ion beam deposition equipment supply
- MEMS sacrificial-layer vapor-etch equipment supply
- self-assembled monolayer coating equipment supply
- PECVD equipment supply
- ICP-RIE equipment supply
- vacuum equipment supply
- quantum-dot material supply
- chip tray supply
- laser-grooving/wafer-dicing protection chemical supply