At a glance
| Booth | R7112 |
| Country | DE |
| Website | www.werner-lieb.de |
Company profile
Werner Lieb GmbH develops customized automation solutions for semiconductor manufacturing and customized automation solutions for power electronics, with a focus on the reliability, precision and innovation expected in high-tech production. For almost more than 70 years, Werner Lieb GmbH has combined innovative solutions with precise in-house production and reliable service. Werner Lieb GmbH operates as a small-series manufacturer and special machinery builder, translating individual customer requirements into production solutions. Its technical approach combines automation with technological process integration so customer processes can be incorporated into purpose-built production equipment.
Exhibits
For semiconductor applications, Werner Lieb GmbH makes safe handling of valuable product wafers the top priority for its components and systems. The handling concept covers substrates ranging from very thin and fragile to thick, and from flat to heavily bent, reflecting the variety of wafer conditions encountered during semiconductor production. Fully integrated systems can incorporate a customer process module or technology into a fully automated system. Werner Lieb GmbH uses specially developed end effectors, load ports and equipment front end modules (EFEMs) to handle different wafer types safely. The semiconductor range includes fully integrated systems, EFEMs, load ports, SMIF load ports for wafers and reticles, substrate handling, end effectors and end effector exchangers. Werner Lieb GmbH offers fully integrated systems that embed a customer process or technology module in a fully automated wafer-handling environment. Each system can be built to the customer specification rather than being limited to a fixed standard configuration. Werner Lieb GmbH can work with the customer to design a new machine platform around the required process. The external dimensions of a fully integrated system can be adapted to the customer requirements. The system equipment and functional configuration can also be customized to the customer needs. Werner Lieb GmbH offers Equipment Front End Modules (EFEMs) for loading wafers into and out of process systems, with configurations that can add different functions. EFEM configuration options include load ports, including a two-load-port configuration, FOUP, SMIF and open wafer cassettes. Handling options include end effectors, robots with single-arm or double-arm configurations, an end effector changer and an EE parking station. Additional EFEM functions include a prealigner, ID or DMC code reader, flip station, spin dryer, OHT option, light curtain, E84 and a filter fan unit. Werner Lieb GmbH shows an EFEM with LIEB LP200-SMIF Load Ports and can customize both EFEM external dimensions and equipment configuration. For wafer load ports, Werner Lieb GmbH offers the LP200-SMIF, which can open and close wafer SMIF pods through an RSP200 interface. The LP200-SMIF W GEN2 is compatible with RSP200 SMIF wafer pods and is available with a bolts interface or as a table-top version. Its wafer mapping specification is 100 µm, and it detects wafers that are correctly inserted, cross slotted or double slotted. The LP200-SMIF W GEN2 has 8 status LEDs, follows SEMI E19.4-0417 and is specified for cleanliness ISO class 3. The LP200-SMIF W GEN2 is identified as Made in Germany. The LP200-SMIF WR reticle load port uses a base plate for SMIF pods with an RSP200 door, a stainless-steel enclosure, and sensors for pod, hood, mask and mask protrusion status. The LP200-SMIF WR has 4 status LEDs, references SEMI S2, S8, E100 and E19.4-0417, is specified for cleanliness ISO class 3, and is identified as Made in Germany. The LP200-SMIF R is compatible with RSP200 Single Mask Pods and adds sensing for pellicle presence and orientation, mask protrusion and load-port occupation for safe OHT loading, together with 8 status LEDs. The LP200-SMIF R references SEMI S2, S8, E19.4-0417, E15, E100 and E117, is specified for cleanliness ISO class 1, and is identified as CE and Made in Germany. The LP200-SMIF R EUV supports both RSP200 Single Mask Pods and EUV Mask Pods, adds Inner Pod sensing, references SEMI S2, S8, E19.4-0417, E15, E100, E117 and E152, and is specified for cleanliness ISO class 1 with CE and Made in Germany identification. Werner Lieb GmbH provides a panel load port with a base plate using a bolts interface. The panel load port includes sensing for panel protrusion. It also detects whether a cassette is present. Cassette placement is monitored, and 8 status LEDs provide status indication. The panel load port references SEMI E84 and is identified as Made in Germany. Werner Lieb GmbH develops end effectors for the specific customer application. The end-effector range is intended for wafer types that may be thin or thick, flat or heavily bent, and highly flexible or rigid. One example is a vacuum end effector with suction cups for handling high-warp substrates. The portfolio includes end effectors that use vacuum, clamping or gravity as the gripping principle. These end effectors can grip wafers, substrates or tape frames on the back side or at the edge. The end effector exchanger is part of Werner Lieb GmbH’s substrate-handling offering. It is intended for wafer handling in systems that use more than one end effector. Different end effectors can be attached to the robot arm. Attachment to the robot arm is secured through a mechanical interlock. All end effectors can be parked in a LIEB end effector station inside the machine. Alongside conventional contract manufacturing, Werner Lieb GmbH offers special services for customers with demanding technical and cleanliness requirements, including parts supplied to defined cleanliness levels and optional individual packaging. Its in-house manufacturing processes materials including metals and carbon, can apply targeted surface treatments, and supports different packaging concepts. Special-solution capabilities include ISO 7 cleanroom conditions with a stated maximum of 352,000 particles at or above 0.5 µm per m³ according to ISO 14644-1, manual particle-removal cleaning, optional ultrasonic-bath cleaning and visual inspection for particles, scratches and damage. Surface cleanliness can reach SCP 4 according to ISO 14644-9 with visual control, while low-particle packaging materials and optional double packaging are available. Material selection can account for chemical resistance, mechanical stress, outgassing and flammability; documentation can include batch records, test reports and serial numbers; ESD requirements can be addressed through suitable packaging and ESD measurement of parts and components. The special-services range also lists cleanroom assembly, milling, turning, surface grinding, welding technology, sheet-metal processing and sawing. Werner Lieb GmbH performs cleanroom assembly for semiconductor applications in ISO class 6 and 7 environments, covering work from prototype production through series production. Its cleanrooms are certified to ISO class 7 and can reach ISO 6 through additional measures; equipment includes HEPA H14 filtration with 99.995% separation efficiency at the minimum according to CEN EN 1822, airlocks, material pass-throughs, cleanroom clothing and trained personnel. Particle management uses multistage cleaning from pre-cleaning through fine cleaning to final inspection, and material choices can include anodized aluminum, stainless steel and technical plastics selected for process requirements. Cleanroom assembly uses cleanroom-compatible tools and inspection equipment, step-by-step assembly instructions and documented inspection records, followed by functional tests, leak tests and optical inspections. Services include mechanical assembly, integration of milled, turned and sheet-metal parts, assembly of frames, enclosures and functional units, screwing and bonding, precision-mechanical components, electromechanical systems, and adjustment and calibration under laminar-flow conditions. Cleanroom packaging options include double-foil packaging, vacuum packaging or protective-gas filling, with ESD-compatible packaging available when required. Quality assurance covers incoming inspection with material certificates, digital assembly records during production, final optical, mechanical and electrical checks, and traceability through serial numbers and batch management. Cleanroom assembly is integrated with mechanical manufacturing, software integration and final testing; examples include end effectors and exchangers, load ports and prealigners, EFEMs for automated substrate loading and unloading, and special machines for substrate handling or wafer processing with final assembly under cleanroom conditions. Werner Lieb GmbH supports both individual pieces and series production and describes co-engineering and transparent communication as part of project execution. For electronics manufacturing, Werner Lieb GmbH develops customized automation across pre-treatment, assembly, testing, packaging and IT connectivity, building on experience in power electronics and semiconductors. Assembly and connection capabilities include screws, rivets, press-fit applications, dosing, gluing and potting, automated feeder solutions for connectors, parts and components, and tray, box or workpiece-carrier loading and unloading. Pre-treatment and cleaning options include plasma cleaning for improved wettability, laser cleaning for particle-free surface preparation, and cleaning and drying of assemblies before assembly or coating. Marking and traceability functions include laser marking of housings, PCBs and components, automated labeling with DMC, barcode or RFID tags, printing on housings, trays and electronic assemblies, and recipe- or ID-based traceability. Testing and inspection can include in-circuit, functional and high-voltage electrical tests, AOI and industrial image processing, temperature, humidity, shock and stability tests, and leak testing for encapsulated or sealed components. End-of-line functions include automated packaging in blister packs, cartons, trays or boxes, document and label handling, palletizing and repackaging, plus integratable traceability and shipping labeling. System integration supports MES and ERP interfaces, traceability, code recognition, serial-number management, and data storage and transfer to production databases. Typical applications include automated production of sensors, control units and power modules, handling of PCBs, housings, sensitive substrates and connectors, testing and packaging for EMS providers and OEMs, and process solutions from small to large series production. For power-electronics manufacturing, Werner Lieb GmbH addresses modules such as IGBTs and MOSFETs in Si and SiC and integrates automation from DBC handling through assembly, testing and encapsulation. Solutions can be delivered as a single module, a fully integrated production line, a single system or a series solution using a Copy Exactly approach. Material-handling options include modular loaders for trays, boxes, workpiece carriers and DBCs, DBC loaders for different sizes, tray and workpiece handling with automatic mapping, continuous material flow and reduced setup effort. Surface-treatment options include plasma cleaning, particle cleaning with ionized air, rinsing with ultrapure water or other liquids, drying units, and controlled environments such as nitrogen flooding. Module assembly can integrate pick-and-place, dispensing and joining technologies for press-fit, bonding or potting, with real-time process monitoring, adaptation to component variants, and combination with test and inspection modules. Inspection and testing options include X-ray inspection, electrical tests for voltage, current and insulation, temperature, humidity and stability tests, and leak tests. Marking and traceability can use paper labels, laser marking, digital printing for logos, serial numbers and QR or DMC codes, with integration into MES and ERP systems. Final handling can include tray handling and automatic repackaging, blister, cardboard and special packaging, labeling and document inserts, and integration into warehouse or shipping logistics. Werner Lieb GmbH provides support from planning through after-sales, connection to MES, ERP and traceability systems, technology developed for 24/7 operation, and automation experience in ESD-protected cleanrooms up to ISO Class 1. Werner Lieb GmbH develops fully integrated system solutions so technology partners can offer turnkey systems, drawing on experience in the development and manufacture of series systems. Its system-integration scope includes machine enclosures, handling of highly sensitive materials, system assembly and commissioning with partner technologies, PLC programming and interface connection, and prototype-to-series development. The systems can integrate production, inspection and testing technologies from partner providers while remaining flexible and scalable. Features include multiple handling, experience with wet substrates, complete traceability, internal use of waste heat to reduce energy consumption, and a compact footprint for integration into existing production lines. Process details include component feeding from trays, workpiece flipping and DMC laser marking, multi-vacuum handling, ID tracking for individual workpieces and wet handling. Werner Lieb GmbH positions these systems for shorter process times and higher productivity and supports scaling from individual workstations to fully automatic equipment and from single machines to series systems. Werner Lieb GmbH supports assembly automation across material handling, assembly technologies and testing for power-electronics modules and electronic assemblies. A modular system architecture is used so equipment can be adapted to the production environment and different product lines or materials. Liquid-handling capabilities include dispensing liquids with different viscosities, potting for insulation and shock or environmental protection, and adhesive processes for challenging surfaces. Surface activation can use plasma, laser and thermal processes, together with flushing and purging techniques for low-particle conditions before sensitive steps. Joining options include press-fit, adhesive bonding, potting, click and snap connections, standardized welding, molding, screws, rivets and other mechanical fasteners. The assembly platform is designed for end-to-end automation through final inspection, scaling from prototypes to series production, with integrated tracking and logging for traceability. Werner Lieb GmbH integrates testing for electronics and power electronics into automated production, with results intended to support product quality, process feedback and traceability. Optical inspection detects surface defects, misalignment and geometric deviations and can provide feedback for automated corrective action. Electrical tests validate voltage, current and resistance, while physical tests can verify dimensions, material behavior and mechanical stability under simulated operating conditions. Force-displacement monitoring measures force application and motion sequences during processes such as bonding or assembly, and leak testing checks for moisture, gases and particles in sensitive applications. Automated test sequences can be integrated into the process, with documentation and traceability of test results and application-specific test profiles for component families and industry standards. Testing solutions are scalable from prototype work to series production and are intended to provide component-level transparency and repeatable process control. Werner Lieb GmbH provides automated handling for encapsulated chips, ceramic plates or substrates with mounted dies, open modules, PCBs, metal carriers, trays, workpiece carriers and finished modules. Multi-part handling can move several components simultaneously to increase throughput and reduce downtime. Optical alignment uses high-resolution image processing and adaptive calibration, while controlled flipping and rotation are designed to limit shock and vibration on sensitive components. Loading and unloading can include integrated DMC or ID reading so handled components remain traceable. Central handling platforms can combine 6-axis robots with Bernoulli end effectors, edge-belt conveyor systems, customized vacuum chucks and 3-axis linear units. The handling concept emphasizes precise low-contact motion, adaptability to different substrate formats, parallel handling, integrated ID reading and mapping, and integration with wet-handling processes. Werner Lieb GmbH offers wet-handling systems for sensitive wafers, glass substrates and other sensitive materials that require controlled and gentle movement in wet-process environments. Wet-process handling is designed for precise positioning, reduced breakage and contamination risk, and integration into existing process lines and automation systems. Drying functions use energy-optimized methods for fast, uniform drying and shorter cycle times and can be combined with inline processes. Vacuum handling with integrated water separation supports wet components and substrates while protecting system components and maintaining operation. DI-water functions include recovery and reuse of ultrapure water, while filtration and real-time conductivity measurement support process-fluid purity and stable process conditions. Werner Lieb GmbH also develops customer-specific wet cleaning, coating and etching processes, with scalable solutions from prototype manufacture to series production and integration into existing manufacturing environments. Werner Lieb GmbH provides MES integration that connects ERP and MES systems with the shop floor for continuous data flows, real-time visibility and data-based production decisions. Live acquisition of machine data and process parameters is used to detect deviations early, while automated feedback and analysis link planning with production to reduce downtime and improve material flow. Traceability can be maintained at batch, lot or individual-part level, with documentation intended to support quality, regulatory and customer requirements. MES interfaces are modular and scalable and can integrate with SAP, Oracle, Microsoft Dynamics or proprietary systems as well as existing machine environments. The MES concept supports end-to-end production digitization, real-time monitoring, rapid response to malfunctions or bottlenecks, continuous data analysis and expansion to new requirements or locations. For semiconductor manufacturing, Werner Lieb GmbH offers a standardized SECS/GEM interface for communication between manufacturing equipment and higher-level MES control systems, including equipment used for etching, coating or cleaning. The SECS/GEM interface is based on established SEMI standards and exchanges machine status, process data and control commands between equipment and host systems for centralized control and monitoring. A GEM Interface Reference Manual covers SECS-II messages, state models and status variables, and the interface supports automated machine-to-MES data transfer, remote system control, standard-compliant documentation and manufacturer-independent communication. Werner Lieb GmbH offers automated loading and unloading systems for substrates, PCBs, components and modules, including Tray Loader and WPC Loader configurations for integration into production equipment. The Tray Loader supports fully automatic tray loading and unloading, direct reading of tray IDs and workpiece DMCs, real-time presence checks, visibility of loaded and processed units, integration through conveyors or robots, and buffering of empty trays. Tray Loader specifications include automatic mapping of tray-stack height and position, automatic correction of positional offsets up to ±12 mm, an ISO Class 7 cleanroom-compatible design, a maximum tray size of 600 × 400 mm (L × W), and high-precision position detection for robotic handling. Tray Loader performance data state a tray change time of 15 sec. and workpiece loading or unloading time of 5 sec. The WPC Loader handles workpiece carriers directly from customer-specific transport trolleys and can use up to two loading or unloading stations, ID scanning, multiple trolley configurations, and compatibility with common systems and process modules. WPC Loader functions include DMC-based recipe selection, compact design, automatic width adjustment, carrier sizes from 500 × 120 mm to 500 × 180 mm (L × W), and stated performance of 15–20 seconds per carrier. The loading and unloading portfolio is described as modular and Industry 4.0 ready, with data connectivity, full traceability, MES or ERP interfaces, cleanroom operation up to ISO class 7, and use in both series production and high-mix or low-volume environments. Werner Lieb GmbH develops and manufactures special machines tailored to the customer product and production process. Special-machine functions can include transport, ID recognition, optical alignment, surface conditioning and coding. The company identifies development and production of special machinery for process automation as a core competence. Werner Lieb GmbH has experience with operating conditions in semiconductor manufacturing, high-power-electronics production, automotive and life science. For processes outside its named market groups, Werner Lieb GmbH works with customers to develop an automation solution for the process to be automated. Werner Lieb GmbH continues customer support after machine installation by training users in system operation and assisting with maintenance and troubleshooting. Scheduled service can be planned with the customer as an on-site service or maintenance visit. Werner Lieb GmbH can prepare an individual maintenance contract for the installed equipment. Possible scheduled-service work includes trailing measurement in accordance with DIN EN 13855, maintenance, and replacement of spare and wear parts. For unplanned malfunctions, support options include telephone support, remote support and on-site support with the aim of restoring continuous production. LIEB products are supplied with a detailed parts list identifying wear parts (V) and spare parts (E).
Capabilities and products
- automated integration of wafer handling and process modules
- customized wafer equipment front end modules (EFEM)
- wafer SMIF load ports with RSP200 interfaces and 100 µm wafer mapping
- reticle SMIF load ports supporting RSP200 and EUV mask pods
- panel load ports
- customized wafer end effectors using vacuum, clamping, or gravity
- wafer end effector changers
- in-machine end effector parking stations
- wafer and substrate prealigners
- EFEM spin-dryer module integration
- automated assembly systems for electronic assemblies
- automated production-line integration for power electronics modules
- automatic feeding systems for connectors and electronic components
- automated screw-fastening systems for electronic assemblies
- automated riveting systems for electronic assemblies
- press-fit assembly systems for electronic assemblies
- precision dispensing systems for liquids of varying viscosities
- adhesive assembly technology integration for electronic assemblies
- potting technology integration for electronic assemblies
- snap-fit automated assembly technology integration
- welding process integration for electronic assemblies
- protective molding process integration for electronic assemblies
- pick-and-place assembly technology integration for power modules
- automatic loaders for DBC substrates of various sizes
- plasma cleaning and surface activation systems
- laser surface cleaning systems
- thermal surface modification process integration for substrates
- ionized-air particle cleaning systems
- ultrapure-water and liquid rinsing process integration
- integration of nitrogen-purged process environments
- drying systems for electronic assemblies
- laser marking systems for housings, PCBs, and electronic components
- automatic labeling systems for DMC, barcodes, and RFID
- printing systems for housings, trays, and electronic assemblies
- in-circuit test system integration for electronic assemblies
- functional test system integration for electronic assemblies
- high-voltage test system integration for electronic assemblies
- AOI automated optical inspection and industrial image processing systems
- temperature, humidity, and shock test system integration for electronic assemblies
- production-line document and label handling integration
- automated palletizing systems for electronic products
- automated repackaging systems for electronic products
- production database storage and data transfer integration
- automated sensor production systems
- automated control-unit production systems
- X-ray internal-structure inspection integration for power modules
- insulation test system integration for power modules
- real-time process monitoring for power-module assembly
- packaging-line integration with warehouse and shipping logistics
- dimensional and material mechanical-stability test systems for electronic assemblies
- force-displacement monitoring systems for bonding and assembly
- hermeticity and leak test systems for electronic assemblies
- machine enclosure design and manufacturing
- automation system assembly and commissioning
- PLC programming and equipment interface integration
- internal equipment waste-heat recovery and reuse
- automated handling systems for encapsulated chips and electronic modules
- automated handling of ceramic substrates with mounted dies
- automated PCB handling systems
- simultaneous multi-component handling systems
- optical alignment and positioning systems for substrates and components
- substrate flipping systems with impact protection
- six-axis Bernoulli non-contact substrate handling robot integration
- edge belt conveyor systems
- customized vacuum chucks
- three-axis linear handling units
- wet handling systems for wafers and glass substrates
- wet vacuum handling with water separation
- DI water recycling and treatment systems
- precision filtration systems for process fluids
- real-time conductivity monitoring of process fluids
- customized wet cleaning process development
- customized wet coating process development
- customized wet etching process development
- automated packaging systems for electronic assemblies using blister packs, cartons, trays, and boxes
- MES/ERP integration with production equipment
- batch, lot, and individual-part traceability systems
- real-time data acquisition for production equipment and process parameters
- SECS/GEM communication interface integration for semiconductor equipment
- automatic tray loading and unloading systems for trays up to 600 × 400 mm
- automatic workpiece-carrier loading and unloading systems for transport trolleys
- workpiece-carrier transport trolleys
- semiconductor mechanical assembly in ISO 6/7 cleanrooms
- electromechanical system assembly in cleanrooms
- precision-component adjustment and calibration under laminar flow
- double-layer cleanroom packaging for components
- vacuum packaging for components
- protective-gas packaging for components
- manual particle cleaning of components
- ultrasonic cleaning of components
- ESD electrostatic measurement of components
- antistatic packaging for components
- metal part machining
- carbon-material part machining
- on-site automation equipment maintenance and spare/wear-part replacement
- remote troubleshooting support for automation equipment
- automation equipment operator training
- equipment stopping-time measurement to DIN EN 13855