At a glance
| Booth | J3353 |
| Country | TW |
| Website | www.waferworks.com/en |
Company profile
Wafer Works Corporation was established in 1997 and presents itself as a customer-centered solution provider of semiconductor materials. The company is a Taiwan-headquartered supplier focused on research, development, manufacturing, and sales of silicon wafers and related semiconductor materials. Wafer Works Corporation describes itself as a globally recognized supplier of semiconductor silicon wafers dedicated to providing high-quality products and services to customers around the world. The company's primary business is semiconductor substrate materials, especially silicon wafers, rather than downstream device fabrication. The company combines materials expertise with integrated technology extending from crystal growth through epitaxial deposition so that products can be matched to device requirements and customer applications. Its expansion in 12-inch, 300 mm wafer capacity includes investment through the Erlin plant, where the first crystal ingot was reported in 2026. Across its technology-development activities, Wafer Works Corporation emphasizes self-developed capabilities and faster wafer-dimension development to shorten research and innovation cycles and reach target markets efficiently.
Exhibits
Wafer Works Corporation supplies 12-inch and smaller polished wafers, epitaxial wafers, double-side polished wafers, lapped wafers, etched wafers, ultra-thick wafers, ultra-thin wafers, and SOI wafers with a range of doping choices. The company also provides customized wafer service and matches materials and production technology to the requirements of different devices and end applications. For 8-inch products, its product layout is organized by component and application category, and the company states that a similar layout is available for wafers of other sizes. For specific applications, polished wafers are available from ultra-low to ultra-high resistivity, with N-type or P-type epitaxy and SOI options for devices such as MEMS, power MOSFETs, and PMICs. For power devices, the range uses low-resistivity or ultra-low-resistivity polished wafers with N-type or P-type epitaxy for power MOSFETs, BJTs, diodes, thyristors, IGBTs, CoolMOS, superjunction devices, and related components. For imaging applications, low-resistivity polished wafers with N-type or P-type epitaxy are offered for image sensors and CIS devices. For analog applications, lightly doped polished wafers with N-type or P-type epitaxy support devices such as LED drivers and PMICs. For logic applications, lightly doped polished wafers with N-type or P-type epitaxy are directed to standard logic ICs and ASICs. For RF applications, the portfolio includes ultra-high-resistivity polished wafers, N-type or P-type epitaxy, SOI options, and polished wafers prepared for GaN epitaxy. The company's technology platform spans crystal growth, wafer processing, and epitaxial technology, reflecting its integrated capability from crystal-growth stages through epitaxial deposition. Crystal-growth capabilities include thermal-field design, control-system design, crystal-growth simulation, ultra-low-resistivity growth with high doping, ultra-low-defect growth with light doping, high-resistivity low-oxygen growth, and multi-element doping. Wafer-processing technologies include wafer-stress control, double-sided polishing, wafer backside coating, heat treatment, and wafer bonding. Epitaxial technologies include multi-layer epitaxy, ultra-thick epitaxy, buried-layer epitaxy, and heterogeneous epitaxy. These capabilities allow Wafer Works Corporation to configure silicon-wafer materials for power, imaging, analog, logic, RF, MEMS, and other semiconductor-device requirements rather than offering a single undifferentiated wafer type. The product set therefore combines standard wafer categories, application-specific resistivity and doping choices, epitaxial and SOI options, GaN-ready polished wafers, and customized wafer service within one semiconductor-material platform.
Capabilities and products
- polished silicon wafers
- epitaxial wafers
- double-side polished wafers
- lapped wafers
- etched wafers
- ultra-thick and ultra-thin wafers
- SOI wafers