At a glance
| Booth | P6006 |
| Country | MY |
| Website | www.vitrox.com |
Company profile
Since its inception in 2000, ViTrox Technologies Sdn. Bhd. has designed and manufactured automated vision inspection equipment and system-on-chip embedded electronics devices for the semiconductor and electronics packaging industries. Its core product groups are Machine Vision System (MVS), Automated Board Inspection (ABI), and Integrated Industrial Embedded Solutions (IIES). The company serves semiconductor Outsourced Assembly and Test companies, printed circuit board manufacturers, electronics assembly companies, OEMs, ODMs, Electronics Manufacturing Services providers, and contract manufacturers around the world. In the company's corporate history, 24 June 2004 marks its conversion into a public limited company; it is listed on the Main Board of Bursa Malaysia under stock code 0097. It has received national and international recognitions and awards for product development, corporate performance, and human-resource development. Its customer base extends across Malaysia, Singapore, Indonesia, Thailand, Vietnam, the Philippines, Taiwan, China, Japan, Korea, India, Australia, Europe, Brazil, Mexico, and the USA, among other markets. The company works closely with customers to design, develop, and implement inspection solutions intended to improve product and process quality. Its machine-vision inspection systems have been installed worldwide by major semiconductor manufacturers, while its inspection portfolio also addresses electronics packaging and PCB production. The company's stated purpose is to contribute to the advancement of society and the wellbeing of humankind through compassionate innovation. It connects that purpose with sustainable growth and profitability while also emphasizing contribution back to society. The company defines compassionate innovation through love, care, empathy, and altruism, and links its research and development work to technological advancement and breakthroughs. Its stated vision is to be the world's most trusted technology company. The company says that this trust is intended to extend across customers, employees, suppliers, investors, and the community through the practice of its I.A.C.T.G core values. It further frames consistent delivery on commitments, integrity, and respect for stakeholders as the basis for credible and reliable long-term relationships. The company has worked with customers and partners including Think Technology Brazil, Leviton Jimenez, Tianjin Foxconn, Jabil Wuxi, Penang Automation Cluster (PAC), UWC, AFA Technologies, Ellenby Technologies, Flex Manaus, Coelmatic, Usina Spark, and Etron on inspection, digitalization, or manufacturing-support applications. Since 2015, the company and SMTo Engineering have developed a service partnership in Mexico; SMTo serves as an official representative, maintains offices and spare-parts hubs in Guadalajara, Chihuahua, and Monterrey, and together they have installed more than 700 ViTrox systems nationwide, including V510i AOI, V310i SPI, V810i AXI, and V9i ARV systems. Installation, training, technical evaluation, and after-sales support have been provided to customers including Think Technology Brazil, Leviton Jimenez, Coelmatic, Usina Spark, and Tianjin Foxconn. A Jabil Wuxi air-gap inspection project involved around four months of study, verification, travel support, and R&D effort, while PAC has collaborated with the company since early 2020 to use V-ONE for machine connectivity, visualization, analytics, and real-time production monitoring.
Exhibits
For back-end semiconductor inspection, the company supplies machine-vision systems for semiconductor ICs, including inspection of mark, lead, and package defects across packages such as MLP, QFP, BGA, SOT, and SC70. The semiconductor portfolio also includes customized true 3D lead inspection, sub-pixel accuracy measurement, 4-in-1 integrated inspection, and high-speed on-the-fly vision systems. For PCB and flex-circuit production, its AOI offering is designed to inspect different board sizes at micron level while supporting production efficiency and throughput. Its vision-handler offering targets surface, marking, and dimensional defect inspection, and the TH-1000 Tray Vision Handler combines handler integration, computing configurations, calibration functions, user-facing software and hardware features, and advanced vision inspection. The company also designs and manufactures AOI and AXI equipment for electronic manufacturing services and the communications industry, and it designs and manufactures I/O cards and motion controllers for automation and medical-industry applications. Its digital-service scope includes manufacturing digital-transformation capabilities built around IoT, analytics, AI, MES, and ERP. The Smart 3D Solder Paste Inspection System family is intended to verify solder-paste alignment and deposited amount during printing, with inspection for defects including insufficient or excessive paste, missing deposits, bridging, misalignment, deformation, and micro-bridges. The V310i SPI for Advanced Packaging and Microelectronics is optimized for micro-bumps, fine-pitch pads, and SiP or WLP assemblies, and it combines advanced vision with automated Gerber or CAD program generation that can reduce programming from 30 minutes to 1 minute. V310i measures solder heights down to 30 µm with 1-micron vertical resolution and uses a 25MP CoaXPress camera with a 4.5 µm telecentric lens for 2D and 3D inspection. V310i platform specifications include a maximum PCB size of 470 mm by 500 mm, PCB thickness from 0.2 mm to 4 mm, inspection speed of 7 to 15 cm² per second at 4.5 µm resolution, and Phase Shift Profilometry for 3D reconstruction. The V310i platform supports SECS/GEM, can be equipped with a HEPA filter for Cleanroom Class 1,000 (ISO 6), and is ready for SEMI S2/S8 compliance, with some platforms already certified to those standards. For SMT solder-paste inspection, the V310Ai Optimus 3D uses a 12MP CoaXPress imaging system at 15 µm resolution and reaches inspection speeds of up to 94 cm² per second. The Optimus 3D platform uses real-time 3D mesh mapping to compensate for PCB warpage and combines multiple projectors with Phase Shift Profilometry to reduce shadows and reflections in 3D solder-profile capture. Its inspection software supports paste and glue profiles, with a 3D construction range up to 450 µm for normal solder-paste applications and up to 2,500 µm for extended applications such as glue or epoxy inspection. The SPI platform also includes AI-based detection functions intended to distinguish foreign material from solder paste, reduce false calls, improve yield, and limit unnecessary material waste. Statistical process-control features include dynamic thresholds, automatic CPK monitoring and threshold adjustment, solder height, area, and volume control, real-time trend views, and alerts when CPk is below 1.33. For connected production, the SPI platform supports closed-loop M2M communication with printers and mounters, the Hermes Standard, and CFX-QPL integration, while related SPI and AOI platforms can share wear-and-tear spare parts because of their high parts similarity. Across SMT PCB assembly, the company provides an inspection ecosystem spanning Smart 3D SPI, Smart 3D AOI, Smart 3D AXI, Smart Robotic Optical System (ARV), and the V-ONE manufacturing platform for front-end and back-end production stages. Within that ecosystem, Smart 3D SPI is positioned for high-speed SMT assembly and precision semiconductor back-end inspection with closed-loop process control. Smart 3D AOI combines 3D optical inspection with AI functions for autonomous program creation, quality control, automatic fine-tuning, and automatic review. Smart 3D AXI applies AI to X-ray inspection of hidden solder joints and internal board defects; the QX1 model is specified at 2 µm resolution, while the Line Scan series adds a Dual Lane architecture for throughput. The ARV robotic optical system uses a 6-axis arm for multi-angle inspection up to 90 degrees and is intended for conformal-coating and final-assembly inspection. V-ONE provides production insights and image traceability across SMT inspection systems, and its ONE View function correlates SPI, AOI, and AXI information across stages of the PCBA inspection workflow. The same manufacturing-intelligence layer supports M2M connectivity, big-data analytics, and real-time monitoring so inspection data can be used for process analysis and optimization rather than remaining isolated at individual machines. For Smart 3D AOI, the V510Ai family covers back-end semiconductor, front-end PCBA SMT, dual-sided post-THT inspection, conformal coating, and final-assembly applications through configurations including Vision Pro, Optimus 3D, DST, and R. V510Ai programming functions include automatic parameter assignment based on IPC standards with up to 99% SMT component coverage, CAD-less recipe creation through component auto-detection, and AI-based checks that validate whether required inspection parameters have been assigned. Its AI auto-buyoff function reaches up to 95% judgment accuracy and up to 99% defect coverage, while the platform can reduce manual verification effort and use on-premise AI model training for future inspection needs. The V510Ai Vision Pro adds auxiliary SWIR vision for inspection beyond the visible spectrum and is designed to detect microcracks and sub-micron surface cracks below 1 µm against complex backgrounds. Vision Pro combines a 25MP primary CoaXPress vision system with a 5.2MP secondary SWIR system, offers secondary imaging down to 3.45 µm per pixel, and can be equipped with HEPA filtration for cleanroom operation. The V510Ai Optimus 3D uses a 12MP CoaXPress camera with a 15 µm telecentric lens, with optional 13 µm, 10 µm, and 8 µm optics, and uses 4-way projectors with 8-layer projection for 3D defect detection and shadow-reduced construction. Its AOI inspection functions include missing parts, offset, skew, polarity, billboard and tombstone conditions, lifted or bent leads, excess or insufficient solder, overturn, bridging, wrong-part marking, through-hole solderability and pin detection, coplanarity, foreign material, and polarity-dimple measurement. Additional AOI functions include side-angle analysis using SPECKLE Auto Mapping Technology, adaptive lighting, centralized performance monitoring, and tracking of metrics such as FPY, FPPM, and DPPM through an Intelligent Control Tower. For robotic and final inspection, the V9i Series Smart Robotic Optical System combines 6-axis robotics with multi-angle vision and an Ultraviolet-Red-Green-Blue lighting module for conformal-coating and assembly inspection. The robotic platform supports laser height measurement for components up to 100 mm tall, multi-focal vision with an adjustable focus range from 5 mm to 200 mm, and inspection angles up to 90 degrees. A modular configuration supports PCB sizes up to 840 mm by 620 mm, while the V510Ai R inline platform supports boards up to 600 mm by 510 mm, PCB thickness from 0.5 mm to 13 mm, and board weight up to 15 kg. The Integrated Industrial Embedded Solutions portfolio includes Industrial I/O, illumination solutions, motion-control solutions, and VisionXpert solutions alongside the inspection equipment. Industrial I/O is positioned for high-speed data acquisition with high-isolation protection, while the illumination portfolio combines engineered lighting modules with controllers for synchronized machine-vision imaging. The motion-control offering uses a DSP-based architecture with high-speed response and anti-resonance tuning for multi-axis control, and VisionXpert provides an integrated platform for rapid deployment and high-speed image analysis. The solder-paste inspection portfolio includes V310Ai Optimus 3D, V310Ai SPI XL, V310Ai SPI XXL, V310Ai SE Series, and the V310i platform for advanced packaging and microelectronics, allowing selection for different board sizes and semiconductor or SMT inspection requirements. For new-product introduction without stopping an inline machine, Network Offline Programming allows engineers to import CAD or Gerber formats, including Extended 274X and 274D, build and verify the inspection program on an offline PC, and perform a 60-second first-board validation when changing models. For fine-pitch bridge detection, the SPI software combines a Feature Extraction Module with 3D True Colour Paste Segmentation and Single Pad Bridge Auto-Masking to identify microscopic bridges below 35 µm while separating natural pad geometry. The AOI product range also includes V510Ai SE, V510Ai SE XXL, V510Ai XL, V510i XXL, V510i XLW, and V510Ai ST in addition to Vision Pro, Optimus 3D, DST, and R, covering different board formats and inspection stages. For advanced packaging, AOI inspection covers die presence, offset, coplanarity, chip-off or cracks, orientation, scratches, contamination, gold-pad or gold-finger surfaces, foreign material, coordinate measurement, and wire-bond conditions including missing, broken, shifted, off-pad, shorted, or wrong bonds. Integrated industrial options also include ViLIGHT light-source controllers, while VisionXpert is offered alongside industrial I/O, illumination, and motion-control solutions for embedded machine-vision deployments.
Capabilities and products
- semiconductor IC mark, lead, and package defect inspection
- true 3D lead inspection
- sub-pixel accuracy measurement
- 4-in-1 integrated vision inspection
- high-speed on-the-fly vision inspection
- micron-level AOI for PCB and flex circuits
- Vision Handler for surface, marking, and dimensional defects
- Smart 3D solder paste inspection (SPI)