UVAT Technology Co., Ltd.

At a glance

Company profile

UVAT Technology Co., Ltd. was founded in 2002 by specialists with years of vacuum-technology experience and works in the design and development of Physical Vapor Deposition (PVD) and dry etching technologies including ICP, RIE, Ion beam, and Micro wave. Its technical base includes PVD processes such as sputtering, evaporation, and sputter evaporation, CVD processes including PECVD, MOCVD, and ThermalCVD, and dry-etching equipment built around ICP, RIE, Ion beam, and Micro wave methods. The company continues to develop plasma technology and works with customers on new application fields, thin-film properties, process hardware, and new processes. Its service scope includes providing test samples, planning mass-production systems, EFEM design, automation design, modification of existing equipment, and functional improvement of equipment. UVAT maintains an after-service team, supplies sputtering equipment, and provides film-coating OEM services alongside equipment and process work. The company’s professional technologies serve fields including 5G communication, PCB, IC Substrate, Semiconductor, IC Package, Tablets NB, Smart, Automobile parts, and LED. Its broader industry coverage also includes 3C electronics, footwear, solar energy, optics, touch applications, biotechnology, automotive components, packaging, and other areas connected with coating and plasma processes. UVAT emphasizes long-term customer partnerships, helping customers improve process capability, cooperating on new processes, and using process capability and OEM service to support equipment orders, process outsourcing, and production-capacity adjustment. Based on its PVD work, UVAT has developed sputtering applications for solar panels and touch screens and offers customized process development and equipment manufacture. Its PVD application direction includes EMI film coating for cell phones and laptops, decorative coatings, touch screens, conductive films on ceramic heat-dissipating substrates for LED, and applications in biotechnology and medical supplies. Corporate-member information lists operations in Taichung and Taoyuan in Taiwan, Shenzhen and Chongqing in China, and Muar, Malaysia, with establishment years shown as 2002 for Taichung, 2002 for Taoyuan, 2004 for Shenzhen, 2011 for Chongqing, and 2024 for Muar. The listed activities include PVD equipment development and manufacture, equipment after service, PVD accessories, film-coating OEM, new PVD process and equipment development, optical and ITO coating, functional and exterior coating, LED heat-dissipating substrates, blood-glucose test strips, and regional PVD OEM work. UVAT received the 2025 9th Ministry of Economic Affairs National Industrial Innovation Award, while its Ti-Cu seed-layer sputtering machine received the 29th Taiwan Excellence Award. UVAT states that it is Taiwan’s largest company offering professional PVD OEM service and sets a goal of becoming a professional PVD manufacturer in Taiwan with a wider spectrum of products and services.

Exhibits

UVAT Technology Co., Ltd. supplies vacuum sputtering equipment, plasma equipment, dry etching equipment, and vacuum-coating OEM service, with capabilities that include a high-temperature degas intelligent loop system, low-temperature PVD intelligent monitoring system, Pre-clean system, Particle suppression system, Ti-Cu plasma coating, Ti-Cu coating-parameter optimization, plasma dry etching, vertical continuous plasma etching, Plasma Desmear, and Plasma Descum. Its equipment and OEM service also includes equipment sales support, joint development of new processes and equipment technologies with customers, assistance with production build-up and problem improvement, and customer service intended to address specific customer requirements. For advanced semiconductor packaging, the Ti-Cu Seed layer In line Vacuum Sputtering Equipment is an Inline Sputter system for UBM(Under Bump Metallurgy), RDL(Redistribution Layer), and Sputter Ti/Cu seed layer, with low-temperature sputtering, low output time/high capacity design, sidewall coverage, film adhesion, and an automatic carrier return system. The Non Plating Line uses an Inline Sputter system for Non Plating Line and Coreless Substrate applications, with stable and fast InLine production, low production cost and consumable use, uniformity and reproducibility, connection to automatic board handling, and an environmental process described as non-toxic and without wastewater. The High heat dissipation film_Nano silver sputtering system uses an Inline Sputter system with a multilayer metal structure, nano-silver alloy adhesion and heat-conduction effects, low-temperature sputtering, high-capacity design, sidewall coverage, film adhesion, and automatic carrier return. The Horizontal continuous EMI sputtering equipment applies an Inline Sputter system to SIP EMI and a thick-film process of >5um, combining high heat-dissipation technology, low-temperature sputtering, high-capacity design, sidewall coverage, film adhesion, automatic carrier return, and high coating quality. The Vertical Plasma Etch Equipment(Inline system) performs Plasma Via Desmear and Dry Film Descum and includes PCB-substrate warpage suppression, low-temperature processing, RF anisotropic etching to address hole expansion, even gas distribution, peripheral-substrate clamping, and graphics capability of L/S < 2um and Via < 30um. The Horizontal Plasma Etch Equipment covers Plasma Dry Etch for Dielectric Etch, Plasma Metal Etch, and Fine line Etch, plus Plasma Thin down for Plasma ABF Etching, Plasma EMC Etching, and Molding Compound Etching, together with Desmear, Descum, and Plasma Pre-treatment for Contact Angle and Wetting. That horizontal plasma platform is described with high-speed dry etching, high etching uniformity, modular low-cost and low-footprint design, applications in Panel Fan-Out FOPLP/FOWLP and high-end carrier boards, and compatibility with a semiconductor-grade EFEM configuration. The Vacuum Oven supports Vacuum Degas, Deep water vapor removal, Material Curing, Anti-oxidation, and Residual Gas Analyzer functions, with deep water and oxygen removal, multi-chip heating, high temperature uniformity, programmable temperature and time, residual water and oxygen detection, and customizable substrate size and piece count. Dry microplasma equipment performs Plasma dry etching(Desmear，Descum), surface modification, and roughening on PP, PMMA, ABF, Epoxy and substrates including Wafer, Si, Glass, PP, PMMA, and Cu, using a multi-piece, high-capacity, low-running-cost, modular design with no special gas demand and a substrate size of 21” x 24”. Metal plasma equipment and reactive plasma equipment cover plasma dry etching of Cu, Ti, Ta, Si, SiO2, Pd and polymers including PP, PR, PMMA, ABF, and Epoxy on Wafer, Si, Glass, PP, PMMA, and Cu substrates, with high-speed etching, high cooling capacity, low substrate deformation, high-aspect-ratio etching, modular customization, and substrate sizes of 4”, 6”, 8”,16” x 20”, and 20” x 24”. The surface modification, surface cleaning, and roughening application uses plasma dry etching on the same listed metal and polymer materials and substrates, with high-speed processing, high cooling capacity, low substrate deformation, high-aspect-ratio etching, high capacity, low running cost, and modular customization. Silicon Wafer Etching Plasma and Reactive Ion Etching Plasma use an RIE process for Si, SiO2, and Si₃N₄ on Wafer, Si, and Glass, with O2、Ar、N₂、CF₄、SF₆、CHF₃ listed as process gases. The silicon-wafer plasma equipment is specified for 8” and 12” wafers and combines high-speed dry etching, high cooling capacity, low substrate deformation, high-aspect-ratio etching with low side etching, high capacity, low running cost, and modular customization. For optical applications, the APOLLO OPTICS & REFLECTION vacuum magnetron coating system is designed for NCVM bright silver film, brightness-enhancement film, and multilayer film on glass, ceramics, composite board, explosion-proof membrane, and PC injection transparent casing for mobile-phone back-cover color effects. The APOLLO system lists NCVM bright silver throughput of 20K Pieces per day, multi-target material-film adjustment, uniformity, easy operation and maintenance, reduced operating manpower, small land area, low running cost, and optional automation; a related vertical inline sputtering system serves handheld devices, vehicle displays, smart-home displays, photography systems, and optical instruments with AR, Color Filter, and AF films. The ATLAS high-vacuum sputtering system uses continuous independent process chambers to deposit metal films on quartz substrates for electrode layers and etch-stop layers, with multi-piece Wafer Level or Panel Level carriers, low-temperature deposition, uniformity, low film stress, and low Particle performance. ATLAS lists Au-200nm film completion every 10 minutes, a load of 4” 8pcs or 100*100mm quartz 8pcs, 200nm deposition below 50℃, uniformity of < ±3% after instrument-error deduction, dimensions W3.5m*L8m*H2.5m, EFEM System loading and unloading, and optional SECS/GEM software. The Car Wheel Product Line coats automobile aluminum-alloy wheels together with a powder process to create a metallic mirror appearance as a process replacing polluting electroplating, and is intended for OEM and mass-production wheel coating with wheel size Φ23”~Φ18” J：~12”, machine size L 10.5M x W 2.5M x H 2.6M, and throughput 2pcs / 1min；(1pcs/2min). That mass-production wheel system uses a multi-chamber batch configuration, can operate as a continuous mass-production system, provides an Industry 4.0 compliant automation link with robotic-arm connection points, and supports factory-compliant traceability. The Car Wheel RD & AM tool is intended for R&D, small-quantity production, and modified-wheel coating, with wheel size Φ23”~Φ18” J：~12”, machine size L 3.5M x W 2.5M x H 2.6M, throughput 1pcs / 10min, a single or multi-chamber batch system, expansion to continuous mass production, One Start coating, and parameters that can transfer to mass-production machines. Rear-view mirror coating covers Automobile / Motorcycle / Truck / Aviation / Medical / Construction applications and Chrome Mirror Coating, Aluminum Mirror Coating, and Blue Mirror Coating, with a multi-chamber continuous system, automated loading and unloading, adjustable reflectivity and transmittance, throughput < 50s/tray, curvature 300~1450, and whole-plant equipment for baking, cutting, chamfering, and cleaning. Other metal-process equipment lists size L 1200mm x W 10mm, machine size L 6M x W 6M x H 3.5M, and throughput 40 min per batch, while plastic-process equipment lists size L 650mm x W 450mm, machine size L 9M x W 2.5M x H 2M, throughput 1 min per tray, and suitability for 2D products. A further listed configuration for 3D products uses size L 1200mm x W 10mm, machine size L 6M x W 6M x H 3.5M, and throughput 40 min per batch. For passive components, vacuum coating precisely controls continuous-film thickness on the target object for thin-film resistive, capacitive, inductive, tantalum-component, protection-component, high- and low-resistance-film, temperature-and-humidity-resistant barrier-film, and automotive anti-sulfuration-film applications. The passive-component equipment uses a multi-chamber continuous system with automated loading and unloading, optional high- and low-temperature vacuum heating, optional plasma cleaning, Face to Face high-uniformity dense coating, factory-compliant traceability, and a high-vacuum fast-regeneration system of less than 40min to increase productivity. In LED applications, Aluminum Nitride film is presented for increased brightness, reduced GaN growth time, and a wider epitaxial-process range with improved yield; UVAT lists high-vacuum technique, ALN coating OEM, and quality monitoring with d.n.k, α-STEP, XRD, AFM, Spectroscope, and force measurement. One Flip Chip Ag configuration has coverage size 420mm x 650mm, plant size L 3.5M x W 2.2M x H 2.3M, capacity 2” 300K/Mon based on 24hr/26Day, 2”, 4”, 6” fixture production, ultra-low-temperature high-speed film formation, Lowdamage Ag composite layers, small Grain with high reflectivity, magnetic-fluid transmission, oil-free design, and quick target change. Another Flip Chip Ag configuration has coverage size 420mm x 650mm, plant size L 4.8M x W 2.3M x H 1.85M, capacity 2” 45K/Mon and 4” 10K/Mon based on 24hr/26Day, with ultra-low-temperature high-speed film formation, Lowdamage Ag and ultra-dense Ag composite layers, magnetic-fluid transmission, oil-free design, and quick target change. The ITO equipment has coverage size 350mm x 350mm and plant size L 4.2M x W 2.5M x H 2.4M, with Kioth-I100 capacity 2” 116K/Mon and Kioth-I200 capacity 2” 230K/Mon based on 24hr/26Day, plus automatic-flip MMC Cathode, small-Grain sputter control, dense high-penetration ITO film, Multi ITO structure, Super Low Damage and Low Damage cathodes, magnetic-fluid transmission, and oil-free design. The ODR Ag reflect layer system has coverage size 300mm x 300mm, plant size L 4.8M x W 1.8M, UHS-20503C4 capacity 2” 78K/Mon based on 22hr/26Day, 2”, 4”, 6” fixture compatibility, continuous sputtering, a lift-up chamber door, automatic reflux and automation integration, stable film uniformity, Ag film reflectivity >91%, and Ag Reflect film-stack design. The Metal (Multilayer) system has coverage size 250mm x 250mm x 10 side, plant size L 3.5M x W 2.2M x H 2.6M, UFE-11005P2 capacity 2” 63K/Mon based on 24hr/26Day, 2”, 4”, 6” fixture compatibility, multilayer and thick-film design, a Low Damage Magnetron Sputtering System, extremely thin-film deposition, low-temperature film formation with process-temperature monitoring, modular maintenance, automated loading and unloading, and multilayer metal-film thrust >50g. Equipment customer service includes regular maintenance and servicing, domestic and international on-demand repair service, 24H customer support, vacuum-component maintenance and purchase/sale service, production-target-material sales in various materials and specifications, UVAT equipment upgrades and process adjustment, and modification, moving, or function addition for non-UVAT equipment. Appearance-coating OEM services include SDC sputtered surface treatment for metallic gloss on products such as cell phones and laptops, and NCVM/NMVM decorative coating for wireless-product exteriors that is intended not to interfere with radio-signal transmission and can be used on cell-phone panels and touch home-appliance panels. The appearance-coating range also includes color coating produced through different sputtering processes and optical coating made by stacking dielectric films to combine color and transmission and create reflective tones and colors not produced by ordinary metal coating or traditional ink printing. Functional-film OEM service includes EMI Coating in which a sputter-deposited metal film inside a plastic shell provides electromagnetic shielding for products such as cell phones, laptops, microchip packaging, GPS devices, MEMS, film antennas, and radio devices. AR Coating uses optical interference and multiple film layers on transparent materials such as glass, PET, and PC to increase transmission, reduce reflection, and enhance images for lenses, display panels, and cell-phone screens. AF/AS Coating is used on glass, PET, PC and other transparent materials for products such as lens covers, touch screens, and cell-phone screens, with a listed glass contact angle of 40~50o before coating and >110o after coating. For IC carrier (PBGA) applications, vacuum sputtering forms conductive film on the substrate surface and inside pores to complete circuits with associated processes, for high-density conductor designs without electroplating in PBGA/CSP/FCCSP carriers. For heat-dissipating substrates, conductive film is sputtered onto non-conductive insulation or ceramic material and combined with related processes to form circuits for high power/high wattage LED and Solar aluminum or ceramic heat-dissipating substrates; the same functional-coating range also includes LED reflective coating, barrier layers, and mirror-based 3D projection applications. In touch applications, general high-temperature ITO provides optical transparency and low electrical resistance, while low-etch-mark low-temperature ITO combines high optical penetration with low resistance and leaves nearly no visible etching marks after ITO circuit etching. For ITO touch-module circuits, UVAT sputters a metal circuit layer on ITO film (glass) and combines it with photolithography to produce circuits < 10um, with thin thickness, fine lines, low resistance, and high acceptable yield compared with traditional printed-circuit limitations. For biotechnology, vacuum coating is applied to biosensors to improve the low acceptable yield and unstable electrical characteristics associated with traditional printing, providing greater stability and sensitivity; the process combines biomedical and engineering technologies and has been clinically proven for multiple biotechnology products. UVAT’s sputtering process uses plasma ion bombardment to knock atoms from a target; the ejected atoms reach the substrate and form a thin film through adhesion, adsorption, surface migration, and nucleation. In the stated sputtering principle, Argon gas enters an enclosed vacuum chamber and high voltage ionizes it into Ar+; the ions accelerate to the cathode and bombard the target, target atoms move to the substrate to form film, and secondary electrons contribute to further argon ionization. Magnetron sputtering adds a magnetron device at the cathode so electrons move in a spiral path, increasing electron-gas collisions and gas ionization, creating more ions to bombard the target and thereby increasing the coating rate. Plasma is described as a partially ionized gas of ions, electrons, molecules, and atomic groups generated by high voltage at low pressure of l00mTorr~a few mTorr; the ion-electron chain reaction produces plasma that remains electrically neutral because it contains positive ions, negative electrons, and neutral atoms. Dry etching is plasma etching rather than wet etching and is divided into physical etching through Sputter Etching or Ion Beam Etching, chemical Plasma Etching, and combined physical-chemical Reactive Ion Etching (RIE); UVAT also lists PVD production flows for injection products and glass products, coating categories including decoration, reflective, functional, EMI, optical, conductive, T.C.O, Anti Finger, Anti-smudge, and NCVM films, and applicable metal and non-metal materials including Al, Cu, Sus, PC, PET, PMMA, PI, Nylon, FR4, PPO, PPS, PPA, Glass, Wafer, LCP, PU, TPU, TPE, ABS, ABS＋PC, and PMMA＋PC.

Capabilities and products

• development of PVD evaporation and combined evaporation-sputtering equipment
• PECVD equipment development
• MOCVD equipment development
• thermal CVD equipment development
• ICP dry etching equipment development
• thin-film process development, sampling and mass-production system planning
• Mo/Al/Mo coating
• LED DBR coating
• waterproof coatings for LEDs
• copper-nickel-gold bump processing
• antistatic coating
• anti-fog coating
• inline sputtering equipment for UBM/RDL titanium-copper seed layers
• sputtering equipment for NPL and coreless-substrate build-up
• nano-silver heat-dissipation film sputtering
• continuous EMI sputtering equipment for SiP metal shielding
• plasma desmear and descum equipment
• plasma etching equipment for dielectrics, metals and fine lines
• plasma thinning of ABF, EMC and molding compounds
• vacuum ovens for degassing, curing and oxidation prevention
• plasma surface modification, cleaning and roughening equipment
• RIE etching equipment for 8/12-inch silicon wafers
• sputtering equipment for electrode and barrier layers on quartz substrates
• vacuum coating equipment for automotive wheels
• rear-view mirror coating equipment and turnkey plant supply
• contract aluminum nitride coating for LEDs
• silver reflective-layer sputtering equipment for LED flip-chip and ODR applications
• multilayer metal-film sputtering equipment for LEDs
• vacuum coating equipment maintenance and breakdown repair
• vacuum component supply and repair
• coating target supply
• vacuum equipment upgrades and process adjustment
• decorative metal and colored optical coatings
• NCVM/NMVM nonconductive metallization
• electromagnetic interference shielding EMI coating
• antireflection AR optical coating
• conductive coatings for ceramic and insulating heat-dissipation substrates
• high-reflectivity metal coating for LED reflectors
• interfacial barrier-layer coating
• reflector applications for 3D projection
• high-temperature and low-etch-mark low-temperature ITO coatings
• fabrication of metal traces below 10um for touch modules
• contract vacuum coating for biosensors
• semiconductor equipment front-end module EFEM design
• anti-fingerprint and anti-smudge AF/AS coatings
• copper coating processes for PBGA substrates
• magnetron sputtering equipment for mobile-phone back-cover NCVM and multilayer films
• optical-film sputtering equipment for AR, color filters and AF
• vacuum coating equipment for thin-film resistors, capacitors and inductors
• heat- and humidity-resistant water-barrier films
• ion-beam dry etching equipment development
• microwave dry etching equipment development
• automotive anti-sulfuration films
• particle suppression systems for coating processes

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