At a glance
| Booth | N1170 |
| Country | TW |
| Website | www.utechzone.com.tw |
Company profile
Utechzone Co., Ltd., established in 1992, supports PCB, semiconductor, and display manufacturers under the core spirit “We Serve with Vision” and has spent more than three decades developing Automatic Optical Inspection systems based on Machine Vision. The company says its AOI systems are intended to replace traditional human inspection, using machine vision to reduce subjectivity and fatigue while achieving high precision and efficiency. Utechzone integrates optics, image-processing algorithms, automation, mechanics, and motion control, and its AOI definition groups the system into optic sensors, software, mechanisms, and electronic control. The optic-sensor layer includes CCD cameras, lenses, and lighting; the software layer includes algorithms, communication, and image processing; the mechanism layer includes robotic arms, mechanical design, and motion interfaces; and the electronic-control layer includes PLC and control PCs. Its stated AOI applications include quality control, scientific inspection, and safety checks, while the company's customer focus covers PCB, semiconductor, and display manufacturing. Utechzone says customized skills and experienced staff support its goal of high quality and efficiency at reasonable cost, and that years of Automated Optical Inspection research enabled it to expand service into semiconductor inspection. The product structure reflects that expansion through PCB inspection equipment, IC-substrate inspection equipment, roll-to-roll inspection equipment, LCD and LCM automatic optical inspection equipment, OLED and TP automatic optical inspection equipment, semiconductor automatic optical inspection equipment, COF inspection equipment, and other inspection equipment. Within semiconductor inspection, the company lists automatic optical inspection for 8”~12” wafers with white-light OM, fluorescence OM, film-thickness measurement, stress and residual analysis, CESA (coating edge status analysis), and optional bevel inspection.
Exhibits
For flexible, rigid, and rigid-flex boards, Utechzone Co., Ltd. provides automatic appearance-inspection equipment that combines an exclusive high-resolution lighting configuration with a smooth mechanical design and can rapidly perform both single-sided and double-sided appearance inspection. The same board-inspection equipment combines high inspection quality with high output speed and applies to circuit boards of various sizes. For PCB and HDI-board appearance inspection, Utechzone combines AI automatic defect classification, review, and hot-spot analysis with a smooth infeed-mechanism design and describes the resulting system as a high-stability, high-inspection-rate automatic appearance-inspection machine. Its HDI circuit-inspection machine is designed specifically for HDI boards, states a finest inspection capability of 20um, uses a large-stage mechanical design, and pairs that stage with system online-inspection settings to increase inspection capacity. The multifunction inspection-and-measurement system combines 3D measurement, short-distance measurement, and expansion/shrinkage measurement in one machine, and also provides AI automatic defect classification and review. For appearance inspection, that multifunction system states a minimum inspection capability of 15um and is presented as a cost-effective inspection and measurement machine. The broader product catalog covers PCB inspection, IC-substrate inspection, roll-to-roll inspection, LCD and LCM AOI, OLED and TP AOI, semiconductor AOI, COF inspection, and other inspection equipment, allowing inspection technology to address multiple substrate, display, and semiconductor formats named by the company. For semiconductor wafers, Utechzone lists inspection of 8”~12” wafers with white-light OM and fluorescence OM functions, adding optical modalities specifically identified for wafer inspection. The same semiconductor inspection equipment includes film-thickness measurement, stress and residual analysis, CESA (coating edge status analysis), and optional bevel inspection, extending the wafer platform beyond surface imaging into the listed measurement and analysis functions. Across these systems, Utechzone's Machine Vision approach combines optical sensing, algorithms and image processing, automation, mechanical design, motion control, and electronic control, while the exhibit-level functions add AI-assisted defect handling, high-resolution illumination, online inspection settings, and multiple measurement modes for PCB, HDI, display-related, and semiconductor inspection environments.
Capabilities and products
- PCB automatic optical inspection equipment
- IC-substrate inspection equipment
- roll-to-roll inspection equipment
- LCD/LCM automatic optical inspection equipment
- OLED/TP automatic optical inspection equipment
- semiconductor automatic optical inspection equipment
- COF inspection equipment
- 20um HDI circuit inspection
- 3D/short-distance/expansion-shrinkage combined measurement
- 8”~12” wafer white-light and fluorescence OM inspection
- wafer film-thickness measurement
- wafer stress and residual analysis
- wafer coating edge status analysis (CESA)
- wafer bevel inspection