At a glance
| Booth | P5206 |
| Country | TW |
| Website | www.ulvac.com.tw |
Company profile
With a history of 70 years, ULVAC Group applies vacuum technology across a broad range of fields and provides equipment, components, materials, analytical instruments, and customer solutions while pursuing new possibilities for vacuum technologies. The group emphasizes synergy and innovation across its organization together with rapid response to changing needs as part of its approach to creating new applications for vacuum technology. 優貝克科技股份有限公司 was formally renamed from 台灣日真 in January 2002, with the stated goal of providing comprehensive solutions and improving customer satisfaction. ULVAC Taiwan Inc. combines technology development from its Japanese parent group with operations in Taiwan and introduces technology and equipment for major fields including semiconductors, displays, LEDs, and solar cells. The company also describes management innovation, international industrial-supply-chain integration, and comprehensive solutions for the development of industries and scientific fields as part of its operating direction. Its semiconductor manufacturing-equipment business is positioned as a business that ULVAC intends to develop into a pillar while pursuing global expansion, alongside optical coating and continued equipment manufacturing and R&D for process requirements. Service support is organized around the same goal of providing comprehensive solutions and raising customer satisfaction. ULVAC received the Excellent Production Support award at the 2025 TSMC Excellent Performance Award from Taiwan Semiconductor Manufacturing Company. Its company information also records the start of sales of automatic helium leak-detection and recovery equipment on May 20, 2024. Another recorded milestone states that ULVAC's lithium-metal anode production technology proposal was selected for a NEDO national project on November 22, 2022. ULVAC Taiwan Inc. also provides an online vacuum-degree calculation utility addressing common vacuum units and conversion between units. The company states that it has established five management policies in pursuit of becoming a top global production manufacturer.
Exhibits
ULVAC supports MEMS manufacturing technologies across applications ranging from microsensors to flow-channel modules, optical transistors, and bio-MEMS, backed by application experience in these areas. For thin-film deposition, PECVD is presented for films used in process components, including dense hard masks and dense protective films. ULVAC chemical vapor deposition equipment is designed for high-uniformity, high-rate film production and can control film properties including refractive index, stress, electrical properties, and wet-chemical etch rate. ULVAC PECVD uses a high-density plasma source and provides high-temperature and low-temperature deposition configurations according to process requirements. The equipment architecture ranges from compact to large layouts and, depending on the model, can support 2inch~12inch wafers or square substrates. The semiconductor product area also lists Asher, CVD, Etcher, Evaporator (PVD), and Sputter equipment categories. Named equipment models include the ULDiS optical-film sputtering system, the CEH centrifugal thin-film vacuum distillation system for oily-solution distillation, and the SME-200 Multi-Chamber Sputtering System. The listed range further includes the CMD single-wafer plasma CVD system, EWA roll-to-roll vacuum evaporation equipment, and SCH planar Sputter inline coating equipment. Additional sputtering equipment includes SMV-500F/SMV-650 systems, the CS-L compact R&D experimental Sputtering system, and Batch type SX batch Sputtering equipment. Other named equipment includes the SOPHI-400 high-energy ion implantation system, a Batch vacuum heat-treatment furnace, and EWE & ULFARAD vacuum evaporation equipment. Together, the MEMS, PECVD, sputtering, evaporation, ion-implantation, and heat-treatment offerings place ULVAC Taiwan Inc. across multiple semiconductor process-equipment requirements rather than a single process step.
Capabilities and products
- MEMS manufacturing technologies and equipment
- 2inch–12inch PECVD deposition equipment
- asher equipment
- semiconductor etching equipment
- PVD evaporation equipment
- sputtering equipment
- multi-chamber sputtering systems
- roll-to-roll vacuum evaporation equipment
- high-energy ion implantation equipment
- batch vacuum heat-treatment furnace
- automatic helium leak-detection and recovery equipment