At a glance
| Booth | I3305 |
| Country | JP |
| Website | www.ueno-seiki.co.jp |
Company profile
Ueno Seiki Co., Ltd. has supported the semiconductor industry since its founding in March 1972 through an integrated system covering development, design, manufacturing, sales, and maintenance of semiconductor manufacturing equipment. The company states that attractive products, satisfactory service, and a support system that gives customers confidence are three elements it continually works to improve, with organizational and individual goals directed toward innovation. Its business is the development, manufacture, and sale of electronic-component and semiconductor manufacturing equipment, and its stated customer base includes major electronic-component and semiconductor manufacturers in Japan, East Asia, Southeast Asia, Europe, and the United States. Company information lists capital of 2,300万円, sales of 128億円, and 240 employees. Its group and overseas network includes operations in Japan, China, Hong Kong, Taiwan, Malaysia, Thailand, the Philippines, and Singapore, supporting customers across multiple semiconductor-manufacturing regions. A new company building was completed in spring 2019, with the company linking the facility to customer-oriented equipment development, adaptation to industry change, future work styles, and a comfortable working environment for employees. Ueno Seiki Co., Ltd. also describes a one-stop production system in which sales, planning and development, design, parts machining, manufacturing and assembly, shipment, and maintenance are performed through closely coordinated in-house functions. The company develops optical design and image-processing algorithms for visual inspection in-house, combines mechanical, electrical, and software engineering in equipment design, machines important parts internally, and provides post-installation technical support through its service organization.
Exhibits
Ueno Seiki Co., Ltd. provides die sorters and test handlers that perform visual inspection and electrical-characteristic testing of semiconductor and electronic components, accurately classify good and defective parts, and integrate downstream laser marking and taping. Its transport technology is stated to move 17 semiconductor or electronic components per second, providing the processing speed required for high-volume production lines. A patented damage-free control technology enables ultra-high-speed transport without damaging the semiconductor or electronic components being inspected. The company's internally developed visual-inspection equipment is stated to detect cracks of 10 µm or less, while its broader inspection portfolio includes micron-level and sub-micron inspection capabilities. The current product scope includes a new Test Handler with further-developed high-speed and load-control technologies, High-speed Discrete Tester and Power Tester products intended to maximize handler performance, high-speed Vision Inspection Equipment using the company's vision technology, and Chip-on-board equipment. Across the die-sorter product family, diced wafers can be picked from dicing sheets, inspected on six sides, and stored in carrier tape, with options that add electrical-characteristic testing, laser marking, infrared transmission inspection, and 3D measurement. The die-sorter platform is stated to reach up to 70,000UPH, combining high-speed handling with a small footprint for high area productivity. RV36-NEO / RV16-NEO are identified as the fastest wafer-die-sorter models, automatically loading diced wafer frames for visual inspection and taping, and delivering their highest performance for chip sizes below 1mm. For RV36-NEO / RV16-NEO, stated productivity is 70,000UPH; supply formats are 6, 8, and 12 inch wafer frames; storage uses 8mm and 12mm carrier tape; and supported chip sizes range from 0.2mm to 5mm square. The same models list target packages and devices including WLCSP, panel-level packages, bare die, LED, compound semiconductors, QFN, DFN, MEMS, and filters, with options for electrical testing, defective-part classification, ARC, tape feeder, and 2DID reading. Their inspection options include six-side visual inspection for chipping, microcracks, sidewall cracks, and bumps, plus thickness inspection, in-pocket inspection, post-seal inspection, NIR and SWIR infrared inspection, 3D height inspection, bump-coplanarity inspection, color-camera inspection, and AI-based overkill reduction. For 3D Inspection, thickness inspection, and warpage inspection applications, the product list includes RV36-NEO / RV16-NEO, RS20 / RS24, RS20-DualSide, RHR-Evo, LT-NEO, LT36, LT-Hot, WS-evo, WS-NEO, RP124, DP328, LV-NEO, and RS20-Tray. RS20 / RS24 are wafer die sorters supporting varied operation, RS20-DualSide is a die sorter for double-sided electrode testing, and RHR-Evo combines room-temperature and high-temperature testing before carrier-tape storage. Test Handler products feed small chip components from parts feeders, perform electrical and six-side visual inspection, and store results in carrier tape or paper tape; the LT-NEO family is identified as a representative high-speed model. For chips as small as 0.2x0.4mm, load-control technology is used to maintain high productivity without damaging the devices. Frame-to-frame handling products pick chips from diced wafer sheets, inspect them, and place them on another frame sheet or target wafer, with handling from chip sizes below 1mm up to 35mm and load-control technology applicable to silicon and compound semiconductors. Tray Chip Handler products support waffle trays, JEDEC trays, and custom trays, can be customized with tray auto loaders and visual sensors, and use high-speed rotary-table operation while minimizing tray exchange time. The inspection and handling technology set includes high-speed 3D measurement, non-contact handling, micron-level thickness measurement, IR internal transmission inspection, AI image measurement, and full-closed-control load control. The product search range explicitly covers 3D Inspection for thickness and warpage measurement, and models RV36-NEO / RV16-NEO are included in that application category. Six-side visual inspection is a recurring inspection category across the product range, with support for chipping, microcracks, sidewall inspection, and other device-surface checks. AI Deep Learning Inspection and AI visual inspection are included in the searchable technology range, and RV36-NEO / RV16-NEO specifically list AI-based overkill reduction among their inspection options. Infrared inspection appears as SWIR / NIR and internal-transmission inspection in the technology range, while RV36-NEO / RV16-NEO list NIR and SWIR infrared inspection as selectable functions. The supported handling context spans 6, 8, and 12 inch wafers and ultra-miniature device sizes listed at 0.4mm, 0.2mm, and 0.15mm, linking wafer handling to very small semiconductor and electronic components. Other searchable applications include CMOS / MEMS Device, Optical Device / LED / LD(EEL/VCSEL) / PD(Photo Diode), NOR Flash / NAND / HBM, SiC / GaN / IGBT / MOSFET power semiconductors, BAW / SAW filters, CIS / Image Sensor / glass devices, and WLSCP / WLP wafer-level packages.
Capabilities and products
- High-speed discrete-device testers
- Power-device testers
- Chip-on-board (COB) equipment
- Wafer die sorting and taping equipment with throughput up to 70,000 UPH
- Electrical test handlers for miniature chips of 0.2 × 0.4 mm
- Frame-to-frame chip reconstitution and sorting equipment
- High-precision die placement equipment
- Tray-based chip sorting equipment
- High-speed 3D chip measurement
- Non-contact chip handling
- Contact and non-contact chip thickness measurement
- AI-based chip image measurement
- Fully closed-loop load control for chip handling
- Customization of semiconductor inspection and sorting equipment
- Development of visual inspection optics and image-processing algorithms
- Six-sided visual and microcrack inspection of semiconductors
- NIR/SWIR infrared transmission inspection of chips
- Bump coplanarity inspection
- Visual inspection of chips before and after tape sealing
- Integrated chip laser marking
- Double-sided electrode contact testing of power semiconductors
- Light-emission testing of optical components
- Ambient- and high-temperature electrical testing of chips
- Semiconductor inspection equipment maintenance