At a glance
| Booth | I3305 |
| Country | JP |
| Product categories | Cut & Down Set; Trim; Form Equipment · Device Handling; Feeding Systems · Die Sorter; Pick & Place; Flip Chip Placement Systems · Lead Frame Taping Systems · Marking; Imprinting; Labeling Equipment · Package Handling; Conveying Equipment · Wafer Mount; Taping Equipment · Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Package Inspection; Lead Scanners · Discrete Component Test Systems · Handlers; Positioner Systems · Linear Test Systems · Logic Test Systems · Optical Test Systems · Equipment; Hardware; Product Design, Integration and Manufacturing |
| Website | www.ueno-seiki.co.jp |
Company profile
We'll exhibit remote on live in our booth. We are pleased to show new test Handler, which are deepened our high-speed & load control technologies more than ever. Besides that, High-speed Discrete Tester and Power Tester that maximize our handler's performance are also introduced. Moreover, we'll introduce high-speed Vision Inspection Equipment applied our unique vision technology as well as Chip-on-board equipment as a new proposal. http://www.ueno-seiki.co.jp
Capabilities and products
- Chip-on-board equipment
- High-speed Discrete Tester
- Power Tester
- high-speed Vision Inspection Equipment
- test handler with high-speed and load control technologies