At a glance
| Booth | L1309 |
| Country | TW |
| Website | ucome.com.tw |
Company profile
Ucome Tech Co., Ltd was established in 2013 and states that it is committed to supporting the development of Taiwan's semiconductor industry and academic organizations while advancing through R&D and innovation and obtaining multiple invention patents. The company provides complete solutions from front-end to back-end processes and can carry out customized development to meet varied customer requirements. Its main business includes precision ceramics and engineering plastics used as equipment consumables in semiconductor processes, and it specializes in precision ceramic components and advanced ceramic machining for semiconductor equipment applications. Ucome Tech Co., Ltd combines advanced technologies from domestic and overseas manufacturers to provide technical support and multiple choices for customers. Its material expertise includes silicon carbide and alumina, and the company distributes high-quality silicon carbide and alumina from Japan for broad use across upstream, middle, and downstream semiconductor-process stages. The company's service description emphasizes material selection and design advice based on the properties of silicon carbide, alumina, and related engineering materials, together with customized solutions spanning different process needs. Its products are described as being widely used in semiconductor, LED, and packaging-and-test industries, with long-term cooperation relationships with multiple well-known companies and flexible capacity planning from a single sample through volume orders. The semiconductor-facing role also includes distribution of equipment and materials across front-end and back-end processes, with business items that include industrial plastic products, electronic components, precision instruments, machinery, electronic materials, product design, repair, and leasing-related activities.
Exhibits
The product and service lineup includes Ceramic Fork, Wafer Tray, Porous Ceramic Chuck, Heater Ceramic Chuck, Pin Chuck, Precision Ceramic, and other equipment consumables for semiconductor processes. For Ceramic Fork applications, precision ceramic is described as having very low particle generation, high stiffness, and a low thermal-expansion coefficient so positioning accuracy can be maintained during high-speed transfer and temperature changes. The Ceramic Wafer Hand range uses alumina ceramic for insulation, wear resistance, corrosion resistance, and high-temperature resistance, and Ucome Tech Co., Ltd uses 99.6% or higher purity, 100% Japan-made imported alumina ceramic as the base material for customized design and production. The low-particle Ceramic Wafer Hand type uses AL2O3 at 99.6% purity in vacuum or non-vacuum environments at room or high temperature, combines ceramic with special low-particle engineering plastic, reduces wafer contact area, and supports stable transfer of 8inch and 12inch wafers. For high-temperature use, the Ceramic Wafer Hand can use an integrated ceramic construction with high-temperature-resistant epoxy, while the Teflon coating type uses conductive coating on AL2O3 at 99.6% purity with surface resistance of 10E5 to 10E9Ω to prevent static electricity and reduce ceramic wear or scratching on the wafer. The conductive-ceramic Ceramic Wafer Hand type is listed for vacuum or non-vacuum use at room or high temperature with surface resistance of 10E6 to 10E8Ω, static prevention, wear resistance, and corrosion resistance. The SiC Ceramic Wafer Hand type is also intended for vacuum or non-vacuum use at room or high temperature, with surface resistance of about 10E8Ω, static prevention, resistance to deformation or stretching at high temperature, and high thermal conductivity. For Wafer Tray applications, SiC is described as providing high-temperature resistance and high thermal conductivity for rapid and uniform heat transfer and as having strong corrosion resistance to fluorine-based plasma and reactive gases. The SiC Tray lineup includes a 12inch Turn 8inch configuration for transfer, carrying, and Bonding, a 6inch x 3 configuration for CVD, and 4inch x 7 configurations for etching, all listed for room or high temperature with capability above 1400℃. A SiC Tray PIN Type in 4inch x 7 is listed for etching at room or high temperature above 1400℃, while an 8inch x 1 SiC Tray is listed for RTA annealing under the same temperature description. The Wafer Tray range also includes an Al2O3 AR Tray in 4inch x 1 and in 4,6,8,12inch sizes for room or high temperature and custom equipment applications. Porous Ceramic Chuck material is made from alumina (AL2O3) or silicon carbide (SiC) through special composition mixing and high-temperature sintering, and its internal pore structure is used for CHUCKING processes that adsorb and hold wafers while providing high strength and high-temperature resistance. Listed porous-ceramic material choices include AZP50 at 50% porosity, AZP60 at 60%, AZP60B at 73%, AZPW40 at 40%, AZPWB40 at 35%, AZPV60 at 60%, AZPS40 at 40%, and AZPVS60 at 60%. Customized Porous Ceramic Chucks are offered for handling and fixing semiconductor, panel, wafer, and other precision electronic components, with round, large square, and special geometric forms and with ceramic stiffness, wear resistance, and corrosion resistance combined with the machinability and close fit of metal or composite bases. The Porous Ceramic Chuck material description also identifies aluminum nitride (AlN) for thermal conductivity, heat radiation, thermal-shock resistance, electrical insulation, and a thermal-expansion coefficient matched to silicon wafers. The Heater Ceramic Chuck integrates uniform heating with vacuum adsorption and is designed for high-precision inspection, bonding processes, and thin-wafer or thin-film handling with high-accuracy heating and temperature-control technology. Fine pores distributed through the ceramic create stable and uniform adsorption force to reduce localized stress that can cause wafer warpage or breakage, while thermal stability and low thermal expansion help preserve flatness, dimensional stability, bonding accuracy, and process repeatability during heating. Pin Chuck uses a multipoint micro-contact structure to reduce contact area while supporting the wafer, helping reduce backside contamination and adsorption marks, and high-cleanliness treatment makes it suitable for processes with very strict surface-cleanliness requirements. For larger ceramic structures, Ucome Tech Co., Ltd uses high-performance engineering ceramics, Al2O3 or SiC, to maintain shape under prolonged heating and load, and the low thermal-expansion coefficient helps suppress warpage and deformation while maintaining bonding and alignment accuracy. On SiC ceramic surfaces, the company applies SC(Annealing) treatment to remove organic residues and grinding debris, increase surface purity and cleanliness, and reduce metal elution by more than 95% depending on the element compared with conventional SiC ceramic. The SC-treated material is widely used in wafer-handling arms, Ceramic Hand, and is also applicable to ceramic components such as carrier plates (Plate) and vacuum chucks (Chuck). Large Precision Ceramic production is described as involving precision forming, high-pressure hydraulic processing, and high-temperature sintering, with larger dimensions creating increasing challenges in sintering deformation control and later precision machining. Ucome Tech Co., Ltd states that it uses advanced technical capability and strict quality control to address deformation and machining difficulties in large ceramic parts and uses 100% high-quality ceramic base material imported from Japan for wear resistance, corrosion resistance, low thermal expansion, and structural stiffness. The square Precision Ceramic Jig is designed for semiconductor, panel, and high-end automated machining processes and uses high-purity alumina with precision grinding to maintain micron-level geometric accuracy and environmental resistance at large dimensions. The large square ceramic jig is listed with a maximum size of 1000mm and squareness and straightness controlled below 2µm, together with high bending resistance, high wear resistance, and long service life.
Capabilities and products
- precision ceramic components and machining for semiconductor equipment
- ceramic wafer hands
- SiC/Al2O3 wafer trays
- porous ceramic chucks
- heater ceramic chucks
- pin chucks for wafers
- large precision ceramic manufacturing
- SC (Annealing) surface treatment for SiC ceramics
- 1000mm square precision ceramic jig