At a glance
| Booth | J3034 |
| Country | KR |
| Website | www.tse21.com |
Company profile
TSE Co., Ltd. describes a 30-year history of innovation and bold challenges in Korea's semiconductor testing industry, where it positions itself as a pioneer developing cutting-edge technology beyond current limitations; its heritage is reflected in diverse customer experiences, proven capabilities, and a strong track record, and it states that it sets new technology standards. TSE Co., Ltd. has developed LC components using MEMS technology and states that it is the world's only company to provide i3unify, an integrated interface solution for the three key test InterconneXion hardware components of high-performance semiconductor devices: probe cards, interface boards, and test sockets. Its i3unify architecture integrates probe cards, interface boards, and test sockets into a three-in-one system that flexibly addresses diverse semiconductor chip testing requirements, combines integration and flexibility, and uses advanced design technologies and processes to provide interfaces optimized for specific testing needs with higher power density, faster signal transmission, and reliable on-time delivery. Vertical integration supports an in-house supply chain for high-performance probe cards, interface boards, and test sockets, while i3unify provides a consistent user experience across platforms, enhances solution performance and stability, simplifies implementation, reduces the complexity of multiple suppliers, and makes installation and after-sales service convenient. TSE Co., Ltd. states that its test interconnection hardware solutions emphasize accuracy and efficiency for leading chipmakers, and it operates 14 locations worldwide, with headquarters in Korea and branches across Asia, the Americas, Europe, and South America, including Germany, Cheonan in South Korea, the USA, China, Japan, Malta, Thailand, Taiwan, the Philippines, Brazil, Singapore, and Malaysia. The company also identifies GMTEST, TigerELec, Megatouch, MegaSen, and LDT under WE TSE GROUP. TSE Co., Ltd. describes continuous innovation and commitment to technical challenges as a distinctive value that supports its work with customers.
Exhibits
TSE Co., Ltd. states that it is the world's only company providing high-performance probe cards, interface boards, test sockets, and Loop Back devices for ultra-high-speed testing in-house through a vertically integrated supply chain. Its probe cards test chip functionality within DRAM, NAND, and Flash wafers by electrically connecting testers and chips and detecting defects through input-output signal connections; the broader probe-card lineup covers DRAM, Flash, Foundry & Logic, Parametric, and SoC applications and is categorized as High-Performance Probe Cards and Vertical MEMS Probe Cards. Memory test interface boards validate the performance and reliability of high-speed memory devices such as DDR, LPDDR, and GDDR using high-speed signal integrity and power integrity for stable results across testing environments, while TSE Co., Ltd. also provides next-generation ultra-high-speed Device Test Interface Board Solutions based on simulation-driven PCB design capabilities. The company offers sockets and COKs for package testing and provides interfaces optimized for customer usage environments through analysis of those environments and a diverse socket lineup. Its MEMS LC component is used for loopback testing of high-speed I/O ports including USB, Thunderbolt, PCI, and SATA. A KGD testing solution inspects individual HBM or die-level devices using existing test infrastructure. For display measurement, TSE Co., Ltd. provides ATS (Array Test System) equipment and, after building core competencies from its LED inspection equipment business, serves customer needs from OLED TVs to AR/VR glass displays; its ATS system integrates glass transfer equipment, electrical test equipment, software implementation technology, large-capacity data processing, and AI technology.
Capabilities and products
- integrated interface for probe cards, interface boards, and test sockets
- high-performance probe cards
- vertical MEMS probe cards
- DDR/LPDDR/GDDR memory test interface boards
- ultra-high-speed Device Test Interface Board solutions
- package test sockets and COKs
- MEMS LC components for high-speed I/O loopback testing
- HBM/die-level KGD testing
- display Array Test System (ATS)