At a glance
| Booth | P6206 |
| Country | TW |
| Website | www.trumpf-huettinger.com |
Company profile
TRUMPF Electronics was founded in 1922 and is headquartered in Freiburg, Germany, with a portfolio spanning plasma power supplies, industrial heating, battery inverter systems, and microwave generators and amplifiers for semiconductor, display, solar-energy, and industrial-glass-coating applications. Since 1990, TRUMPF Electronics has been a member of the TRUMPF Group, which is active in highly versatile machine tools for sheet-metal processing and industrial lasers as well as electronics for industrial applications. With more than 100 years of expertise, the company specializes in developing and manufacturing plasma power supplies with a focus on deposition and dry etching in semiconductor manufacturing processes. Sales and service subsidiaries operate across Europe, America, and Asia, providing a regional sales and support structure around the company's industrial power-electronics and plasma technologies. TRUMPF's mission is to further develop and digitally connect production technology so that manufacturing becomes more efficient, precise, and future proof. In the 2023/24 fiscal year, the TRUMPF Group had around 19,000 employees and generated sales revenues of EUR 5,2 billion. Within power electronics, TRUMPF Hüttinger supplies DC, MF, and RF generators with the required frequency and power for plasma applications, induction heating, and CO2 laser excitation, and its product categories include Plasma Excitation, Generators for industrial heating, Microwave amplifiers, and Inverters. The power-electronics portfolio also includes an inverter developed for energy storage from renewable energies, adding battery and energy-storage conversion to the company's plasma, heating, and microwave power technologies.
Exhibits
TruPlasma RF G3 is a new-generation RF plasma power supply whose high-speed pulsing increases plasma-generation and control capability; multi-level pulse technology provides flexible plasma-excitation modes, and a built-in high-speed sampling oscilloscope monitors changes in power, impedance, phase, and frequency for deposition and etching process monitoring, analysis, and optimization. TruPlasma Highpulse 4002 G2 uses HiPIMS power technology to generate high-density plasma for advanced thin-film deposition and functional-material preparation, and its high-peak-power pulse excitation increases sputtered-material ionization to support deposited films with improved density, adhesion, and uniformity. The TruMicro 6000 series is an industrial-grade ultrashort-pulse laser for demanding mass production, while TruPulse nano is a laser module for integrators seeking ultra-high precision and high adaptability and is offered with multiple configuration options. TRUMPF Hüttinger plasma generators provide process stability for high-tech industries and support functional coating of solar cells and microchips, coating of large architectural-glass surfaces, manufacture of semiconductor elements, and production of flat screens. Its plasma-excitation range covers MF Plasma Excitation, DC Pulsed Plasma Excitation, DC Plasma Excitation, RF Plasma Excitation, and microwave plasma generators, allowing different power and excitation modes to be matched to coating, etching, sputtering, and other plasma processes. TruPlasma MW Series 1000 / 5000 uses a solid-state platform concept to generate high plasma densities, with nano pulses allowing diverse plasma parameters to be set for the required application. TruPlasma Bipolar Series 4000 (G2.1) supplies flexibly formable output signals and arc management for solar-cell and semiconductor production, decorative and wear-resistant layers, and architectural-glass coating, and is suited to reactive sputtering, PVD, and PECVD. TruPlasma MF Series 7000 (G2) is aimed at controlling demanding large-area coating processes with peak efficiencies of over 90%, combining layer-quality and productivity objectives with reduced operating cost. TruPlasma Highpulse Series 4000 (G2) is designed for corrosion-resistant and wear-resistant hard-material coatings and HiPIMS applications and, with polarized substrates, also supports semiconductor trench filling, surface pretreatment, and etching. TruPlasma DC Series 4000 (G2) combines arc handling with DC pulse technology to reduce coating defects and increase deposition rate, while TruPlasma DC Series 3000 (G2) targets DC sputtering with progressive arc management, integrated water cooling, and a compact design for integration into existing applications. TruPlasma Arc Series 3000 is intended for hard-material and decorative coatings and uses a compact air-cooled design for integration into new or existing systems. For RF plasma excitation, TruPlasma RF 1001 Air delivers up to 1000 watts of high-precision, reproducible RF energy in increments of 100 mW for semiconductor, solar-cell, display, and other plasma applications. TruPlasma RF Series 1000 / 3000 (G2/13) combines patented CombineLine coupling technology with real-time measurement of process parameters for demanding plasma processes, while TruPlasma RF Series 3000 emphasizes efficiency and process stability for semiconductor, photovoltaic-cell, and flat-screen production with generator-matched impedance matchboxes. TruPlasma VHF Series 3000 uses a modular, water-cooled platform whose output power can be scaled up to 80 kW, and TruPlasma Match Series 1000 (G2/13) provides impedance matching between RF generators and the plasma process as part of the TRUMPF RF system. The TruPlasma VHF Series 3000 platform combines high power density with modular, purely water-cooled construction and a compact, robust design, with output power scalable up to 80 kW for demanding process requirements. Its arbitrary-pulse function supports precise and fast single-level and multi-level pulse shapes, with minimal ramp time < 150 ns, while Smart Auto Frequency Tuning is intended to optimize interaction between the generator and matchbox. Highly precise digital frequency modulation supports reproducible process control, and CombineLine technology allows generator operation through mismatch conditions without requiring RF cable length to be adapted whenever the process changes. For photovoltaic production, the VHF generators support plasma processes such as sputtering, PECVD, and etching, and fast arc management is used to maintain stable plasma control while the power supply is adapted to the process. For semiconductor production and flat-screen coating, TruPlasma VHF Series 3000 supports processes including dry etching, reactive-ion etching (RIE), atomic layer deposition (ALD), plasma-enhanced chemical vapor deposition (PECVD), and RF sputtering used for semiconductor components, MEMS, flat screens, and solar cells. The modular VHF platform can be adapted through output power up to 80 kW, a wide frequency range, variable line voltage, and cable length, while LDMOS power transistors and highly integrated planar technology are used to combine power density, energy efficiency, and reduced cooling-capacity requirements. VHF SystemPort measures the RF signal directly at the input and output of the matchbox and makes the measured values available to the RF generator for closed-loop control, process-parameter monitoring, matchbox protection, and early arc detection through a single generator interface. VHF options include targeted arc management, flexible pulse shapes, patented Auto Frequency Tuning, and TruControl Power software for start-up and secure monitoring of the RF generator or the complete TRUMPF RF system during active processes. VHF system components include TruPlasma Match matchboxes, an accessory kit for water and electrical connections and synchronization, master oscillators with digital frequency and phase synthesis including designs for 13.56 MHz, RF switches with 2, 3, or 4 outputs in two power classes, and coaxial cables for 50-ohm RF power transmission. TruPlasma RF Series 1000 / 3000 (G2/13) is the latest generation of RF generators for stable and reproducible plasma current supply, using stable output power and high control accuracy for coating and surface-structuring processes that require high productivity. CombineLine technology provides a true 50 ohm output impedance and reflected-power protection during mismatch, while the design removes the need to adjust RF cable lengths when process conditions change. The RF generators reach efficiencies of up to 80%, reducing energy costs by up to 50%, and their blower-free cooling solution avoids heating or contaminating ambient air so the generators can operate in clean rooms. Process applications include reactive-ion etching (RIE), atomic layer deposition (ALD), plasma-enhanced chemical vapor deposition (PECVD), RF sputtering, semiconductor-component and MEMS manufacturing, flat-screen coating, solar-cell coating, and demanding PECVD, etching, and RF-sputtering processes in the solar industry. For semiconductor production, intelligent real-time matching adjusts impedance rapidly and directly to 50 ohms, while CombineLine is used to prevent plasma fluctuations and impurities and the blower-free cooling concept is intended to reduce failure occurrence and support clean-room operation. Integration options include configurable analog interface, RS 232/485, DeviceNet, Profibus, and EtherCAT, with integrated ultra-wide-range power packs for 200-480 VAC and compact 19-inch or ½-19-inch plug-in formats for space-saving integration into production systems. RF SystemPort performs closed-loop control by measuring the RF signal at the matchbox input and output, giving the generator access to measured values for improved process monitoring, matchbox protection, early arc detection, and control of the complete RF system through one generator interface. The RF Series options include patented Auto Frequency Tuning for fast simultaneous frequency tuning and generator-matchbox interaction and RF arc management for targeted arc detection that protects the product and system during plasma processing. The RF system can be combined with TruPlasma Match Series 1000 (G2/13) matchboxes, master oscillators with digital frequency and phase synthesis including 13.56 MHz designs, RF switches with 2, 3, or 4 outputs in two power classes, and 50-ohm coaxial cables for RF power transmission. Active matchboxes continuously adjust the complex variable plasma load toward an optimal impedance of 50 ohms, and generator and matchbox can be integrated into the process environment through interfaces including EtherCAT and connected intelligently through SystemPort as a coordinated TRUMPF RF System.
Capabilities and products
- plasma power supply development and manufacturing
- generators for industrial heating
- microwave amplifiers
- battery inverter systems
- high-speed pulsed RF plasma power supply
- HiPIMS high-density plasma power supply
- industrial ultrashort-pulse laser
- high-precision laser module
- VHF plasma generators scalable up to 80 kW
- RF plasma impedance matchbox