At a glance
| Booth | I3228 |
| Country | TW |
| Website | www.tronstek.com/index_en.html |
Company profile
Tronstek International Inc. provides process-equipment solutions and professional application services for three major electronics-manufacturing fields: printed circuit boards, semiconductors, and electronic assembly. The company presents innovation and creativity as the way it approaches customer problems and positions production tools together with application services as the practical output of that approach. Its value concept is to create a triple win for customers, partners, and Tronstek through value creation, placing cooperation with customers and business partners within the company's solution model. The product scope shown in its solution portfolio spans MK7 series Reflow Oven, MK5 series Reflow Oven, Voidless / Vacuum Reflow Soldering Oven, Vertical Curing Oven (VCO), Pressure Curing Oven (PCO), Automatic Optical Inspection (AOI), Solder Paste Inspection (SPI), and die bonders at 0.5um, 1.5um, 3um, and 5um accuracy classes. This combination gives the company a product and application-service range that covers reflow and vacuum reflow ovens, curing ovens, AOI and SPI inspection equipment, and high-precision die-bonding equipment for PCB, semiconductor, and electronic-assembly production environments.
Exhibits
The 0.5um Die Bonder offering includes model MRSI-S-HVM, a next-generation ultra-high-accuracy solution designed for integrated-photonics volume manufacturing, semiconductor wafer-level packaging, and multi-chip, multi-process production in one machine. MRSI-S-HVM provides two modes with automatic changeover, ±0.5μm @ 3σ and ±1.5μm @ 3σ, both with on-axis z-force for die bonding, and a proprietary high z-force option is available. Applications include Chip-on-Wafer (CoW), Chip-on-Interposer (CoI), silicon photonics, and pick-and-place of dies from an III-V wafer of 8 inches onto a silicon wafer of 12 inches with mapping. Supported processes include DAF, eutectic, epoxy stamping and dispensing, thermal heating from top and bottom, and proprietary bottom laser soldering, while flip-chip bonding uses direct alignment of fiducials on both bonding interfaces without an additional reference or calibration. The machine also includes a proprietary wafer table with automated leveling and inherits parallel processes using proprietary automatic tool change and a dual gantry/head arrangement. Material input methods include wafer, Waffle pack, Gel-Pak®, and customized fixtures, allowing different incoming-material formats to be handled within the same die-bonding platform. For high-volume, high-mix manufacturing, the company highlights throughput, flexibility, ultra-high accuracy, and multiple process options, and the ability to switch between 0.5 micron and 1.5 micron modes is intended to balance different chip or die accuracy requirements in one machine. The MRSI-S-HVM uses an icon-based interface on a Windows™ platform for programming and machine maintenance and is supported by local technical-support teams and application expertise, more than 35 years of industry experience, and reliable 24/7 field operation. The reflow portfolio includes the named Voidless / Vacuum Reflow Soldering Oven as well as the MK7 series Reflow Oven, covering conventional reflow and a vacuum option for void-free reflow applications. The MK7 platform was designed around lower Delta T, reduced nitrogen consumption, extended preventive-maintenance intervals, and a low-height package that improves operator access and visibility across the production floor. Tronstek offers process-profile support by allowing customers to run profiles and gather data at three locations or send a difficult PCB for reflow-soldering profiles and generated data, and the reflow ovens can be custom configured to customer requirements. The MK7's low-height top shell uses double insulation on all skins, saving up to 10-15% in reflow-soldering energy loss. For Industry 4.0 operation, the platform supports Internet of Manufacturing (IoM), smart factories, intelligent machines, and networked processes; its Uniform Gas Management system eliminates net flow and reduces nitrogen consumption by up to 40%, while a semi-circular heater is designed for robustness, efficiency, and longer lifetime. The flux-management system traps flux in collection jars that can be removed and replaced while the reflow oven is running, uses a filtration box intended to avoid flux clogging for longer maintenance intervals, and applies a proprietary Flux-Free Grill system to limit flux residue on cooling grills. Additional reflow functions include programmable cooling, Reflow Oven Energy Management Software, and Reflow Oven CPK. The CPK offering is a three-tier system consisting of Tier 1 Reflow Oven CPK, Tier 2 Process CPK, and Tier 3 Product Traceability, with automatic record keeping and recall intended to help keep reflow-soldering process parameters under control and within specification while supporting product quality, yield, and cost improvement. Beyond reflow and die bonding, the equipment portfolio includes Vertical Curing Oven (VCO), Pressure Curing Oven (PCO), Automatic Optical Inspection (AOI), and Solder Paste Inspection (SPI), giving customers curing and inspection options alongside assembly and bonding equipment.
Capabilities and products
- professional application services for PCB, semiconductor, and electronic assembly
- vacuum reflow soldering oven supply
- reflow oven supply
- vertical curing oven supply
- pressure curing oven supply
- automatic optical inspection (AOI) equipment supply
- solder paste inspection (SPI) equipment supply
- 0.5um die bonder supply
- 1.5um, 3um, and 5um die bonder supply
- reflow profiling and data generation service
- reflow process CPK and product traceability