At a glance
| Booth | T9237 |
| Country | KR |
| Product categories | Defect; Particle; Bump; Contamination Detection, Review or Inspection · Instruments; Bench Top Test · Line Width; Critical Dimension (CD) Measurement · Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes · Microscopes: Optical Microscopes · Overlay Measurement · Package Inspection; Lead Scanners · Stress; Refractive Index; Reflectivity & Conductivity Measurement · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Inspection and Metrology · Failure Analysis Systems · FPD Test; Measurement; Repair Equipment · Optical Test Systems |
| Website | tomocube.com/precision |
Company profile
🔷 Tomocube Inc. Pioneering Industrial Holotomography Deep Insights from Surface to Substrate Tomocube Inc. is the global leader in Industrial Holotomography, an advanced 3D optical imaging technology that enables quantitative, non-destructive analysis of internal structures across a wide range of transparent and semi-transparent materials. Our proprietary holotomography platform provides high-resolution, refractive index-based 3D imaging without the need for physical cross-sectioning or destructive sample prep. The result: Real-time, volumetric insight into structures below the surface, enabling process engineers and quality teams to detect defects early, optimize parameters, and improve yield. ✅ Key Applications across Industries 🔹 Glass Substrate Processing • Detect cracks, residues, and voids in TGV/Blind Via • Visualize taper angle, hole completeness, and inner-wall roughness • Monitor laser modification and etching behavior quantitatively 🔹 Semiconductor Packaging • Measure Cu pad recess and shape deformation in hybrid bonding • Analyze line width and thickness in fine RDL patterns • Quantify surface roughness of dielectric layers and trenches 🔹 Photonic Integrated Circuits (PICs) • 3D characterization of optical waveguides • Evaluate RI uniformity and structural alignment in transparent layers 🔹 Display Industry (AR/XR, MicroLED, MLA) • Inspect micro display pixel structures • Visualize and analyze Micro Lens Arrays (MLA) alignment and shape • Non-destructive inspection of embedded components under transparent layers Tomocube’s holotomography modules are being adopted by metrology tool makers, display and semiconductor manufacturers, and research centers around the world. We continue to expand industrial applications through partnerships with process equipment manufacturers and system integrators. ✨ Experience the unmatched depth and precision of Holotomography – now made for industrial use. ✉️ For more info or partnerships, visit us at Booth #T9237, SEMICON Taiwan 2026
Capabilities and products
- Industrial Holotomography 3D optical imaging technology
- TGV/Blind Via crack, residue, and void detection
- TGV/Blind Via taper angle, hole completeness, and inner-wall roughness visualization
- fine RDL line width and thickness analysis
- hybrid bonding Cu pad recess and shape deformation measurement
- optical waveguide 3D characterization for PICs
- refractive index-based non-destructive 3D imaging