At a glance
| Booth | T9237 |
| Country | KR |
| Website | tomocube.com/precision |
Company profile
Tomocube, Inc develops Industrial Holotomography, a 3D optical imaging approach for quantitative, non-destructive analysis of internal structures in transparent and semi-transparent materials. Its proprietary holotomography platform reconstructs high-resolution 3D information from refractive index without physical cross-sectioning or destructive sample preparation, providing volumetric information below the surface. The company positions this information for process engineers and quality teams to detect defects earlier, optimise process parameters, and improve yield through real-time internal-structure analysis. For glass-substrate processing, stated applications include detecting cracks, residues, and voids in TGV and blind vias, visualising taper angle, hole completeness, and inner-wall roughness, and quantitatively monitoring laser modification and etching behaviour. For semiconductor packaging, Tomocube, Inc lists measurement of Cu-pad recess and shape deformation in hybrid bonding, analysis of line width and thickness in fine RDL patterns, and quantification of surface roughness in dielectric layers and trenches. For photonic integrated circuits, the applications include 3D characterisation of optical waveguides and evaluation of refractive-index uniformity and structural alignment in transparent layers. For display applications including AR/XR, MicroLED, and MLA, the company lists inspection of micro-display pixel structures, micro-lens-array alignment and shape analysis, and non-destructive inspection of embedded components beneath transparent layers. Tomocube, Inc states that its holotomography modules are being adopted by metrology-tool makers, display and semiconductor manufacturers, and research centres, and that it expands industrial applications through partnerships with process-equipment manufacturers and system integrators.
Exhibits
Holotomography combines holography and tomography with quantitative phase imaging to visualise internal structures of industrial materials while producing quantitative information such as refractive-index mapping, step height, and roughness. The general technology description gives nanoscale resolution of 130 to 161 nm, non-destructive imaging, and real-time inspection without damaging the sample, with applications in semiconductors, glass substrates, optical elements, and electronic devices. HT-T1™ is a transmission-based second-generation holotomography system for transparent samples, designed for non-destructive metrology of glass substrates, waveguides, and other optically transparent structures. The HT-T1™ specification lists lateral resolution of 161 nm, axial resolution of 1.298 µm in glass with refractive index n = 1.5, and refractive-index sensitivity of approximately 10⁻⁴ Δn. Target samples include transparent and semi-transparent materials such as glass substrates up to 2 mm, TGV panels, silicon-photonics waveguides, Holographic Optical Elements, and optical films. Measurement outputs include a 3D refractive-index volume, critical dimensions, depth and taper, sidewall roughness, and locations of internal defects or microcracks. For laser-modified transparent materials, HT-T1™ can map 3D refractive-index changes associated with densification, rarefaction, microdefects, and early-stage cracking, providing feedback for adjustment of laser-process parameters. For etching, the system visualises vias and trenches in 3D and quantifies via taper, sidewall geometry, and etch completeness so process conditions can be adjusted using internal-geometry feedback rather than surface appearance alone. HT-T1™ is also positioned as a complement to surface-based AOI because it can reveal subsurface voids, incomplete material removal, and hidden microcracks that may not be visible in conventional surface inspection. The product is available as an HT-T1™ Module with an imaging unit, illumination unit, and TomoPilot host interface, or as an HT-T1™ Desktop configuration that adds a motorised sample stage and software for image acquisition and analysis. The listed software includes TomoVision for acquisition control, TomoAnalysis MI for data viewing and quantitative analysis, and TomoPilot for host integration. For opaque substrates such as silicon wafers, metal layers, and PCBs, Tomocube directs users to the reflection-based HT-R1™ rather than the transmission-based HT-T1™. A sample-measurement service is also described in which a customer's sample can be handled under NDA, measured to prepare a full 3D analysis report, and reviewed live with an application engineer. HT-T1™ requires no cutting, polishing, or physical contact for full-volume inspection, allowing valuable or delicate transparent samples to be inspected repeatedly without the damage or contamination risk associated with destructive preparation. Its industrial design is described as providing stable, repeatable measurements for process control, quality assurance, and advanced manufacturing development, while the refractive-index sensitivity supports analysis of thin films and microfabricated transparent components.
Capabilities and products
- industrial holotomography 3D optical imaging
- non-destructive internal 3D analysis of transparent materials
- TGV/Blind Via crack, residue and void inspection
- TGV taper, completeness and inner-wall roughness measurement
- quantitative monitoring of laser modification and etching behavior
- hybrid-bonding Cu pad recess and deformation measurement
- fine RDL line-width and thickness analysis
- dielectric-layer and trench surface roughness measurement
- 3D characterization of optical waveguides
- refractive-index uniformity and alignment evaluation in transparent layers
- MicroLED micro-display pixel structure inspection
- Micro Lens Array alignment and shape analysis
- non-destructive inspection of embedded components under transparent layers
- 3D measurement and analysis report service for transparent samples
- reflection-based holotomography for opaque substrates