At a glance
| Booth | M0648 |
| Country | TW |
| Product categories | Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Coat; Develop; Resist Processing; Track Equipment · Crystal Growing & Machining Equipment · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy (MBE); Atomic Layer Epitaxy (ALE) · Etching; Stripping; Ashing - Dry and Wet Equipment · SOI Bonders; Temporary Bonders; De-Bonders · Spin on Glass (SOG); on Dielectric (SOD) Track systems · Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment · Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers · Equipment Interface; Communication Protocols · Yield Mgmt; Process Control Software · Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts · Used; Rental Equipment; Inventory Reduction, Appraisal - Brokers; Resellers |
| Website | www.tel.com |
Company profile
As a leading global company of innovative semiconductor production equipment, Tokyo Electron ) engages in development, manufacturing, and sales in a wide range of product fields. All of 's semiconductor production equipment product lines maintain high market shares in their respective global segments. provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia. will contribute to technological innovation in semiconductors through continuous technological innovation. Please visit https://www..com/ for more information.
Exhibits
as a semiconductor production equipment manufacturer. as a semiconductor production equipment manufacturer. Notice Regarding ISS’s Updated Voting Recommendation for Proposals to Be Submitted to the 63rd Annual General Meeting of Shareholders Summary of Results of Evaluation of the Effectiveness of Tokyo Electron's Board of Directors （202KB） Notice of Stock Split and Corresponding Partial Amendment to the Articles of Incorporation （151KB） Tokyo Electron Chosen for METI's Global South Future-Oriented Co-Creation Project in 2024 Japanese fiscal year Supplementary Budget Tokyo Electron Announces Epsira™, a New DX Solutions Concept for Improving Equipment and Field Operation Productivity Tokyo Electron Launches Ulucus™ LX, an Extreme Laser Lift Off System for 300ｍｍ Wafer-Bonded Devices Tokyo Electron Launches Acrevia™, a Gas Cluster Beam System for Ultra-Fine Patterning in EUV Lithography Tokyo Electron Launches Single Wafer Deposition Systems Episode™ 1 and Episode™ 2 DMR, Announces Planned Release of Episode™ 2 QMR Notice Regarding ISS’s Updated Voting Recommendation for Proposals to Be Submitted to the 63rd Annual General Meeting of Shareholders Summary of Results of Evaluation of the Effectiveness of Tokyo Electron's Board of Directors （202KB） Notice of Stock Split and Corresponding Partial Amendment to the Articles of Incorporation （151KB） Tokyo Electron Technology Solutions Tohoku Office Achieves Platinum Status in RBA VAP Response to the impact of the tsunami caused by the volcanic eruption in the Tonga Islands that occurred on January 15th The blog features various topics including technology, people, corporate culture about. Tokyo Electronis pleased to announce that it has signed a sponsorship agreement with professional golfer Hideki Matsuyama. This page provides information on ’s DE&I, which we promote various initiatives based on the idea of "ONE, DIFFERENT TOGETHER™". The report details our medium- to long-term profit expansion and continuous corporate value enhancement through value chain initiatives that leverage our strengths. We contribute to the resolution of issues and development of industry and society as well as the achievement of the SDGs. We invests in innovative technologies that have synergy with Tokyo Electron and works with portfolio companies through supporting development of technologies and products, striving to create new businesses at both companies.
Capabilities and products
- Acrevia gas cluster beam system for ultra-fine EUV patterning
- Episode 1 single wafer deposition system
- Episode 2 DMR single wafer deposition system
- Episode 2 QMR single wafer deposition system
- Epsira DX solutions for equipment and field operation productivity
- Ulucus LX Extreme Laser Lift Off System for 300mm wafer-bonded devices
- semiconductor production equipment