At a glance
| Booth | M0648 |
| Country | TW |
| Website | www.tel.com |
Company profile
Tokyo Electron Limited, or TEL, develops, manufactures, and sells semiconductor production equipment across a wide range of product fields. The company states that all of its semiconductor production equipment product lines maintain high market shares in their respective global segments. TEL supplies products and services through a global network spanning the U.S., Europe, and Asia, combining equipment development and manufacturing with worldwide customer support. Its stated direction is to contribute to semiconductor technological innovation through continuous technological innovation in semiconductor production equipment.
Exhibits
TEL offers system solutions across the semiconductor patterning sequence and maintains product lines for deposition, lithography, etch, cleaning, test, and bonding or debonding processes. In deposition, TEL addresses dielectric and metal thin films on wafer surfaces and lists Oxide/Anneal thermal deposition, CVD, ASFD, ALD, and PVD technologies for films including extremely thin 1-10 nm layers requiring uniformity and etch resistance. TELINDY PLUS™ is a batch thermal processing system for 300mm wafers, while EVAROS™ is a 300 mm batch thermal processing system described with precise process control, high productivity, low power consumption, and an expandable controller for future autonomous operation. NT333™ is TEL's first semi-batch ALD system for 300mm wafers and is described as providing film-thickness control and uniform film quality in high-aspect-ratio structures using an original deposition technique. Triase+™ Ti/TiN is a 300mm single-wafer CVD system using TiCl4 for high-step-coverage Ti and TiN deposition, while Episode™ 1 is a 300mm single-wafer deposition system with up to 8 process modules and Episode™ 2 DMR transports and coats two wafers simultaneously to increase productivity and reduce footprint. Other deposition products listed by TEL include TELINDY PLUS™ IRad™, TELFORMULA™, ALPHA-8SE™ i, Triase+™ EX-II™ TiN, Triase+™ W, Triase+™ SPAi, EXIM™, and LEXIA™-EX. For lithography, TEL describes the integrated sequence of photoresist coating, exposure, and development and states a 90% overall share in the Coater/Developer market and almost 100% share for the high NA process. CLEAN TRACK™ LITHIUS Pro DICE™ is a 300mm coater/developer supporting EUV technologies including High NA, CLEAN TRACK™ LITHIUS Pro™ AP supports 300/200mm wafers for next-generation packaging and spin-on hard-mask processes, and CLEAN TRACK™ LITHIUS Pro™ Z supports EUV and other advanced lithography processes on 300/200mm wafers. The lithography lineup also includes CLEAN TRACK™ LITHIUS Pro™ V / LITHIUS Pro™ V-i, CLEAN TRACK™ LITHIUS Pro™ / LITHIUS Pro™ ｰi, CLEAN TRACK™ LITHIUS™ / LITHIUS™ i+, CLEAN TRACK™ ACT™12 / ACT™12 SOD, CLEAN TRACK™ ACT™8Z, and CLEAN TRACK™ ACT™ M. In etch, TEL addresses anisotropic etching and selectivity requirements for advanced devices and states that it has the second-largest market share in dry etch systems. Episode™ UL is a 300mm plasma etch system with flexible multi-chamber configurations, a smaller footprint, maintenance features, and smart-tool technology, while Tactras™ is a 300mm plasma etch system released in 2006 and Certas LEAGA™ is a 300mm gas chemical etch system for applications from volume manufacturing to next-generation device development. The etch lineup also lists UNITY™ Me+ as a plasma etch system. For cleaning, TEL describes removal of foreign material and drying as essential between processes and states that it has the second-largest share of wafer cleaning systems while developing cleaning technologies for advanced semiconductor devices. CELLESTA™ -i MD is a 300mm single-wafer cleaning system supporting processes at the 10nm technology node and beyond, CELLESTA™ -i is a 300mm single-wafer cleaner with improved productivity and reduced footprint, and EXPEDIUS™ -i is a 300mm batch auto wet station based on the EXPEDIUS™ + platform. Other cleaning products include CELLESTA™ MS2, NS300Z, NS300+ 200mm Conversion, NS300+ HT, NS300, ANTARES™, and ZETA™＋200/300/Semi-auto. In test, Prexa™ is a fully automated 300mm wafer prober supporting KGD testing for advanced packaging, Prexa™ SDP is a singulated-device prober with high-accuracy contacts and temperature control for KGD sorting of high-heat-generation devices, and Cellcia™ is a 300mm multi-cell wafer probing system designed to improve test efficiency and reduce total testing cost. Additional test products include Prexa™ MS, WDF™ 12DP+, Precio™ XL, Precio octo™, PN-300, and network-based or operation-support functions for wafer probers. For bonding and debonding, TEL applies technologies accumulated through its 60-year history to 3D-stacked-device manufacturing, including Synapse™ V / Synapse™ Z Plus for temporary bonding and debonding of 300mm wafers and Synapse™ Si for 300mm-device bonding with fusion bonding and Cu hybrid bonding. TEL has also announced Epsira™ as a DX solutions concept for improving equipment and field-operation productivity, Ulucus™ LX as an Extreme Laser Lift Off System for 300ｍｍ wafer-bonded devices, and Acrevia™ as a Gas Cluster Beam System for ultra-fine patterning in EUV lithography. The same announced-product set includes Episode™ 1 and Episode™ 2 DMR single-wafer deposition systems, reinforcing the company's single-wafer deposition offering alongside its other patterning-process systems. TEL's service scope includes TELCustomer with 24/7 access to parts, manuals, services, and order processing, plus TELCertifiedUsed inventory that supports customization of certified used equipment.
Capabilities and products
- 300mm batch thermal processing systems
- 300mm semi-batch ALD system
- 300mm single-wafer CVD system
- EUV coater/developer systems
- 300mm plasma etch systems
- 300mm gas chemical etch system
- 300mm single-wafer cleaning systems
- 300mm batch wet cleaning system
- fully automated 300mm wafer prober
- KGD sorting prober for high-heat-generation devices
- temporary bonding and debonding of 300mm wafers
- 300mm fusion and Cu hybrid bonding
- 300mm wafer laser lift-off system
- Gas Cluster Beam system for ultra-fine EUV patterning
- Oxide/Anneal thermal deposition systems
- ASFD deposition systems
- PVD sputtering systems
- plasma-enhanced batch thermal ALD systems
- 300/200mm coater/developer systems
- single-wafer cryokinetic cleaning systems
- singulated-device probers
- wafer/dicing-frame probers
- data management systems for wafer probers
- network-based advanced functions for wafer probers
- operation support systems for wafer probers