At a glance
| Booth | Q6134 |
| Country | JP |
| Website | www.tokyodiamond.com/english/product/list/industries/sc_device |
Company profile
Tokyo Diamond Tools Mfg. Co., Ltd. was founded in 1932 and has spent more than ninety years researching, producing, and selling diamond and CBN, or cubic boron nitride, superhard tools for precision manufacturing. The company is headquartered in Meguro, Tokyo, and has production, research and development, and sales bases in Japan and overseas, including overseas bases in Thailand and Singapore for customer support and service. Its tools and processing solutions serve semiconductors, electronic components, automotive parts, precision machinery, medical devices, optical components, and construction, linking superhard-tool technology to a wide range of manufacturing industries. Core processing technologies include cutting, grinding, polishing, and drilling, using the hardness, wear resistance, and machining characteristics of diamond materials to support product quality, production efficiency, and process stability. Across its history, the company describes a progression from early mechanical-processing industries into electronics, information and communications, and semiconductor applications while continuing to invest in superhard-material processing experience and R&D. Its standard product families include diamond grinding wheels, CBN wheels, electroplated wheels, cutting tools and cut-off wheels, diamond drills and drilling tools, single-crystal diamond cutting tools, dressers, and special custom processing tools. The company applies these tools to silicon wafers, compound semiconductors, ceramics, glass, sapphire, superhard alloys, silicon carbide or SiC, gallium nitride or GaN, quartz, and other hard and brittle materials. Beyond standard products, Tokyo Diamond Tools Mfg. Co., Ltd. provides custom design and joint development for different materials, equipment, and machining conditions, addressing actual production issues through application-specific tool proposals. Its technical consulting scope extends from tool selection and machining-condition optimisation to mass-production introduction, supported by accumulated processing knowledge and application data for superhard materials. The company states that it has a technical research organization and R&D team that continue developing new materials, new processes, and new tools while working with customers on machining challenges. Material analysis, machining tests, and verification in actual production are used to improve product performance and tool life, connecting research activities with manufacturing validation. For semiconductor manufacturing, the company identifies wafer cutting, wafer grinding, package-substrate processing, and advanced-material processes as established application areas for its diamond-tool technologies. It specifically addresses the processing difficulty and tool wear associated with third-generation semiconductor materials such as SiC and GaN by continuing to develop high-performance diamond tools and process technologies for precision, efficiency, and surface-quality requirements. The company also describes an environmental and sustainability approach based on contributing to natural circulation, improving energy efficiency and resource use, extending tool life, improving machining efficiency, and reducing material waste and manufacturing environmental burden. Its corporate-responsibility direction includes building a safe, healthy, and trustworthy working environment while pursuing business development alongside environmental protection and efficient resource use. Looking forward, Tokyo Diamond Tools Mfg. Co., Ltd. states that it is strengthening global development and R&D for growth markets including semiconductors, electronic components, new-energy vehicles, medical applications, and advanced precision manufacturing as digitalisation, smart manufacturing, AI, and new-energy industries develop.
Exhibits
For semiconductor-device processing, Tokyo Diamond Tools Mfg. Co., Ltd. offers the porous vitrified bond wheel VEGA for intermediate and final processing of SiC and GaN wafers, with a structure combining ultra-fine diamond abrasive grains and large and fine pores in a vitrified bond. VEGA is described as having a larger pore diameter and higher porosity than conventional wheels to maximise biting performance on work materials, and it is particularly suited to SiC-wafer surface grinding, including grinding 6-inch SiC wafers without dressing. The VEGA product description also states that spontaneous blade generation maintains cutting quality and that the wheel can provide stable high-quality surfaces and lower processing cost during SiC and GaN wafer finishing work. The Taffair porous metal bond wheel is intended for compound-semiconductor wafers such as sapphire or SiC, using a porous metal-bond structure to improve biting and heat dissipation while combining abrasion resistance with maintained cutting quality and longer tool life. Metarex diamond wheels use a metal-bond concept intended to combine the cutting performance associated with resin bonds and the abrasion resistance of metal bonds for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz. For semiconductor-wafer edge grinding or beveling, the company offers wheels for silicon, SiC, sapphire, LT or lithium tantalate, LN or lithium niobate, GaN, GaAs, and quartz, including ME-bond wheels for silicon-wafer chamfering with sharpness and groove-shape retention. The edge-grinding range also includes bond wheels for SiC and sapphire with sharpness and grinding durability, electrodeposition-bond chamfering wheels for small and medium production volumes, and LT or LN specifications intended to suppress chipping on brittle wafers. In addition to general R-shaped and T-shaped grooves, the beveling-wheel offering can cover special groove shapes such as asymmetrical profiles, and the silicon-wafer ME-bond description links improved finished roughness to reduced polishing after chamfering and lower post-process time and consumable use. Diamond notch wheels are used for chamfering and finishing semiconductor-wafer notches, with runout accuracy of the diamond layer to the shank attributed to the company's original processing technology and specifications offered for silicon, SiC, LT, LN, quartz, and sapphire wafers. Diamond multi-layer wheels combine multiple grinding stages in one wheel so rough grinding, pre-finishing, and finishing can be performed on a single machine without tool replacement, using combinations such as metal bonds for roughing and resin bonds for pre-finishing and finishing. For semiconductor polishing pads, electroplated pad-conditioning dressers use selected diamond abrasive grains electroplated to a base metal to provide stable dressing or conditioning and reduce individual differences; listed work materials include urethane, non-woven fabric, and suede pads. BL porous resin bond wheels are designed for mirror finishing of difficult-to-cut materials including cemented carbide or tungsten-carbide molds, ceramics, silicon wafers, and hardened steel alloys, using pores and a heat-resistant bond strengthened by special filler to maintain cutting performance while producing high-quality finished surfaces. The package-board cutting range includes precision diamond blades in rim-saw type with a metal base and all-blade type, with a metal bond intended to maintain sharpness and cutting quality and resist deterioration caused by copper adhesion. Depending on blade thickness and particle size, a V-face cutting-edge shape is used to suppress initial board chipping, and the company can also provide a dress board selected to match blade specifications. These package-cutting blades are used not only for package boards but also for laminated ceramics, magnetic materials, and optical glasses, broadening the cutting application beyond semiconductor packaging substrates. Diamond polishing products and diamond slurry are provided for lapping and polishing high-hardness materials such as glass, ceramics, ferrites, sapphires, and cemented carbide or tungsten carbide when high-precision surface finishing is required, with highly precise diamond powder used in slurry products.
Capabilities and products
- porous vitrified bond wheel for SiC/GaN wafer finishing
- porous metal bond wheel for compound semiconductor wafers
- high-efficiency diamond wheels for difficult-to-cut materials
- semiconductor wafer edge grinding and beveling wheels
- diamond notch wheels for semiconductor wafer chamfering
- diamond multi-layer wheels for multi-stage grinding
- electroplated conditioning dresser for semiconductor polishing pads
- precision diamond blades for package-board cutting
- diamond slurry for lapping and polishing high-hardness materials
- dressing-free surface grinding of 6-inch SiC wafers
- diamond grinding wheels
- CBN grinding wheels
- electroplated wheels
- cutting tools and cut-off wheels
- diamond drills and drilling tools
- single-crystal diamond cutting tools
- dressers
- special custom processing tools
- custom tool design and joint development
- superhard-material machining technical consulting
- porous resin bond wheels for mirror grinding difficult-to-cut materials