At a glance
| Booth | K2370 |
| Country | TW |
| Website | titan-semi.com |
Company profile
Titan-Semi Co., Ltd. focuses on semiconductor, packaging, IC carrier-board, and SMT application fields and provides a broad service scope covering materials, equipment, automation, and customization. The Titan-Semi team was established in 2007 and is described as helping customers identify suitable combinations of materials and equipment for their processes. Its business is presented as process support and solution provision for semiconductor packaging, IC substrate or carrier-board production, and SMT-related applications rather than integrated device manufacturing. The company's stated service model links materials and production equipment with automation and customized support, allowing the supplied scope to be matched to the customer's process rather than limited to a single product category.
Exhibits
Titan-Semi Co., Ltd. lists Wafer plating liquid flux as part of its semiconductor-process material offering. Its flux and solder-related product list also includes WL-CSP ball drop flux, Flip Chip Jetting / Dipping flux, Ball attached flux, Low residual flux, Water Soluble Solder Paste, and No Clean Solder Paste. Additional listed process materials and cleaning products include Kao De-Flux Cleaner and various adhesive tapes for semiconductor processes. On the equipment side, Titan-Semi Co., Ltd. lists a Vacuum Re-flow system, also written as Vacuum Reflow System in the product information. Named equipment models in the same product information include MK-BP2000, Minami MK-878SVW, and Minami MK-878SVMAF. The listed equipment and process categories further include Micro Ball / FOPLP, Dicing, Sawing, and PCB Singular, Mask surface Inspection system, and In line De-flux Cleaner. These named materials and systems sit within Titan-Semi's broader supply scope of materials, equipment, automation, and customization for semiconductor, packaging, IC carrier-board, and SMT applications. The product range therefore spans fluxes and solder pastes, process cleaning products, semiconductor-process tapes, vacuum reflow equipment, named MK and Minami models, micro-ball or FOPLP-related offerings, singulation-related equipment, mask-surface inspection, and in-line de-flux cleaning. Titan-Semi combines its named materials and equipment into a portfolio for multiple steps in semiconductor, packaging, carrier-board, and SMT production environments, with automation and customization extending the offering beyond individual product categories. The same service scope also includes automation and customized support, so the listed materials and equipment can be provided as part of a process-specific combination selected for customer requirements.
Capabilities and products
- wafer plating liquid flux supply
- WL-CSP ball drop flux supply
- Flip Chip jetting/dipping flux supply
- ball attach flux supply
- low-residue flux supply
- water-soluble solder paste supply
- no-clean solder paste supply
- de-flux cleaner supply
- semiconductor process tape supply
- vacuum reflow system supply
- Micro Ball / FOPLP equipment supply
- dicing, sawing and PCB singulation equipment supply
- mask surface inspection system supply
- in-line de-flux cleaner supply
- semiconductor process automation and customization services