At a glance
| Booth | K3367 |
| Country | JP |
| Product categories | Device Handling; Feeding Systems · Die Sorter; Pick & Place; Flip Chip Placement Systems · Vision; ID; Bar Code Systems · Discrete Component Test Systems · Environmental Stress Systems - Temperature; Humidity; Pressure; HAST · Failure Analysis Systems · Functional Test Systems · Handlers; Positioner Systems · Linear Test Systems · Logic Test Systems · Package Test Systems · System on a Chip (SOC); Mixed Signal Test Systems · Test Contactor Cleaning; Conditioning Systems · Test Head Manipulators and Docking Stations · Test Services or Consulting |
| Website | www.tesec.co.jp/en |
Company profile
Tesec is a global pioneer in power semiconductor testing, trusted for over 50 years. Our cutting-edge technologies for high-voltage and high-current measurement deliver high-efficiency, high-quality testers that cover the full range of power device formats—from wafers and chips to packages and modules. Whether it is static or dynamic characterization, Tesec solutions are designed to meet the demanding needs of today’s power semiconductor market. Paired with our wide variety of reliable and flexible handlers,we help manufacturers boost productivity and accelerate innovation. Tesec’s proven expertise and forward-looking solutions continue to drive the future of the global semiconductor industry. ◆ TESEC offers: ・Film Frame Test Handler ・Die Sorter ・Gravity Handler ・MEMS Handler ・TAB Handler ・Discrete Device Test System ・IPD/IPM Test System ・Thermal Resistance Tester ・Inductive Load Tester ・Dynamic Test System We look forward to welcoming you at our booth!
Capabilities and products
- Die Sorter
- Dynamic Test System
- Film Frame Test Handler
- Inductive Load Tester
- MEMS Handler
- Thermal Resistance Tester
- high-voltage and high-current measurement testers
- power semiconductor testing
- static and dynamic power-device characterization
- testers for wafers, chips, packages and power modules