At a glance
| Booth | R8201 |
| Country | TW |
| Website | www.tescan.com |
Company profile
TESCAN GROUP TAIWAN Co. Ltd develops and manufactures advanced electron-microscopy solutions for materials science, life sciences, semiconductor research, industrial R&D, and quality control. The company focuses on imaging performance, automation, usability, and long-term collaboration, using reliable microscopy workflows to help researchers see otherwise invisible details and accelerate discovery.
Exhibits
Tescan workflows use FIB-SEM, STEM, and micro-CT systems to analyze structures, defects, and interfaces from R&D through production, with support for precise delayering, TEM lamella preparation, non-destructive 3D imaging, and package-level cross-sectioning for fault isolation, advanced-packaging validation, and root-cause analysis. For energy-storage work, the workflows combine high-resolution imaging, multimodal analysis, and non-destructive 3D visualization to examine particle morphology, electrode interfaces, and failure mechanisms while maintaining sample integrity, with automation for reproducible data across raw-material optimization, cell design, and recycling. Tescan FIB-SEM systems combine high-resolution electron imaging with ion-beam modification for nanoscale characterization, sample preparation, nanomachining, cross-sectioning, tomography, and analytical investigation in materials science, semiconductors, battery research, life sciences, and geoscience. The portfolio includes Ga+ FIB systems for ultra-precise nanofabrication and TEM sample preparation and Xe plasma FIB-SEM systems for rapid large-volume milling and high-throughput workflows, with modular architectures, field-free ultra-high-resolution SEM imaging, integration options including EDS, EBSD, ToF-SIMS, Raman, and in-situ experimentation, and automation for TEM lamella preparation, serial-section tomography, and multidimensional correlative analysis. Tescan AMBER™ 2 combines BrightBeam™ field-free SEM optics, the Orage™ Ga+ FIB, and automated lamella workflows for planar and inverted TEM sample preparation, nanoprocessing, and final polishing; an optional Argon Gentle Ion Beam™ below 200 eV supports lower-damage final polishing, and integrated FIB milling, e-beam lithography, and material deposition support nanoscale prototyping. Tescan AMBER X™ 2 combines Mistral™ Xe Plasma FIB and BrightBeam™ UHR SEM for large-volume sectioning and TEM lamella preparation across hard, soft, or beam-sensitive materials, supports EDS, EBSD, ToF-SIMS, and Raman workflows, and combines 3D tomography, TEM preparation, and multimodal analytics in one platform. Tescan SOLARIS™ 2 is a dedicated Ga+ FIB-SEM platform for automated high-precision TEM sample preparation in semiconductor workflows with sub-10 nm features, integrating Triglav™ SEM, AutoTEM Pro™ software, and the OptiLift™ nanomanipulator for hands-free lamella preparation in planar, inverted, or top-down geometries. SOLARIS™ 2 uses AI-driven automated lamella workflows for repeatability and throughput, Triglav™ SEM and in-column detectors for nanoscale end-point targeting at beam coincidence, and overnight auto-alignments and unattended batch processing to reduce downtime. Tescan SOLARIS X™ 2 combines Mistral™ Xe Plasma FIB, UHR SEM imaging, and Rocking Stage cross-sectioning for semiconductor failure analysis, with fast defect localization, Xe-based Ga+-free TEM preparation, deep curtaining-free TRUE X-sectioning for heterogeneous stacks and polymers, and guided end-pointing and automated alignment for standardized workflows.
Capabilities and products
- FIB-SEM systems for high-precision imaging and sample preparation
- STEM analysis systems
- micro-CT analysis systems
- precision delayering
- TEM lamella preparation
- non-destructive 3D imaging
- package-level cross-sectioning
- Ga⁺ FIB nanofabrication and TEM sample preparation
- Xe plasma FIB-SEM large-volume milling