At a glance
| Booth | N0031 |
| Country | TW |
| Website | www.technic.com |
Company profile
Technic Taiwan Co., Ltd. presents Technic chemistry solutions for advanced semiconductor packaging, drawing on more than 75 years of engineered-solution experience. Technic's electrodeposition chemistries are marketed under the Elevate name for applications including RDL, pillars, microbumps, and LED packaging. The company also supplies photoresist strippers for liquid and dryfilm resists together with metal etchants and cleaners marketed under the TechniStrip®, TechniEtch, and Techniclean names. For analytical control, Technic identifies the RTA 3D for damascene copper and backend-packaging applications, including control of TSV and copper-pillar processes.
Exhibits
Technic offers semiconductor electroplating tools ranging from laboratory and small-scale production plating technologies to fully automated production equipment for electroless processes such as ENIG and ENEPIG. The equipment range extends from single-cell countertop testing devices to fully enclosed automatic rack-transport systems with multi-programmable functions. The Semcon 1000 is designed for research and low-volume production and is used for wafer electrodeposition evaluation and application-performance testing. The Semcon 2000 is a wet-bench, multiprocessing electroplating tool intended to provide plating accuracy with a high degree of uniformity and repeatability. The Semcon 2500 is an automatic, fully enclosed, multi-wafer rack system for electroless and immersion processes such as ENIG and ENEPIG, with a programmable multi-process interface and access for maintenance or changeovers in process-development and full-scale-production settings. The wider semiconductor portfolio includes electroplating chemistry, photoresist strippers, cleaners for post-etch residue removal, metal etchants, high-purity wet chemistry, and semiconductor manufacturing equipment. Elevate® semiconductor fabrication and packaging electroplating chemistries are part of this portfolio, linking the Taiwan presentation with Technic's broader semiconductor chemistry range. Photoresist strippers are supplied for both liquid and dryfilm resist, while metal etchants and cleaners are supplied for substrates used in wafer-level surface preparation. Technic also lists ultra-high-purity wet chemicals for semiconductor fabrication, including acids, bases, solvents, and hydrogen peroxide, with the stated availability limited to the EU. SEMCON Semiconductor Electroplating Tools are described as wet-bench wafer-metallization tools for the semiconductor industry. The Real Time Analyzer RTA 3D is presented for real-time monitoring of electroplating solutions in high-precision semiconductor applications such as copper damascene and TSV. The Elevate Analyzer is designed specifically for Elevate semiconductor electroplating solutions and provides rapid analysis of individual components so users can monitor and control production plating baths. Together, the listed products cover electrodeposition chemistry for advanced packaging, wafer-level stripping, etching and cleaning, electroplating tools for research through production, and analytical control for plating processes. Technic groups its semiconductor electroplating chemistry into copper, nickel and tin, and precious metals, with sulfite gold, cyanide-based gold, and other precious-metal products listed as subcategories. It separately lists semiconductor photoresist strippers, metal etchants, cleaners, Analytical Control RTA, High Purity Chemistry, Semcon 1000, Semcon Fountain, Semcon 2000, Semcon 2500, and Semcon Wafer Racks. This organization connects chemistry, equipment, and controls: chemical categories prepare or plate wafer-level surfaces, Semcon tools execute electroplating or related wet processes, and RTA or Elevate Analyzer systems monitor process chemistry. Technic also identifies a broader industrial surface-finishing range with pretreatment cleaners, activators and etchants, electrolytic plating categories for nickel, tin, silver and copper, and electroless, immersion and post-treatment processes. For printed circuit boards, listed chemistry categories include photoresist developers and strippers, preclean and microetch products, desmear chemistry, metallization, copper and tin plating, electroplated final finishes, and immersion final finishes. The combination of RDL, pillars, microbumps, LED packaging, damascene copper, TSV, and copper-pillar control places the described chemistry and analytical tools across both advanced packaging and semiconductor metallization workflows. For ENIG and ENEPIG work, the Semcon 2500 is the explicitly named multi-wafer platform, while the wider equipment line also covers single-cell testing devices and automatic rack-transport systems with programmable functions. For research and lower-volume process development, the Semcon 1000 provides wafer electrodeposition evaluation and performance testing, while the Semcon 2000 provides a wet-bench multi-process configuration focused on plating uniformity and repeatability. Taken together, the Taiwan-facing offering includes chemical brands, named analytical systems, and multiple Semcon equipment formats rather than a single product category.
Capabilities and products
- Electroplating chemistries for RDL, pillars, microbumps and LED packaging
- Photoresist strippers for liquid and dry-film resists
- Metal etchants for semiconductors
- Real-time analysis and control of plating solutions for copper damascene, TSVs and copper pillars
- Wafer electroplating equipment for R&D and small-scale production
- Multiprocess wet-bench electroplating equipment
- Fully automated electroless and immersion plating equipment for ENIG/ENEPIG
- Wafer post-etch residue removers
- Ultra-high-purity acids, bases, solvents and hydrogen peroxide, supplied in the EU only
- Composition analyzers for copper, nickel and tin plating solutions