At a glance
| Booth | N0290 |
| Country | TW |
| Website | product.tdk.com/en/products/fa/index.html |
Company profile
TDK Corporation was established in 1935 as a venture business born out of academic research, with the goal of achieving the world's first commercialization of the magnetic material ferrite. Ferrite had been invented at the Tokyo Institute of Technology, but its possibilities were still unknown, and TDK describes its early direction as being driven by belief in that material's potential and a desire to create something unprecedented. As the electronics industry grew in size and influence, TDK states that the original commercialization ambition was realized and that the company continued to act as an agent of change. Throughout the eight decades since the company's founding, TDK says it has built on a strong foundation in magnetics technology derived from ferrite while continuing to develop products intended to have true value. The company also emphasizes maintaining the venture spirit of its beginnings while exploring new technologies and preserving a dedication to craftsmanship expressed through the Japanese Monozukuri concept. TDK connects that Monozukuri approach with dedication to quality and a new era of electronic craftsmanship, which it says has enabled an ongoing succession of innovative and valuable products.
Exhibits
For manufacturing environments such as semiconductor facilities and flip-chip mounters, TDK notes that required cleanliness is continually increasing and reports a particle score in a PWP test described as the world's best ever recorded level. Its next-generation mini-environment systems are equipped with a FOUP load port that is compatible with every company's 300-mm FOUP without adjustment through an air-cushion system. The same mini-environment systems include an automatic nitrogen purge, combining the no-adjustment 300-mm FOUP interface with automated purge capability for clean manufacturing use. TDK also manufactures and sells flip-chip mounting systems that it describes as highly reliable, space saving, and economically priced. The company says these FA systems are developed after evaluating production-site needs from the user's perspective, linking the equipment design to practical operating requirements in manufacturing plants. Within its FA Systems offering, TDK identifies FOUP Load Port and Flip Chip Bonding System as products in this manufacturing-equipment category. Within the same FA Systems offering, TDK repeats the no-adjustment compatibility with every company's 300-mm FOUP, the air-cushion mechanism, automatic nitrogen purge, and the availability of flip-chip mounting systems, reinforcing those capabilities as the core semiconductor-related offering. Together, the listed systems address clean wafer-container interfacing and flip-chip mounting, two equipment functions tied directly to semiconductor manufacturing environments where TDK says cleanliness requirements are rising. The FOUP load-port design combines the air-cushion mechanism with universal 300-mm FOUP compatibility as described by TDK, avoiding adjustment when handling FOUPs from different companies. Automatic nitrogen purge is integrated into the same next-generation mini-environment platform rather than being presented as a separate stand-alone function. TDK positions both the mini-environment platform and flip-chip mounting systems within its FA Systems offering, alongside product information and technical support resources. As an electronic-component supplier, TDK says it brings these systems to users only after examining production-site needs from the user's perspective, tying the product concept to actual factory requirements.
Capabilities and products
- 300-mm FOUP no-adjustment Load Port
- automatic nitrogen Purge system
- flip-chip mounting system manufacturing and sales