At a glance
| Booth | Q6134 |
| Country | JP |
| Website | mirror-polish.com/?lang=en |
Company profile
TDC Corporation is a Japanese specialist in ultra-precision polishing and lapping, achieving sub-micron to nanometer accuracy on flat, curved, and complex geometries across a variety of materials. Its technologies serve a wide range of industries and research fields, and the company works in collaboration with universities, institutes, and manufacturers around the world. TDC combines manufacturing and finishing services so that finished components can be controlled not only for geometry but also for surface roughness, flatness, and reliability. The company also presents its role as solving research and development challenges with nano-level precision. TDC identifies its headquarters and factory in Miyagi, Japan. Its core service set includes CMP, polishing, lapping, and grinding, together with precision cleaning in Class 3 facilities using ultra-pure water and measurement and inspection with instruments such as Bruker Dimension Icon, Taylor Hobson Talysurf, Hamamatsu Optical Nano Gauge, Mitutoyo, and Keyence systems. Beyond polishing, TDC also offers CMP, grinding, wafer thinning, wafer bonding, and wafer cleaning services. Its precision-processing experience is applied in electronics, semiconductors, optics, medical care, aerospace, automotive, and energy fields, while its electronic-component work includes components used in PCs, smartphones, home appliances, sensors, and semiconductor-related applications.
Exhibits
TDC's precision-polishing supply scope covers a manufacturing flow that includes cutting, grinding, polishing, inspection, cleaning, quality assurance, and shipping, with lapping as a central part of its precision-polishing services. The company uses ultra-high-precision polishing machinery, including lapping machines, and combines processing methods to meet demanding geometry and surface-finish requirements. Its stated precision levels include surface roughness of Ra 1 nm and Rz 4 nm, parallelism of 100 nm, flatness of 30 nm, dimensional accuracy of ±100 nm, angular tolerance of ±3 arcseconds, and sphericity or roundness of 50 nm. For quality assurance, TDC cites Bruker's AFM, Zygo's Aperture System, and an optical surface profiler for checking requirements such as roughness and flatness. Its broader measurement resources include Bruker Dimension Icon, Talysurf and Talyrond instruments, Optical Nano Gauge, Mitutoyo measuring instruments, and KEYENCE systems. Precision cleaning is supported by Class 3 facilities using ultra-pure water, while the production flow also uses ultrasonic cleaning to remove visible stains or deposits. Inspection is performed by professional staff in a clean measurement room at 20 ± 2 °C, and specialized staff check final products individually and provide inspection data with delivery. TDC processes metals, ceramics, crystalline materials, resins, glass, semiconductor materials, and diamond; examples include stainless steel, superalloy, copper, titanium, aluminum, molybdenum, tungsten, nickel, tantalum, Al2O3, ZrO2, SiC, Si3N4, SiO2, BK7, quartz, Si, GaN, sapphire, LiTaO3, LiNbO3, PEEK, PMMA, and PEFE. The company polishes flat and curved surfaces as well as spherical surfaces and the inner and outer diameters of cylindrical forms, and it states that it can accommodate customer-required shapes across a wide range of materials. Its polishing service covers workpieces from a few microns up to 800 mm in size. In lapping, workpieces are placed on a flat disc-shaped lap plate, abrasive slurry is introduced while pressure is applied from the top and bottom, and both the plate and workpieces rotate as progressively finer abrasive grains are used toward the final precision. By adjusting the amount of polishing and the slurry composition according to the target accuracy, material, and workpiece shape, TDC performs precision machining at both micrometer and nanometer scales. For roll and shaft applications, TDC lists super-precision mirror-polished rolls and shafts and highly polished rolls for nano-imprinting molds. Its long-foil polishing technology is offered for metal foils exceeding 100 meters in length. For diamond substrates, TDC states surface roughness of Sa 0.2 nm, flatness of 0.5 um, and current polishing capacity for samples up to 40 mm. Its precision shims, spacers, and washers are designed to reduce thickness dispersion, support high assembly precision and reproducibility, and reduce looseness after long-term use; standard shims are listed for M2 through M8. In electronic-component applications, TDC uses mirror finishing together with ultra-precision control of flatness and parallelism, including work on light-guide plates that require high precision. The company reports production experience with sensor chips, sensor heads, sensor probes, crystal materials, and wafer polishing. Wafer polishing is listed for sizes up to φ8 inches. For electronic components, TDC also states that it can handle mass production in large lots while maintaining reproducible high-accuracy processing across large quantities. For wafer chuck plates and precision tables used in semiconductor manufacturing equipment and precision measuring machines, TDC controls flatness, parallelism, dimensional tolerance, and requested surface texture such as smooth or satin-ground finishes. It performs precision CMP and thin polishing on crystal wafers made from materials including silicon, sapphire, SiC, and diamond, supporting quantities from one sheet and small experimental lots through mass production. Its shim examples include accuracy levels of ±0.5 μm and ±1 μm with thickness variation of 1 μm for precision measuring machines, electronic devices, and medical devices. TDC also processes test pieces for friction and wear tests and tensile tests across various materials, with quick-delivery work included in the stated service scope. Surface-plate services cover reference planes used in assembly and inspection where absolute flatness is required, including stone, ceramic, and thermal-sprayed surface plates. For molds used in plastic working, press working, and injection molding, TDC performs precision polishing on both flat and complex forms, including uneven lens shapes. The company also processes spheres for high-precision bearings and measuring probes, where both sphericity and surface roughness are important. Across these services, TDC supports material procurement and test pieces, difficult-to-cut materials, and production volumes ranging from single pieces to mass production. The resulting processing portfolio is applied to electronic components, semiconductors, optics, medical care, aviation and space, automobiles, and energy, linking nano-scale polishing with semiconductor and precision-component manufacturing requirements.
Capabilities and products
- Nanometer-level precision polishing and lapping
- Wafer thinning
- Wafer bonding services
- Ultrapure-water and ultrasonic cleaning of wafers and parts in a Class 3 environment
- CMP processing of multi-material wafers
- Precision cutting
- Precision grinding
- Machining of wafer chuck plates and precision tables
- Machining of test pieces for friction, wear and tensile testing
- Precision surface plate machining
- Precision mold and die polishing
- Precision spherical machining for bearings and measuring probes
- Precision polishing of 8-inch wafers
- Machining of sensor chips, sensor heads and sensor probes
- Mirror polishing of nanoimprint mold rolls and shafts
- Polishing of metal foils longer than 100 meters
- Low-damage diamond substrate polishing
- Ultra-precision shims, spacers and washers
- Precision measurement of surface roughness and flatness