At a glance
| Booth | L0400 |
| Country | JP |
| Product categories | Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Line Width; Critical Dimension (CD) Measurement · Overlay Measurement · Package Inspection; Lead Scanners · Particle Monitors; Analyzers - Airborne or Liquid · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Weight measurement; precision scales |
| Website | takano-net.com.tw |
Company profile
TAKANO provides inspection and metrology for advanced package!! Taiwan: https://takano-net.com.tw Japan: https://www.takano-kensa.com ・Inspection and Metrology System for Semiconductor ① [WM-7SR] Non-Pattern Surface Inspection System (2inch~8inch) ② [WM-10R] Non-Pattern Surface Inspection System (4inch~12inch) ③ [Vi Series] Wafer Pattern Inspection System ④ [ALTAX] Hi-speed Height Inspection System for Bump Height ⑤ [Thinspector] Wafer Surface Thin Film Analysis Inspection System Looking forward to seeing you at SEMICON Taiwan 2024.
Exhibits
Inspection Inspection judgment processing, noise reduction processing, spatial filter, defect map display Review Defect list(Map / coordinate data), defect image display, trend graph, statistical processing, etc
Capabilities and products
- ALTAX high-speed bump-height inspection system
- Thinspector wafer surface thin-film analysis inspection system
- Vi Series wafer pattern inspection system
- WM-10R non-pattern surface inspection system for 4-to-12-inch wafers
- WM-7SR non-pattern surface inspection system for 2-to-8-inch wafers
- semiconductor inspection review with defect maps and coordinate data