At a glance
| Booth | L0001 |
| Country | TW |
| Website | www.cosei-tech.com |
Company profile
Takai Precision Co., Ltd is part of KD Group, which was established in 2008 and comprises four subsidiaries: COSEI Technology, Takai Precision, GOTEX Electroptic, and TAKANAMI Trading. KD Group's business scope covers PCB and substrate buffing consumables, buffing equipment for PCB, substrate, and IC packaging applications, as well as contract manufacturing and operations in China. With more than a decade of experience in grinding-related technologies, the group states that it provides professional and practical solutions tailored to customer needs, focuses on maximizing product value, and uses efficient and flexible service capabilities in its grinding-solution business. The group also provides solutions for removing resin burrs and package overflow from QFN, DFN, and other package types as an alternative to conventional chemical deflash processes, with the stated benefits of reducing environmental impact, secondary contamination, and post-treatment challenges. COSEI Technology was established in 2008 and develops and sells grinding materials including ceramic brush wheels, nonwoven brush wheels, foamed brush wheels, exposure Mylar, cleaning tape, release film, carrier film, and protective film, together with grinding-solution services. TAKANAMI Trading was established in 2009 and handles sales and service in the China market for grinding materials, equipment, parts, and maintenance, with products including ceramic brush wheels, nonwoven brush wheels, foamed brush wheels, grinding machines, sandblasting machines, and X-RAY drilling target machines. Takai Precision was established in 2010 and sells and maintains equipment including brush grinding machines, sandblasting machines, belt sanding machines, copper-powder recovery machines, and dry-ice cleaning machines. Takai Precision also provides maintenance and parts sales for laminating machines and X-RAY drilling target machines. GOTEX Electroptic was established in 2011 and provides PCB hole-plugging subcontracting together with professional grinding subcontracting for different substrates. Across these group companies, grinding materials, grinding equipment, subcontract processing, equipment service, parts, and maintenance are organized around PCB, substrate, and IC-packaging production needs.
Exhibits
NPV, or Negative Pressure Vacuum Hole-plugging Printing, is a patented hole-plugging printing technology that the company describes as unique in the industry and especially effective for micro-hole diameters below 0.2mm. Using a 1.7mm-thick substrate as an example, the NPV process can perform fast single-point plugging of 0.2mm holes and substantially reduce air-bubble problems inside the holes. HGT, or Homogenization Grinding Technology, uses differential grinding on substrates with uneven surface copper after plating to turn them into substrates with very small copper-thickness differences. The HGT process is not limited by substrate size and is presented as suitable for factory mass-production requirements. The company links improved surface-copper thickness uniformity to higher circuit yield for advanced substrates and to subsequent development of ultra-fine circuitry, while also describing HGT as having a production-cost advantage over chemical processes. Its vacuum hole-plugging grinding OEM services include resin hole-plugging grinding, professional copper-reduction grinding, various pretreatment grinding processes, grinding for special requirements, and ultra-thin-board grinding. Daily grinding capacity is listed as 4,000 square feet for vacuum hole-plugging grinding, 6,000 square feet for screen-printing hole-plugging grinding, and 3,000 square feet for professional copper-reduction grinding. The resin-plug subcontracting scope includes vacuum differential hole-plugging technology and is presented with high-yield and high-capacity performance. Daily hole-plugging capacity is listed separately as 3,000 square feet for vacuum hole plugging and 5,000 square feet for screen-printing hole plugging. The broader KD Group product and service range supporting these processes includes ceramic, nonwoven, and foamed brush wheels, grinding machines, sandblasting machines, X-RAY drilling target machines, cleaning tape, release film, carrier film, protective film, maintenance, and subcontract buffing. For semiconductor packaging, the group supplies buffing equipment used in IC packaging and provides resin-burr and package-overflow removal for QFN and DFN packages. This mechanical removal approach is offered as an alternative to conventional chemical deflash processes for package finishing. Together, NPV hole-plugging, HGT surface homogenization, grinding subcontracting, copper reduction, and equipment maintenance form a process-oriented offering for PCB, substrate, and packaging production environments.
Capabilities and products
- brush-grinding machine sales and maintenance
- sandblasting machine sales and maintenance
- belt-sanding machine sales and maintenance
- copper-powder recovery machine sales and maintenance
- dry-ice cleaning machine sales and maintenance
- laminating-machine maintenance and parts sales
- X-RAY drilling-target machine maintenance and parts sales