At a glance
| Booth | L0528 |
| Country | TW |
| Website | www.fairfield.com.tw |
Company profile
Taiwan Fairfield Electronic Technology CO., LTD. is a high-tech materials trading company focused on imported semiconductor-packaging and electronic materials while also providing process design, solutions, and technical support. Its imported-material portfolio includes conductive adhesives, insulating adhesives, heat-dissipation and thermally conductive materials, potting and encapsulation compounds, gap fillers, dicing films, grinding films, and DAF, with names including Fairfield, Lord, AIM, AMC, AiT, Pi, and Aki-moto. The company serves six areas: hermetic packaging, optical communication, LED packaging and lighting, semiconductor packaging, electronic assembly, and industrial engineering. Typical products include silicon aluminum, conductive silver paste and nanoscale silver paste, insulating paste, thermally conductive potting and encapsulation materials, structural adhesive, and carbon-free trays.
Exhibits
The product lineup includes Conductive Ag Epoxy and insulating adhesives, magnetic coatings, structural adhesives for electronics and EVs, grinding and dicing tape, structural adhesives, gap fillers and potting compounds, nano-sintered silver, RFID heterogeneous conductive adhesive, Die-on-a-Foil (DAF), solder paste and flux, Zero-carbon or Carbon Free Tray, temporary bonding adhesive and film for Glass and Wafer, and Graphene Foam Film. AUD1 is a general-purpose wafer-dicing PVC tape that prevents leakage, chip fly-off, and chipping and is easy to remove after UV exposure; AUD5 is a CIS (CMOS image sensor) dicing PVC tape widely used in Korea for good CIS-chip yield, with the same leakage, chip-fly-off, chipping, and UV-removal functions. AUD7 is a blue PVC dicing tape for small chips with good laser-marking performance through the tape; AUF3 is a strongly adhesive PO tape for PCB and wafer dicing using PO film described as environmentally friendly; AU105-HA is a PO tape for wafer dicing and glass-filter protection that performs well for long-term glass packaging and leaves no residue or stains after UV treatment. AUP165-HC is a small-chip dicing tape with high transmittance for label readability and can cut packaged chips down to 0.6 * 0.3mm; AUP170-HC is a high-adhesion general package dicing tape that allows easy residue-free chip removal after UV irradiation. AUP1 is a Power QFN dicing tape that stably holds thick packages such as PQFN and ceramics and releases chips without residue after UV exposure; AUP4 is a low-odor dicing tape for packages 3 * 3mm or smaller and provides a more comfortable work environment after UV irradiation; AUG2 is a strong-adhesion PET-film tape for glass and LED dicing where firm chip holding is required. AMC dicing tape is described for wafer dicing with high strength, strong adhesion, low residual stress, consistent performance, and multiple sizes to support high yield and high-quality diced wafers. For LORD JMC-700K protective coating, surfaces are cleaned of dirt, grease, and oxidation before application; the coating is stirred thoroughly and can be thinned with LORD JMC-700ST Thinner or ethyl acetate (MEK), applied by dipping or spraying at a recommended dry-film thickness of 10-100 microns, and cured for 30 minutes at 180°C after reaching target temperature. LORD JMC-700K has a shelf life of one year from manufacture when stored in original unopened containers in a well-ventilated place at 21-27°C. LORD JMC-700K is a thermosetting epoxy for thin-film coating of heatsinks and magnets, providing electrical insulation, heat resistance, oil resistance, and single-layer application for automotive uses including electric-vehicle cooling plates, heatsinks, radiators, motor magnets, other automotive parts, and industrial machinery. Its listed JMC-700K performance includes strong substrate adhesion, operation from -40°C to +180°C, resistance to heat, oil, and moisture, passage of a 180°C x 1500-hour heat test, a -40°C to +170°C 1500-cycle test, a 150°C x 2000-hour oil-resistance test, and an 85°C, 85% RH x 2000-hour humidity-resistance test. Thermal conductive adhesives are offered in epoxy, silicone, and special-resin systems with constant-temperature or low-temperature curing, high strength, and high thermal conductivity for heatsinks, flip chips, transformers, high-power LEDs, and bonding of different materials. Epoxy and silicone thermal greases are offered with high thermal conductivity, high-temperature tolerance, high reliability, and simple operation for processes and heat-dissipation uses including heatsinks, flip chips, transformers, and high-power LEDs; thermal gap fillers fill gaps between heat-generating electronic components and heatsinks or chassis to improve thermal conductivity and thermal management in LED lighting, automotive electronics, and computer systems. AI Technology Group die-attach epoxy adhesives provide high bond strength on gold, silver, copper, aluminum, and stainless steel for semiconductor packaging and electronics manufacturing, along with high thermal conductivity and low thermal resistance for heat dissipation. The die-attach epoxy also provides electrical insulation to help prevent shorts between die and lead frame and protect against ESD, cures quickly at room temperature to shorten manufacturing time and increase output, has low outgassing for lower contamination risk in vacuum and space applications, and is RoHS compliant with EU hazardous-substance requirements.
Capabilities and products
- conductive silver epoxy sales and technical support
- insulating adhesive sales and technical support
- thermally conductive potting compound sales and technical support
- thermally conductive adhesive sales and technical support
- thermal grease sales and technical support
- thermal gap-filler sales and technical support
- wafer grinding/dicing tape sales and technical support
- nano-sintered silver sales and technical support
- RFID heterogeneous conductive adhesive sales and technical support
- die-attach film (DAF) sales and technical support
- solder paste and flux sales and technical support
- Carbon Free Tray sales and technical support
- temporary bonding adhesive/film sales and technical support
- Graphene Foam Film sales and technical support
- thermosetting epoxy protective coating sales and technical support
- semiconductor die-attach epoxy sales and technical support