At a glance
| Booth | L0528 |
| Country | TW |
| Product categories | PV: Modules · PV-Building-Integrated Solutions · Solar Thermal · Backgrind; Slicing; Lapping; Polishing Equipment · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Dispensing Systems · Printing Equipment; Screen-printing; Alignment ; Film Printing · Wafer Mount; Taping Equipment · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Marking ink · Molding; Encapsulation; Potting; Resin Materials · Packages; Ceramic and Other High Temp Compounds · Packages; Plastic · Preforms; Lids · Printing Masks; Screens · Scribe Tools; Saw or Dicing Blades and Accessories · Solder; Solder Balls and other Soldering Materials · Tape Automated Bonding (TAB) Accessories · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Thin Film; Dielectric Film Materials · Cleaning Chemicals; Solvents; Strippers · Other Specialty Chemicals · Spin on glass material · Surface protection material; coatings · Alignment Film Materials · End-Sealing Material · Spacer Materials · Gases Materials · CMP; Grind; Lap; Polish; Abrasive materials · Plasma; Ion Sources · Plating Materials · Sealants; Adhesives; Finishes · Computer ; Control ; Communication ; Data Acquisition Systems |
| Website | www.fairfield.com.tw |
Company profile
Taiwan Fairfield Electronic Technology Co.,Ltd. is a high-tech material trading company engaged in sales of imported semiconductor packaging and electronic materials, providing process design and solutions, and strong technical support. Fairfield covers six major industries: hermetic packaging, optical communication, LED packaging and lighting, semiconductor packaging, electronic and assembly, industrial and engineering. Typical products include silicon aluminum, graphite copper, conductive silver paste and nanoscale silver paste, insulating paste, thermally conductive potting & encapsulation, structural adhesive, carbon-free tray etc.
Capabilities and products
- carbon-free trays
- conductive silver paste
- graphite copper electronic materials
- imported semiconductor packaging materials
- insulating paste
- nanoscale silver paste
- process design support for semiconductor packaging materials
- silicon aluminum packaging materials
- structural adhesive
- thermally conductive potting and encapsulation materials