基本資料
| 攤位 | L0528 |
| 國別 | TW |
| 產品分類 | PV: Modules · PV-Building-Integrated Solutions · Solar Thermal · Backgrind; Slicing; Lapping; Polishing Equipment · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Dispensing Systems · Printing Equipment; Screen-printing; Alignment ; Film Printing · Wafer Mount; Taping Equipment · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Marking ink · Molding; Encapsulation; Potting; Resin Materials · Packages; Ceramic and Other High Temp Compounds · Packages; Plastic · Preforms; Lids · Printing Masks; Screens · Scribe Tools; Saw or Dicing Blades and Accessories · Solder; Solder Balls and other Soldering Materials · Tape Automated Bonding (TAB) Accessories · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Thin Film; Dielectric Film Materials · Cleaning Chemicals; Solvents; Strippers · Other Specialty Chemicals · Spin on glass material · Surface protection material; coatings · Alignment Film Materials · End-Sealing Material · Spacer Materials · Gases Materials · CMP; Grind; Lap; Polish; Abrasive materials · Plasma; Ion Sources · Plating Materials · Sealants; Adhesives; Finishes · Computer ; Control ; Communication ; Data Acquisition Systems |
| 網站 | www.fairfield.com.tw |
公司簡介
台灣銘奮電子科技有限公司是一家以銷售進口半導體封裝及電子材料為主 (導電膠/絕緣膠/散熱導熱材料/灌封膠/填縫膠/切割膜/研磨膜/DAF...) ( (Fairfield, Lord, AIM, AMC, AiT, Pi, Aki-moto...) ，以提供工藝設計及解決方案、強大的技術支援為輔的高科技材料公司。公司的產品覆蓋了：氣密性封裝、光通訊、LED封裝和照明、半導體封裝、電子組裝、工業工程共六大行業。 典型產品有矽鋁、金剛石銅、導電銀漿和納米銀漿、絕緣膠、導熱灌封膠、結構膠, 零碳tray盤等。
能力與產品項目
- graphite copper 電子材料
- silicon aluminum 封裝材料
- 半導體封裝材料製程設計支援
- 奈米級銀膠
- 導熱灌封與封裝材料
- 導電銀膠
- 無碳托盤
- 結構膠
- 絕緣膠
- 進口半導體封裝材料