At a glance
| Booth | M0434 |
| Country | TW |
| Website | www.taiwandiamond.com |
Company profile
Taiwan Asahi Diamond Industrial Co., Ltd. was founded in 1967 and manufactures diamond and CBN tools for hard and brittle material processing. The company’s manufacturing scope covers cutting, grinding and lapping, drilling, polishing, drawing and other processing tools. In January 1968, investment and technical cooperation with Asahi Diamond Industrial Co., Ltd. of Japan was approved by the Ministry of Economic Affairs, capital was increased to NT$3 million, and Diamond Core Bits and Diamond Saw Blades were introduced. Sales activities started in January 1969 together with Diamond Wheels, Diamond Dressers, Diamond Bites and Diamond Dies. The production plant moved to Bade, Taoyuan in October 1975, and a new office building and production plants were completed in November 1996. The company announced the quality policy “Innovation, Speed, Service, Profit” in August 2001 and completed the Zhongli Plant in March 2013 for diamond tools used with touch-panel glass. Its 2021 corporate vision states an objective of providing energy-saving, environmentally friendly, high-precision diamond tools. Taiwan Asahi Diamond lists ISO 9001 quality-system certification and describes 5S, QCC and the 2015 introduction of TPS lean production management as internal production-improvement activities. Its customer and application base spans conventional manufacturing, high-technology industries and aerospace component production, with customized service and a one-roof solution approach.
Exhibits
TDC’s product system organizes tools by processing method, including grinding, cutting, cut-off, wire drawing, wear applications, scribing, dressing, drilling and other operations. Application sectors include electronics, semiconductor and optoelectronics; transportation and machinery; optical and glass processing; construction and stone; and wire drawing. Within semiconductor processing, the catalogue includes dressing plates, wafer groove grinding wheels, electroplated diamond wire saws, grinding wheels for multiple wafer types, CMP pad conditioners, silicon-wafer bevel grinding wheels, hub-type precision dicing blades, double-side wafer grinding wheels and electroplated diamond band saws. Surface Grinding Wheels for Wafers are intended for semiconductor wafers, electronic components, packaging and reclaimed wafers, with wheel selection matched to the material and customization reviewed according to customer requirements. The wafer grinding-wheel material list includes Silicon Wafer, Silicon Carbide, Gallium Nitride, Gallium Arsenide, Indium Phosphide, Lithium Tantalate, Lithium Niobate, WLP, PLP, Aluminum Nitride and Aluminum Oxide. Those wafer surface-grinding wheels are described as reducing the processing damage layer, improving process efficiency and reducing production cost. CMP Pad Conditioners are used to regenerate the pad surface, correct pad shape and maintain the wafer polishing rate, with PU listed as the processing material. The semiconductor and optoelectronic catalogue also lists diamond scribing tools, solar-silicon grinding and bevel wheels, bonding tools, package dicing blades, resin wheels for surface grinding, quartz-column electroplated band saws and thread-processing electroplated grinding rods. For optoelectronic materials, products include thin-wall drills for sapphire and silicon, saw blades for sapphire and silicon cutting, sapphire core drills, sapphire backside grinding wheels, sapphire bevel grinding wheels, electroplated diamond wire saws, wafer outer-diameter and orientation-flat grinding wheels, and electroplated diamond band saws. Cut-off tools include hubless precision package dicing blades for electronic materials, hub-type precision package dicing blades for semiconductor materials, quartz-column electroplated band saws, carbide cut-off wheels, multi-blade precision thin-edge wheels for optical glass, and sapphire or silicon cutting saws. The cutting-tool range includes PCD piston tools, PCD and PCBN milling cutters, PCD panel-cutting, trimming and bevel tools for printed circuit boards, PCD and PCBN ream-milling tools for automotive and aerospace components, single-crystal tools for spherical and aspherical optical molds, and single-crystal tools for contact lenses. Transportation and machinery applications include profile grinding wheels for hobs, gear bore grinding wheels, hob grinding wheels, ceramic CBN wheels for linear guides and sliders, carbide end-mill and drill grinding wheels, centerless grinding wheels, micro-drill fluting wheels and double-side grinding wheels for automotive parts. The grinding category also includes optical-glass thinning wheels, wafer groove grinding wheels, solar-silicon grinding and bevel wheels, resin surface-grinding wheels, metal thinning wheels and electroplated grinding rods for thread processing. Grinding-tool performance is described in terms of strong material removal, lower spindle load, reduced machining time and cost, wear resistance for dimensional retention, a fine tool surface for edge sharpness, and easy dressing and edge opening. The product overview also lists lens-processing tools, including comprehensive tooling for eyeglass lenses, and grinding wheels for optical lenses, LCD glass, touch-panel glass and eyeglass lenses. Other listed products include thin-wall core bits for stone and concrete, single-crystal diamond dies, PCD diamond dies, shaped dies, and grinding wheels for carbide end mills, drills and woodworking circular saws. Across its core application list, TDC supplies touch-panel glass drilling, edge-grinding and polishing tools; TFT/LCD glass lapping tools; automotive-component tools; semiconductor, photovoltaic and silicon slicing, grinding, sizing and polishing tools; sapphire tools; aerospace special-alloy tools; contact-lens tools; and lens cutting, centering and edge-grinding wheels. These product groups connect diamond and CBN tool manufacturing with semiconductor wafer preparation, advanced packaging, optoelectronic material processing and other hard or brittle material operations.
Capabilities and products
- Wafer surface grinding wheels
- Precision packaging dicing blades with or without hubs
- CMP pad conditioners
- Grinding wheels for wafer outer diameters, flats and edge trimming
- Small-diameter vitrified CBN grinding wheels
- Rotary dressers
- Double-sided grinding wheels
- Grinding wheels for woodworking circular saws
- Thin-wall drill bits for stone and concrete
- Single-crystal, PCD and shaped diamond wire-drawing dies
- Grinding wheels for LCD glass
- Optical lens grinding wheels
- Touch-panel glass grinding wheels
- Eyeglass lens grinding wheels
- Diamond cutting tools for semiconductor test probes
- Dressing boards for semiconductor machining
- Wafer notch grinding wheels
- Diamond scribing tools
- Grinding wheels for photovoltaic silicon crystals
- Silicon crystal chamfering wheels
- Bonding tools
- Resin-bonded surface grinding wheels
- Rod-grooving grinding wheels
- Metal-bonded thinning wheels
- Electroplated grinding pins for thread machining
- PCD tools for piston machining
- PCD/PCBN milling cutters
- PCD board-cutting tools for PCBs
- PCD edge-trimming tools for PCBs
- PCD beveling tools for PCBs
- PCD/PCBN reaming and milling tools
- Single-crystal cutting tools for spherical/aspherical mold inserts
- Micro-groove machining tools
- Single-crystal tools for internal-bore machining
- Single-crystal tools for contact lens machining
- Diamond cutting tools for eyeglass lenses
- Machining tools for ball valves and ball seats
- Grinding wheels for gear-hob tooth profiles
- Grinding wheels for gear bores
- Vitrified CBN grinding wheels for linear guides and sliders
- Grinding wheels for tungsten carbide end mills and drill bits
- Centerless grinding wheels
- Flute-grinding wheels for micro drills
- Cut-off grinding wheels
- Grinding wheels for tap flutes
- Thinning wheels for optical glass
- Saw blades for bridge-type stone cutting
- Thin-wall drill bits for sapphire and silicon crystals
- Saw blades for sapphire and silicon crystal cutting
- Sapphire core drill bits
- Sapphire back-grinding wheels
- Sapphire grinding and chamfering wheels
- Electroplated diamond wire saws
- Electroplated diamond band saws, including quartz-rod cutting applications
- Multi-blade precision thin cutting wheels
- Stone-cutting saw blades
- Diamond/CBN tools for bearings and ball screws
- Diamond/CBN grinding wheels for automotive components