At a glance
| Booth | S7937 |
| Country | TW |
| Website | www.tglobalcorp.com |
Company profile
T-GLOBAL TECHNOLOGY CO., LTD. provides thermal-management products, services, heat-dissipation materials, and components, working with partners to identify suitable thermal-management solutions for new energy, 5G, electric vehicles, and other emerging technologies. Its product-development experience and sales expertise help serve more than 7,500 direct customers worldwide, excluding distributors, including Arris, Tesla Specialized, HP, Sony, Siemens, Sharp, Panasonic, Alcatel-Lucent, Asus, NEC, Bosch, Gigabyte, Jabil, Magna, Wistron, Sagem, Chimei-Innolux, CPT, Hannstar, Foxconn, Flextronics, AUO, AOC, D-link, TDK-Lambda, Delta, Liteon, HTC, LG, and Cisco. The company has obtained ISO9001, ISO14001, and IECQ certifications, and its products comply with RoHS, REACH, and UL requirements and are safety certified. For servers, including 1U and 2U types, the company works with liquid-cooling and air-cooling technologies and recognizes that different server specifications have different thermal requirements and deployment environments. For automotive applications, its thermal work is positioned for electric and smart vehicles, including self-driving systems, safety-assistance systems, transparent display components, and Vehicle IoT. For network communications, T-GLOBAL TECHNOLOGY CO., LTD. focuses on heat-conduction and heat-dissipation component design with transmission performance, reliability, and cost requirements in view. For energy-storage systems, the company addresses thermal challenges associated with growing energy demand and renewable-energy development. Artificial-intelligence applications include voice recognition, virtual assistants, machine-learning platforms, deep learning, smart home appliances, and smart manufacturing. For aerospace applications including LEOS, launch vehicles, onboard electronics, and defense systems, T-GLOBAL TECHNOLOGY CO., LTD. provides ASTM E595-compliant thermal solutions with high thermal conductivity and low outgassing for high-power-density and mission-critical environments. For UAVs, the company supplies lightweight thermal solutions for battery systems, power electronics, and imaging modules, with the stated goals of supporting flight stability, endurance, and overall reliability. Its 5G services address thermal-management challenges, while its robotics offering combines thermal engineering services with an integrated network of thermal-conduction and heat-dissipation materials. The company offers dedicated consultation, customized production, no minimum order quantity, thermal-simulation analysis services, and a stated fastest delivery time of 14 days. T-GLOBAL TECHNOLOGY CO., LTD. also identifies renewable-energy use, reduced environmental impact, D-U-N-S® Registered™ status, and ESG practices in its corporate information. Its international R&D activity includes a Taiwan-France advanced R&D initiative with SiPearl and participation in the A+ Driving Industrial Innovation with AI Program.
Exhibits
TG-PCM095 Phase Change Materials provides thermal performance with a precise 45°C phase transition and surface wetting, and its flow characteristics are designed to fill microscopic gaps, lower thermal impedance, and improve overall heat transfer. TG-PCM095 is available in multiple thickness options for AI servers, 5G devices, automotive electronics, energy storage systems, and other high-power electronic applications. The same thermal-interface offering includes TG-AD30D Low-Outgassing Thermal Pad and TG-ASD50AB Thermally Conductive Gel. ASTM E595-compliant thermal-pad products are engineered for vacuum and aerospace environments with controlled Total Mass Loss (TML) and Collected Volatile Condensable Materials (CVCM). TG-AD30D, TG-A1780 E595, and TG-A1780 low-outgassing thermal pads have passed ASTM E595 outgassing testing for TML and CVCM for aerospace, satellite, semiconductor, high-vacuum, and high-cleanliness applications. TG-ASD65AB Thermally Conductive Gel combines high thermal conductivity, flowability, and low-stress performance for demanding AI, 5G, and EV applications. TG-A9000F Fiberglass Thermal Silicone Pad has a thermal conductivity of 7.0 W/m·K and is intended for electronic devices, power modules, automotive electronics, industrial-control equipment, and other high-performance thermal applications. TG-ASD50AB Thermally Conductive Gel has 5.0 W/m·K thermal conductivity, is optimized for 5G, EV, servers, and smart devices, and complies with RoHS and REACH requirements. The M.2 Fan SSD Thermal Module integrates a TG-A6200 Ultra-Soft Thermal Pad with a 20x20x6.5mm hydraulic-bearing fan that reaches a maximum speed of 17,000 ± 20% RPM and has startup specifications of 7.0V/0.10A. The TG-PCM095 phase-change-material line is also positioned for power modules, communication equipment, electric vehicles, and high-density computing applications requiring thermal-interface performance and long-term reliability. The company's thermal-management development work includes advanced AlSiC and CuSiC materials, direct liquid cooling, and other next-generation thermal solutions. Its product portfolio additionally covers thermal simulation, thermal modules, vapor chambers, heat pipes, thermal interface materials, AlSiC, heat sinks, thermoelectric cooling chips, flexible absorbing materials, and fans. For UAV applications, lightweight and thin thermal materials are applied to cooling of battery systems, power electronics, and imaging modules.
Capabilities and products
- phase-change thermal interface materials
- ASTM E595 low-outgassing thermal pads
- thermally conductive gel
- fiberglass thermal silicone pads
- thermal simulation analysis services
- direct liquid-cooling technology
- AlSiC/CuSiC thermal-management materials
- vapor chambers
- heat pipes
- heat sinks
- thermoelectric cooling chips
- flexible absorbing materials
- cooling fans
- M.2 SSD fan thermal modules