At a glance
| Booth | N0776 |
| Country | TW |
| Website | www.synpower.com.tw |
Company profile
SynPower Co., Ltd. was founded in April 2002 and specializes in automation, machine vision and raw-material integration for electronics manufacturing, including customized semiconductor-equipment integration. Our semiconductor solutions integrate advanced inspection systems, wet-process equipment and smart-manufacturing technology for semiconductor and optoelectronic production lines. As a listed company with stock code 6658, SynPower emphasizes transparent corporate governance and stable operations. Our approach to intelligent manufacturing brings together system integration, technology research and development, and service capabilities for global electronics-manufacturing customers. Our technical values include quality assurance through automated optical inspection, automation, yield improvement and risk control. We emphasize efficiency through process integration with speed, stability and precision, alongside tailored services designed for different customer production requirements. Our corporate values refer to meeting international certification benchmarks and building trust with partners. SynPower describes its management philosophy in terms of employee well-being, global talent development with localized service, business integrity and mutual success with partners. Our sustainability agenda covers energy conservation, carbon reduction, corporate governance, environmental protection, employee well-being, customer care and social contribution. Our corporate offering also identifies a global network, the TSS Semiconductor Alliance and business lines in PCB/IC automated inspection, optical measurement, process testing, process manufacturing and smart manufacturing. Our capital exceeds US$11.3 million, and our corporate information covers investors, sustainability, stakeholder engagement and information security.
Exhibits
Our automated optical inspection (AOI) equipment addresses wafer-defect detection and yield management after dry processes, combining multi-angle CCD images, lighting and AI-based review. The wafer AOI system inspects wafer fronts, sides and backs, detects 17 types of defects and supports separate 8-inch and 12-inch machine configurations. With SECS/GEM communication, modular parameter recipes and fully automated FAB operation, AOI results can be integrated into production management while reducing variation caused by manual inspection. Our semiconductor carrier inspection solution combines optical dimensional measurement, appearance inspection and AI defect classification for carrier-quality monitoring. The carrier system supports OHT automatic loading and unloading and FOUP 360-degree rotational inspection, allowing inspection from multiple directions. Inspection records combine dimensional findings, detected defects and quality history to support the ongoing condition and health management of semiconductor carriers. Our Keyence automated inspection solution combines a high-end tool microscope, three measurement functions and automated handling to reduce manual measuring time and make batch full inspection more practical. The automatic Keyence platform shares a frame-handling setup for 8-inch and 12-inch wafers and provides automated positioning, alignment guidance and CST or M-Ring ID recognition. SECS/GEM reporting and visualized measurement data support traceable, consistent automated microscopy inspection of wafer and advanced microstructure products. The Keyence semi-automatic system is intended for packaged ICs, strips, substrates, dies, silicon or glass wafers and panels measuring up to 310 by 310 mm. The semi-automatic measurement stage integrates an R-axis rotary platform, precision granite base, TZ rotary axis and motorized Z-axis stage for angle correction, focusing, magnification switching and imaging. The high-resolution semi-automatic imaging setup can be integrated with an AOI detection system to improve inspection throughput and the consistency of image interpretation. Our wafer automatic labelling machine combines Wafer ID recognition, OCR/BCR cross-checking and automatic label application to match physical labels with recorded wafer identities. The labelling equipment supports both 8-inch and 12-inch wafers, D/F and CST incoming carriers, RFID operation and a SEMI-F47 voltage-stabilization design. High-resolution wafer identification and automated label placement support semiconductor-process traceability and reduce mismatches between wafer IDs and labels. Our wafer incoming sorting system shares an 8-inch/12-inch platform and combines edge finding, wafer ID recognition, visual inspection and carrier conversion for receiving and sorting wafers. Wafer sorting integrates OCR/BCR mutual verification, SECS/GEM communication, RFID and a SEMI-F47 voltage-stabilization system for automated semiconductor-factory operation. The incoming handling process verifies consistency between wafer identities and associated labels while supporting pre-process inspection and quality control. Our fully automated batch wet-cleaning and etching equipment handles wafers and panels and supports wafer sizes from 2 to 12 inches. Batch wet-process options include photoresist stripping, RCA cleaning, metal, silicon and via etching, electroless plating and metal cleaning. Modular batch-system design supports accurate chemical-mixture ratios, automated loading and unloading and customized process configurations, including integrated design, development and equipment manufacturing. Our fully automated single-wafer wet-processing platform integrates automatic transfer, cleaning, etching and drying for wafers from 2 to 12 inches and panels up to 310 by 310 mm. The single-wafer system uses modular processing chambers, DIW cleaning and drying, low-cross-contamination construction and process monitoring to reduce residual-liquid risks. The wet-processing chamber configuration can be customized for panel-level processes and applications that require specific cleaning, etching and drying sequences. Our chemical supply system combines concentrated-chemical blending, mixing, dispensing and filtration to provide a high-cleanliness liquid supply for wet manufacturing processes. Automated control, precise monitoring, safety-oriented equipment design and flexible flow configurations allow the chemical supply system to be adapted to different production-line requirements. Our two-fluid steam-cleaning equipment removes post-etch polymers and foreign-matter residue from wafers by directing high-pressure steam into pure water to generate fine cleaning droplets. The steam-and-water cleaning design removes contaminants without damaging the product surface and operates without chemical cleaning agents while reducing water consumption. The system additionally emphasizes a high gold-recovery rate and an easily recyclable structure, with the stated aims of lowering cleaning costs and pollution discharge while improving process safety.
Capabilities and products
- customized integrated semiconductor inspection equipment
- AI optical inspection of wafer front, side, and back surfaces
- optical metrology and AI defect judgment for semiconductor carriers
- FOUP 360° rotational inspection with OHT automatic loading and unloading
- automated high-end microscopic metrology
- semi-automatic image inspection for IC, Strip, substrate, Die, Wafer, and 310×310 Panel
- wafer OCR/BCR ID recognition and automatic labeling
- 8/12-inch incoming wafer sorting, edge finding, and carrier conversion
- 2–12-inch wafer fully automatic batch cleaning/etching
- PR Strip, RCA, Metal/Si/Via Etch, and Electroless Plating wet processes
- single-wafer cleaning, etching, and drying for 2–12-inch wafers and 310×310mm panels
- chemical supply system for blending, mixing, dispensing, and filtration
- two-fluid steam cleaning for post-etch wafer polymers and foreign residues