At a glance
| Booth | K2984 |
| Country | TW |
| Website | www.synergie-cad.com |
Company profile
Synergie Cad GROUP has more than 30 years of electronic-board design and manufacturing experience and applies that experience to PCB and engineering challenges for demanding semiconductor test interfaces. For more than 30 years, the group has offered global turn-key expertise, combining manufacturing and service capabilities with strategic partnerships intended to address customer needs in semiconductor test. Its semiconductor industrialization and production experience supports packaging and testing services from its European hub in Toulouse for small- and mid-size series, while Tier1 OSAT partnerships complement that capacity for high volumes. The service model is open-ended: customers can select a single service or combine services at the level they need, including design, simulation, sockets, manufacturing and full turn-key support. Synergie Cad GROUP also supports new product introductions, production-yield improvements, offshore transfer and legacy testing through offices and service centers in Europe, the USA and Asia. Its design organization includes more than 70 design stations using CADSTAR, MENTOR, CADENCE and PADS, with project and design engineers located in France, Germany, Morocco, the Philippines, Singapore, South Korea, the UK and the USA. That distributed engineering organization is presented as supporting on-site design services and around-the-clock work on time-critical projects, from schematic capture through final layout and with close customer coordination on project objectives.
Exhibits
Synergie Cad developed and commercialized a full line of Burn-In systems and pairs the modular systems with user-friendly, highly programmable Burn-In drivers. The modular Burn-In systems integrate many functions traditionally associated with the most expensive ATE equipment while being described as delivering those functions at a fraction of that equipment cost. Its design engineering covers RF microwave, electronics, chemistry, mechanical engineering and PCB layout, including uBGA, RF, high-speed digital, analog and mixed-signal design, as well as complex board builds with blind, buried and micro vias, multiple laminations and combined materials. Its PCB designers are described as balancing the requirements of the Test Platform, Test Engineers, Manufacturers and Assemblers when selecting a design solution. The PCB design scope includes differential and single-ended impedance control, stripline, surface microstrip and embedded microstrip, while the mechanical scope includes sockets, shielding, systems, custom stiffeners and cables. For simulation, the group uses ANSYS HFSS for 3-D full-wave electromagnetic-field work on high-frequency and high-speed circuits, test sockets, PCB interconnects and RF or microwave components, including evaluation of transmission loss, impedance-mismatch reflection, parasitic coupling and radiation. ANSYS SIWave is used to analyze complete designs with power and ground layers, vias, signal traces and circuit elements, and the group states that it performs complete signal-integrity and power-integrity analysis from DC to beyond 10 GHz. Engineering and test services include test-software development in addition to test-hardware design and manufacturing, with test-program solutions for leading Automated Test Equipment and support for Final Assembly and Wafer Probe program development. Using internal test platforms and third-party ATE, Synergie Cad GROUP supports characterization, qualification read-point testing, platform conversion and pattern conversion, with design, test and manufacturing teams working together on design validation and test-production improvements. Its in-house PCB manufacturing capability reaches up to 60 layers, thickness up to 7.0mm and wide-area boards up to 750mm x 580mm, with planarity through CIC Technology and Dry Film exposure in a Clean Room rated 1,000. Additional listed PCB capabilities include Laser Direct Imaging, laser drilling, Micro BGA boards down to 250µm pitch, blind and buried vias, 75µm hole diameter, impedance control and advanced fine-pitch PCB interposers. Verti-B uses circular Micro Spring technology with direct-attach PCB, is fully customizable and adaptable to Hand-Lid sockets, and is offered for multi-site, RF, Kelvin and high- or low-temperature testing as well as advanced WLCSP probing. Verti-P uses a Micro Spring Pin with a conical TIP as the contact element; the design provides mechanical compliance for probing, is intended to minimize PAD damage and can test more than 256 dies simultaneously. Verti-P is also presented as reducing test time and test cost for chipmakers worldwide as probe performance becomes increasingly important to overall cost. VERTI-M® is built around a pin design with three different diameters, combining high-temperature mechanical stability and accurate positioning with options for high-current testing, high-frequency testing and customized Gram force. Cantilever probe-card products include Standard Cantilever, Multi-Die Cantilever, Imager Cantilever, Memory Cantilever, Windowless Cantilever and Direct docking Cantilever, with manufacturing focused on probe placement, alignment and planarity. The group also develops customizable parametric probing and states that its long-running improvements in this technology extend into low-leakage applications. Its Toulouse packaging line handles fast-run prototypes and small series in plastic-moulded QFN, SOIC, QFP and DIP packages, air-cavity or premoulded-plastic variants, ceramics, metal TO packages and organic BGA and LGA packages. Larger packaging series are handled through an OSAT partnership, expanding the portfolio to standard and custom packaging solutions that include wafer bumping. For test development and production, in-house Advantest, Teradyne and Xcerra platforms are complemented by 6-, 8- and 12-inch probers or a Multitest handler, supporting complete hardware and software test solutions, test hardening, platform transfers and production testing in Toulouse and through Asian OSAT partners. Test competencies cover DIGITAL, MIXED-SIGNAL and ANALOG, RF and MMW up to 100GHz, together with experience in CMOS sensor and imager production testing. Named test equipment includes Advantest C-Class V93K-PS1600, Teradyne J750, Xcerra Diamond-X and Xcerra Sapphire testers; Semics Opus3 6-, 8- and 12-inch probers; UF300 and EG4090 8-inch dual-temperature probers; and a Multitest MT9510 handler. Thermal equipment includes Temptronic 4010A rated from -65°C to 200°C and Temptronic 4310A rated from -70°C to 200°C, while a listed tri-temperature prober range runs from -55°C to +200°C. The Toulouse Reliability Laboratory supports HTOL and LTOL, I.R. Reflow and MSL preconditioning, Thermal Cycling, Humidity Storage including THNB and THB, and Humidity Stress including HAST and uHAST, with reliability-board development and fabrication in Carros, France. Reliability services also include access to ESD testing in HBM, MM and CDM modes and Latch-Up capability, with external partners used for additional techniques such as irradiation stress and mechanical tests including vibration and acceleration. The turn-key supply-chain service covers semiconductor industrialization, qualification and production, with prototypes and small or medium series handled at the Toulouse hub and larger volumes through a Tier1 OSAT partner. Customers can select services à la carte, while full turn-key supply-chain coverage extends from wafer start to finished-goods delivery and can include test-solution development and transfer, reliability testing, prototype or production-series packaging, production testing and sustaining. UDX is presented for product, application and reliability engineers with configurable software and hardware, covering design validation, characterization, engineering, quality and reliability, and Burn-In for medium-power logic, memory, FPGA, ASIC and mixed-signal devices. UDX also lists extensive data logging, embedded-logic testing, Analog Waveform Aquisition and synchronized analog or digital monitoring, together with modular scalable hardware, a plug-in-based open software environment and remote system management.
Capabilities and products
- PCB design and manufacturing
- Burn-In systems with programmable drivers
- RF/high-speed digital/analog/mixed-signal PCB design
- SI/PI analysis from DC to beyond 10 GHz
- ATE test-program development
- Final Assembly/Wafer Probe test-program development
- PCB manufacturing up to 60 layers
- Verti-B Micro Spring WLCSP probing
- Verti-P parallel testing of more than 256 dies
- VERTI-M® high-current and high-frequency probing
- Cantilever probe-card design and manufacturing
- QFN/SOIC/QFP/DIP plastic packaging
- BGA/LGA organic packaging
- DIGITAL/ANALOG/RF/MMW testing up to 100GHz
- HTOL/LTOL reliability testing
- Thermal Cycling reliability testing
- HAST/uHAST humidity-stress testing
- turn-key supply chain from wafer start to finished-goods delivery