At a glance
| Booth | N0162 |
| Country | TW |
| Product categories | Cleaning; Washing Equipment for Assembly & Packaging · Dispensing Systems · Hot Embossing System · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Wafer Level Bonders · Laser Treatment; Cutting Systems for Panels & Photocells · Cutting; Drilling; Laser ablation; Beveling Equipment · Overlay Measurement · Double sided mask aligner · Equipment, Nanotechnology Tools · Bumping Systems · Coat; Develop; Resist Processing; Track Equipment · Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint · SOI Bonders; Temporary Bonders; De-Bonders · Spin on Glass (SOG); on Dielectric (SOD) Track systems |
| Website | www.suss.com |
Company profile
The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. The production of memory chips, cameras for mobile s or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.
Capabilities and products
- backend lithography equipment and process solutions
- dispensing systems
- lithography systems for wafer level packaging, bumping and 3D interconnect aligners
- micro-optical components
- photomask processing equipment and process solutions
- wafer bonding equipment and process solutions
- wafer level bonders
- wafer processing for Advanced Packaging
- wafer processing for LED
- wafer processing for MEMS