At a glance
| Booth | N0162 |
| Country | TW |
| Website | www.suss.com |
Company profile
SUSS MicroTec (Taiwan) Co., Ltd. is listed as SUSS's Taiwan location, while SUSS supplies equipment and process solutions for microstructuring applications, including backend lithography, wafer bonding, photomask processing, and micro-optical components. SUSS serves the semiconductor industry and related Advanced Packaging, MEMS, and LED markets, with equipment used in manufacturing processes for memory chips, cameras for mobile devices, and tire-pressure sensors, and with solutions for both high-volume production and research and development. Its portfolio spans photomask processing, high-precision imaging, coating, and bonding systems designed for efficient, stable, and cost-effective processes with high yield and consistent throughput, and the company also states commitments to ESG principles, system energy efficiency, an inclusive company culture, and trusted supply chains. The business began in Munich in 1949 with sales representation for microscopes, cameras, and laboratory equipment and soon added optical-device service and maintenance; in 1962 it built a thermo-compression bonding machine for Siemens, in 1963 it developed the prototype MJB3 mask aligner, in 1974 it developed a mask aligner for micrometer-precise double-sided exposure, and in 1975 it launched the MJB55 for volume production. During its international expansion, SUSS opened its first overseas site in Waterbury, Vermont, established a Thailand subsidiary in 1983 and sales offices in Japan, China, and Taiwan, released its first substrate bonder in 1989, added device bonders in 1993, and went public in 1999 as SÜSS MicroTec AG. SÜSS MicroTec acquired Fairchild Technologies in 2000, established SUSS MicroOptics in 2001, sold its device-bonder line in 2007 and prober line in 2009, expanded its Asian presence with offices in Singapore and Korea, acquired Hamatech APE in Sternenfels in 2010 and made that site a wet-processing competence center, and acquired Tamarack Scientific in 2012 to add advanced laser processing for microstructuring. In 2020, SÜSS MicroTec added a production facility to its Taiwan sales and service branch and acquired PiXDRO to add inkjet-printing technology; temporary-bonding demand rose in 2023, and in 2024 SUSS MicroOptics was sold before the company adopted the name SUSS MicroTec SE and the brand SUSS. SUSS states that it operates sales and service locations in all regions, with its headquarters in Garching and company locations including Sternenfels, Eindhoven, Corona, Williston, Shanghai, Yokohama, Hwaseong, Singapore, Zhubei, and Thanjavur; Customer Care Centers, local support teams, and regional application laboratories provide response, technical assistance, advice, communication with production sites, and process-technology support. In 2026, SUSS announced a strategic collaboration with Manz Asia in semiconductor inkjet technology, a record order book of €473.7 million with visibility for 2027, an investment in an Advanced Packaging Innovation Center, and the inclusion of SUSS MicroTec SE shares in the MDAX for the first time.
Exhibits
The ACS300 Gen2 is a modular cluster system for clean, reliable, high-throughput photolithography processing of 200 and 300 mm wafers, and it can process the two wafer sizes in parallel or sequentially without mechanical changeover. ACS300 Gen2 can be configured for HMDS vapor priming, spin coating, spray coating, aqueous or solvent-based developing, baking, and cooling, and it processes thin and thick resists and photosensitive polymers including polyimide, PBO, and Cyclotene (BCB). ACS300 Gen3 is designed for demanding high-volume production with adaptable coating, developing, and baking functions and process control, and SUSS states that a system with eight spinner modules has the smallest footprint on the market. ACS200 Gen3 supports up to 4 wet-process modules and a maximum of 19 plates for HVM, covering Advanced Packaging, MEMS, and LED requirements and bridging R&D and HVM, while ACS200 Gen3 TE extends the platform to up to 6 spinner and spray modules plus an integrated inkjet module. SUSS supports advanced wet cleaning for photomask applications using controlled chemical treatment, rinsing, and drying to achieve cleanliness while preserving mask-surface integrity; process consistency, repeatability, and automated process control reduce variability, while the MaskTrack Pro Series adds automated material handling and process sequencing to reduce operator intervention and contamination risk, improve productivity and throughput, and support efficient, traceable production. SUSS Projection Scanners combine full-field UV exposure with single continuous scanning for non-contact, high-throughput, high-resolution lithography without stitching or over-exposure defects, and DSC300 Gen3 is a high-throughput projection-lithography scanner for 200 mm and 300 mm wafers in advanced packaging. Their edge-to-edge single-pass exposure and single-scan operation provide uniform resolution and repeatable results, reduce complexity and operating costs compared with steppers, and support MEMS, semiconductor, and advanced-packaging applications; integrated metrology uses UMS architecture for prealignment precision, supports >130 WPH while maintaining alignment, and the stated MTBF is >10,000 hours. SUSS Mask Aligners provide mask-to-wafer and wafer-to-wafer alignment with precision optics and automation for substrates up to 300 mm, and the range includes MA300 Gen3 for automated 300 mm and 200 mm HVM, MA200 Gen3 for automated wafers up to 200 mm, MA12 Gen3 for semi-automated wafers up to 300 mm in advanced packaging, MEMS, and imprint lithography, MJB4 for laboratories and small-volume substrates and pieces up to 100 mm, NIL-SFT8 Series and NIL-SFT12 Series stamp-fabrication tools, and the semi-automated MA/BA Gen4 and MA/BA Gen4 Pro mask and bond aligners. Mask Alignment systems provide micron-level overlay accuracy across diverse substrates, optimized optics and automation for higher throughput and shorter cycle times, modular configurations and optional functions for changing materials and production volumes, and integrated metrology with image processing and adaptable illumination for wafer prealignment and notch detection, including centering with edge defects or damaged notches and brightfield and darkfield notch detection. SUSS permanent wafer-bonding systems support advanced packaging from R&D through high-volume production, with stable process conditions, precise alignment, reproducible bond quality, and applications in advanced packaging, MEMS, 3D integration, and engineered substrates. The permanent-bonding range includes XBC300 Gen2 D2W/W2W integrating W2W, collective D2W, and sequential D2W bonding; XBC300 Gen2 SP for automated surface preparation and W2W plus sequential and collective D2W hybrid bonding on 200 mm and 300 mm substrates; XBS300 W2W for automated hybrid fusion bonding of aligned 200 mm and 300 mm wafers; and XBC300 Gen2 D2W for fully automated sequential die-to-wafer hybrid bonding on 200 mm and 300 mm substrates. The range also includes XBS200 for automated aligned wafer bonding up to 200 mm in high-volume production, SB8 Gen2 as a universal semi-automated wafer-bonding system up to 200 mm, and XB8 as a universal semi-automated high-force wafer bonder for substrates up to 200 mm. Permanent-bonding capabilities include submicron overlay precision, void-free results, modular support for varied wafers, stack-ups, and advanced-packaging materials, integrated metrology for sub-micron layer alignment and long-term stability, topology capture, overlay verification and process-shift monitoring, topology scans and smart fiducial placement, and in-line monitoring for stable, repeatable bonding and higher yield. SUSS Temporary Bonding protects sensitive wafers through complex multi-step processes and enables residue-free debonding, with XBC300 Gen2 for room-temperature debonding and cleaning in 2.5D and 3D integration, XBS300 for automated temporary bonding of aligned 200 mm and 300 mm wafers, and DB12T for semi-automated mechanical peel-off debonding at room temperature for thin-wafer applications. Temporary-bonding capabilities include multiple carrier options for thin or ultrasensitive wafers, secure adhesion and residue-free debonding for contamination-sensitive wafers, support for thinning, lithography, and packaging in complex integration flows, smart metrology that detects wafer warpage and verifies alignment before debonding, and post-bond alignment verification before further processing.
Capabilities and products
- 200/300mm wafer photolithography coat/develop cluster systems
- HMDS priming, spin/spray coating, developing and baking
- photomask wet cleaning processing
- 200/300mm projection lithography scanning
- Mask Aligner for substrates up to 300mm
- working-stamp fabrication for micro/nanoimprint lithography
- permanent wafer bonding systems
- 200/300mm W2W/D2W hybrid bonding
- automated hybrid fusion bonding for 200/300mm wafers
- temporary wafer bonding and residue-free debonding
- automated temporary bonding of 200/300mm wafers
- room-temperature mechanical peel-off debonding for thin wafers